Abstract: A system may mitigate leakage currents in non-isolated charging stations for electric vehicles. The system may include a bank of one or more parallel capacitors per phase electrically coupled to an AC voltage source, wherein a neutral point of the one or more parallel capacitors is electrically coupled to a DC ground; a bank of one or more inductors per phase electrically coupled to the one or more parallel capacitors, wherein each inductor is in series with and downstream from one capacitor; a rectifier electrically coupled to and downstream from the one or more parallel inductors, wherein the rectifier converts the AC voltage source to a DC voltage for supply to a battery; a DC bus electrically coupled to the rectifier; and a controller, wherein the controller is configured to mitigate leakage currents by controlling a voltage of at least one of the bank of one or more parallel capacitors.

Abstract: The present disclosure relates to the field of microwave ablation treatment devices, and in particular, to a microwave ablation needle head and a microwave ablation needle. A microwave ablation needle head, comprising an outer tube, a cooling tube, a coaxial cable, and an electrode. The outer tube comprises a first branch tube and a second branch tube which are sequentially provided in a direction from the distal end to the proximal end of the outer tube, and the end of the first branch tube away from the second branch tube forms the distal end of the outer tube, and the material of the first branch tube is a ceramic material or a polymer material.

Abstract: The present application provides a combined machine head and a ray imaging device, wherein the combined machine head comprises: a housing, having an enclosed cavity; a ray tube, arranged in the enclosed cavity; and a pump and a pipe, arranged in the enclosed cavity; wherein the pump is arranged on one side away from an anode of the ray tube, the pipe has a first end connected with an outlet of the pump and a second end extending to be near the anode of the ray tube; or the pump is arranged near the anode of the ray tube, the pipe has a first end connected to an inlet of the pump and a second end extending to one side away from the anode of the ray tube.

Abstract: A system may mitigate leakage currents in non-isolated charging stations for electric vehicles. The system may include a bank of one or more parallel capacitors per phase electrically coupled to an AC voltage source, wherein a neutral point of the one or more parallel capacitors is electrically coupled to a DC ground; a bank of one or more inductors per phase electrically coupled to the one or more parallel capacitors, wherein each inductor is in series with and downstream from one capacitor; a rectifier electrically coupled to and downstream from the one or more parallel inductors, wherein the rectifier converts the AC voltage source to a DC voltage for supply to a battery; a DC bus electrically coupled to the rectifier; and a controller, wherein the controller is configured to mitigate leakage currents by controlling a voltage of at least one of the bank of one or more parallel capacitors.

Abstract: The present application provides a combined machine head and a ray imaging device, wherein the combined machine head comprises: a housing, having an enclosed cavity; a ray tube, arranged in the enclosed cavity; and a pump and a pipe, arranged in the enclosed cavity; wherein the pump is arranged on one side away from an anode of the ray tube, the pipe has one end connected with an outlet of the pump and another end extending to be near the anode of the ray tube; or the pump is arranged near the anode of the ray tube, the pipe has one end connected to an inlet of the pump and another end extending to one side away from the anode of the ray tube.

Abstract: A pressure reducing system for fuel gas and a natural gas dewaxing vehicle are provided. The pressure reducing system includes fuel gas pipelines which consist of successively connected a high pressure pipeline, a medium pressure pipeline and a low pressure pipeline in the flow direction of fuel gas. The tail end of the low pressure pipeline connects with a combustion apparatus. A high pressure relief valve, a high pressure air feed valve, a heat exchanger and a primary pressure reducing valve subassembly are connected on the high pressure pipeline. The heat exchanger is provided with a hot fluid inlet and a hot fluid outlet, where the hot fluid inlet connects with a hot water apparatus, and the hot fluid outlet connects with a water storage apparatus. The medium pressure pipeline is equipped with a medium pressure relief valve and a secondary pressure reducing valve.

Abstract: A pressure reducing system for fuel gas and a natural gas dewaxing vehicle are disclosed. The pressure reducing system (6) comprises fuel gas pipelines which consist of successively connected a high pressure pipeline (41), a medium pressure pipeline (42) and a low pressure pipeline (43) in the flow direction of fuel gas. The tail end of the low pressure pipeline (43) connects with an combustion apparatus (7). A high pressure relief valve (17), a high pressure air feed valve (21), a heat exchanger (24) and a primary pressure reducing valve subassembly are connected on the high pressure pipeline (41). The heat exchanger (24) is provided with a hot fluid inlet (24A) and a hot fluid outlet (24B), wherein the hot fluid inlet (24A) connects with an hot water apparatus (12), and the hot fluid outlet (24B) connects with an water storage apparatus. The medium pressure pipeline (42) is equipped with a medium pressure relief valve (27) and a secondary pressure reducing valve (29).

Abstract: A mobile communication system, a radio switching method, a mobile base station and a mobile terminal in which the mobile terminal does not perform handover to a fixed base station while moving in/on a moving body to avert an adverse affect of variation of received field intensity on communication. Fixed base stations that are connected to a public telephone network are disposed along a traveling direction of a train. The train which a user who possesses a mobile terminal gets on is provided with a mobile base station capable of being connected to the fixed base stations. The mobile base station detects the mobile terminal entering into the communication area covered by the mobile base station and the train starting moving to the next station. Triggered by the two kinds of detection, the mobile base station takes over processes of handover to the fixed base station from the mobile terminal. While moving, the mobile base station performs handover to a next base station one after another.

