Abstract: The disclosure provides a millimeter-wave antenna chip including a package substrate, at least one subunit, and a radio frequency chip. Each subunit includes an end-fire antenna disposed on an upper surface of the package substrate. The end-fire antenna is electrically connected to the radio frequency chip through a feed line. The radio frequency chip is located on a lower surface of the package substrate.

Abstract: A millimeter-wave antenna-in-package includes a substrate, and a radiation structure and a first antenna feeder that are disposed in the substrate. The first antenna feeder includes an antenna matching stub, a feeder transmission strap, and a first harmonic suppression unit. A first end of the antenna matching stub is connected to the radiation structure. The first harmonic suppression unit includes a first transmission part and a first bent part. A first end of the first bent part is connected to a first end of the first transmission part, and a second end of the first bent part and a second end of the first transmission part form a first opening. A second end of the antenna matching stub is connected to the feeder transmission strap through the first transmission part, and the feeder transmission strap extends along the first reference direction.

Abstract: Embodiments of this application disclose an integrated circuit and a terminal device, to resolve a problem that an existing dual-band antenna has a relatively small low-frequency band range and is difficult to meet use requirements. An antenna includes a bearer structure, a first radiation patch, a second radiation patch, and a radio frequency processing chip. The first radiation patch, the second radiation patch, and the radio frequency processing chip are separately placed on different layers of the bearer structure. A first feed line and a second feed line are disposed in the bearer structure. The radio frequency processing chip feeds the first radiation patch by using the first feed line. The radio frequency processing chip feeds the second radiation patch by using the second feed line.

Abstract: The invention provides a chip including a package substrate, at least one subunit, and a radio frequency chip. Each subunit includes an end-fire antenna disposed on an upper surface of the package substrate. The end-fire antenna is electrically connected to the radio frequency chip through a feed line. The radio frequency chip is located on a lower surface of the package substrate. According to the millimeter-wave antenna chip provided in this application, the end-fire antenna may be lifted to the upper surface of the package substrate of the chip by using stacked metal via holes of the package substrate, and a height of the end-fire antenna relative to a peripheral component may be increased by using a thickness of the package substrate.

Abstract: A package antenna apparatus including a package substrate, wherein an antenna array is disposed on the package substrate, and a transceiver chip coupled to the antenna array, where the transceiver chip is fastened to the package substrate, and the transceiver chip has a first pad and a second pad, and a filter disposed on the package substrate, where the filter comprises an input port and an output port, the input port is coupled to the first pad of the transceiver chip, the output port is coupled to the second pad of the transceiver chip, and the filter is configured to filter a signal of the transceiver chip that is input through the input port, and is further configured to output a filtered signal to the transceiver chip through the output port.

Abstract: The present invention relates to a method and system for automatic address allocation in serially connected controlled devices (e.g. luminaires) to achieve a changed control configuration. A signal adapter is modified to send an address sorting command, so that each of the controlled devices will automatically allocate an address to itself in sequence one by one upon receiving the address sorting command from the signal adapter.

Abstract: Embodiments of this application disclose an integrated circuit and a terminal device, to resolve a problem that an existing dual-band antenna has a relatively small low-frequency band range and is difficult to meet use requirements. An antenna includes a bearer structure, a first radiation patch, a second radiation patch, and a radio frequency processing chip. The first radiation patch, the second radiation patch, and the radio frequency processing chip are separately placed on different layers of the bearer structure. A first feed line and a second feed line are disposed in the bearer structure. The radio frequency processing chip feeds the first radiation patch by using the first feed line. The radio frequency processing chip feeds the second radiation patch by using the second feed line.

Abstract: The present invention relates to a method and system for automatic address allocation in serially connected controlled devices (e.g. luminaires) to achieve a changed control configuration. A signal adapter is modified to send an address sorting command, so that each of the controlled devices will automatically allocate an address to itself in sequence one by one upon receiving the address sorting command from the signal adapter.

Abstract: A defect inspection system is provided for inspection of defects in the surface of a sample. An array of light sources is used, with different light sources providing light to the sample from different directions. A main direction of illumination is defined with highest intensity, and this direction evolves over time. By providing varying directional illumination instead of blanket illumination, it becomes easier to detect defects.

Abstract: A defect inspection system is provided for inspection of defects in the surface of a sample. An array of light sources is used, with different light sources providing light to the sample from different directions. A main direction of illumination is defined with highest intensity, and this direction evolves over time. By providing varying directional illumination instead of blanket illumination, it becomes easier to detect defects.