Patents by Inventor Wen B. Huang

Wen B. Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR
    Publication number: 20240088068
    Abstract: A method of forming a semiconductor device is provided. The method includes encapsulating with an encapsulant at least a portion of a semiconductor die and a package substrate, the encapsulant including an additive selectively activated by way of a laser. A first opening is formed in the encapsulant, the first opening exposing a predetermined first portion of the package substrate. The additive is activated at the sidewalls of the first opening. A second opening is formed in the encapsulant, the second opening encircling the first opening and exposing a predetermined second portion of the package substrate. The additive is activated at the sidewalls the second opening. A conductive material is plated on the additive activated portions of the encapsulant.
    Type: Application
    Filed: September 8, 2022
    Publication date: March 14, 2024
    Inventors: Michael B. Vincent, Scott M. Hayes, Zhiwei Gong, Leo van Gemert, Antonius Hendrikus Jozef Kamphuis, Wen Hung Huang
  • Lamp
    Patent number: D368976
    Type: Grant
    Filed: January 26, 1995
    Date of Patent: April 16, 1996
    Assignee: Ben Caster Electric Industrial Co., Ltd.
    Inventor: Wen B. Huang
  • Lamp
    Patent number: D369430
    Type: Grant
    Filed: January 26, 1995
    Date of Patent: April 30, 1996
    Assignee: Ben Caster Electric Industrial Co., Ltd.
    Inventor: Wen B. Huang