Patents by Inventor Weizheng CAI

Weizheng CAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMALLY CONDUCTIVE STRUCTURE AND HEAT DISSIPATION DEVICE
    Publication number: 20180187987
    Abstract: A thermally conductive structure and a heat dissipation device are provided. The thermally conductive structure comprises a first thermally conductive layer and a second thermally conductive layer. The first thermally conductive layer comprises a graphene material and first carbon nanotubes, and the first carbon nanotubes are dispersed in the graphene material. The second thermally conductive layer is stacked on the first thermally conductive layer, and comprises a porous material and second carbon nanotubes, and the second carbon nanotubes are dispersed in the porous material. The heat dissipation device comprises the thermally conductive structure and a heat dissipation structure. The thermally conductive structure is in contact with a heat source, and the heat dissipation structure is connected to the thermally conductive structure.
    Type: Application
    Filed: February 27, 2018
    Publication date: July 5, 2018
    Applicant: Jiangsu Cnano Technology Co., Ltd.
    Inventors: Weizheng CAI, Zhiwei YANG, Tao ZHENG, Ou MAO, Meijie ZHANG