Abstract: Disclosed is a headset which includes a radio communication unit and control unit. The radio communication unit has 2 communication mode. The first mode is used for communication with an access point connected to a fixed network. The second mode is used for communication with a specific portable communication terminal. The communication control unit judges whether the headset can communicate with the access point. The communication control unit selects either one of said first and said second mode based on the judgment result. When the first mode is selected, the communication control unit connects the headset to the fixed network with the telephone number of the specific portable communication terminal as a telephone number of the call originating party.

Abstract: Disclosed is a headset which includes a radio communication unit and control unit. The radio communication unit has 2 communication mode. The first mode is used for communication with an access point connected to a fixed network. The second mode is used for communication with a specific portable communication terminal. The communication control unit judges whether the headset can communicate with the access point. The communication control unit selects either one of said first and said second mode based on the judgment result. When the first mode is selected, the communication control unit connects the headset to the fixed network with the telephone number of the specific portable communication terminal as a telephone number of the call originating party.

Abstract: A method of migration of a seismic data is disclosed. The data include a data point having an input source location, an input receiver location, and a scatter point associated therewith. The method includes determining a projected source location, and determining a projected receiver location. The seismic data point is mapped from an input travel time to a projected travel time. A pseudo-offset is determined based on the projected travel time and the data point is mapped to the pseudo-offset.

Abstract: In one example embodiment of the present invention, a method of migrating an input seismic data point having an input source location and an input receiver location, and an image location associated therewith is provided. The method comprises determining a pseudo-offset and mapping the seismic data point to the image location based at least in part on the pseudo-offset.

Abstract: A mobile communication system, a radio switching method, a mobile base station and a mobile terminal in which the mobile terminal does not perform handover to a fixed base station while moving in/on a moving body to avert an adverse affect of variation of received field intensity on communication. Fixed base stations that are connected to a public telephone network are disposed along a traveling direction of a train. The train which a user who possesses a mobile terminal gets on is provided with a mobile base station capable of being connected to the fixed base stations. The mobile base station detects the mobile terminal entering into the communication area covered by the mobile base station and the train starting moving to the next station. Triggered by the two kinds of detection, the mobile base station takes over processes of handover to the fixed base station from the mobile terminal. While moving, the mobile base station performs handover to a next base station one after another.

Abstract: Critical dimension variation of photolithographically formed features on a semiconductor substrate is reduced by measuring the reflectivity of a photoresist layer and an underlying layer, such as a polysilicon layer, and adjusting the exposure level of the photoresist in accordance with the measured reflectivity. This allows precise control of feature width on the photoresist, which in turn allows precision etching of the underlying layer to accurately form a feature, such as a gate electrode.

Abstract: The present invention compactly fabricates integrated circuits of an electronic system on a semiconductor wafer by fabricating the integrated circuits of the electronic system on both sides of a semiconductor wafer. A first face of an area of the semiconductor wafer is processed with an integrated circuit fabrication process step to fabricate part of a first integrated circuit thereon. In addition, a second face of the area of the semiconductor wafer is processed with the integrated circuit fabrication process step to fabricate part of a second integrated circuit thereon. The first face and the second face are processed for a plurality of integrated circuit fabrication process steps until the first integrated circuit is completely fabricated on the first face and the second integrated circuit is completely fabricated on the second face.

Abstract: A semiconductor device having shallow trench isolation (STI) is formed without dishing of the insulating material filling the trench, and without forming a planarization mask. Embodiments include forming a pad oxide layer and a polish stop layer, such as silicon nitride, on a semiconductor substrate, forming a trench in the substrate, and filling the trench with a first insulating layer, such as silicon dioxide. A second polish stop layer is then deposited on the first insulating layer, followed by a second, sacrificial insulating layer, such as silicon dioxide, to cover the second polish stop layer. The second insulating layer is then polished, as by CMP, to expose the second polish stop layer above the first polish stop layer, and the exposed portion of the second polish stop layer is then removed, as by wet etching, to expose the first insulating layer.

Abstract: Channel doping and gate lithography are simulatneously performed by focusing an ion beam into the wafer through a positive or negative photoresist that is sensitive to the ion beam. Additional fabrication is then performed to provide a gate that is self-aligned with the doped channel.

Abstract: To attenuate a CMP polishing rate differential which tends to occur over the surface of a semiconductor substrate surface which has had one or more layers formed thereon, surface characteristics of the upper surface which are representative of the thickness, for example, of a layer which is being removed either in part or in its entirety, are monitored and surface profile information is developed using a suitable algorithm and used to control the timing with which force is applied by one or more of a plurality of actuators disposed on the other side of the wafer, in a manner wherein areas which have undergone more removal than others, are forced into contact with the polishing pad with a force which is reduced as compared that which is applied to localized high areas wherein a lesser amount of the layer has been removed.

Abstract: The present invention compactly fabricates integrated circuits of an electronic system on a semiconductor wafer by fabricating the integrated circuits of the electronic system on both sides of a semiconductor wafer. A first face of an area of the semiconductor wafer is processed with an integrated circuit fabrication process step to fabricate part of a first integrated circuit thereon. In addition, a second face of the area of the semiconductor wafer is processed with the integrated circuit fabrication process step to fabricate part of a second integrated circuit thereon. The first face and the second face are processed for a plurality of integrated circuit fabrication process steps until the first integrated circuit is completely fabricated on the first face and the second integrated circuit is completely fabricated on the second face.