Abstract: A method for controlling and adjusting a machining parameter of a processing machine detects and acquires information of workpieces during processing, and calculates an error compensation depending on the detected information and a mathematical model. The error compensation is compared with a first preset value and a determination made as to whether the error compensation is greater than a first preset value. The machining parameter is adjusted when the error compensation is not greater than the first preset value, the processing machine can be stopped if greater. An apparatus, and a non-transitory computer readable medium for controlling the machining parameter are also disclosed.

Abstract: An integrated circuit die includes thereon a first device region, a second device region and a non-active region. A first implant mask, which covers the second device region and the non-active region, while exposing the first device region, is formed over the semiconductor substrate. Dopant species are implanted into the exposed semiconductor substrate within the first device region to form first doping regions therein. A second implant mask is formed over the semiconductor substrate. The second implant mask covers the first device region, while exposing the second device region and a portion of the non-active region. Dopant species are implanted into the exposed semiconductor substrate within the second device region to form second doping regions therein.

Abstract: An integrated circuit die includes thereon a first device region, a second device region and a non-active region. A first implant mask, which covers the second device region and the non-active region, while exposing the first device region, is formed over the semiconductor substrate. Dopant species are implanted into the exposed semiconductor substrate within the first device region to form first doping regions therein. A second implant mask is formed over the semiconductor substrate. The second implant mask covers the first device region, while exposing the second device region and a portion of the non-active region. Dopant species are implanted into the exposed semiconductor substrate within the second device region to form second doping regions therein.

Abstract: A semiconductor substrate having an integrated circuit die area surrounded by a scribe lane is provided. Within the integrated circuit die area, a first trench isolation region and a second trench isolation region are formed on the semiconductor substrate, wherein the first trench isolation region isolates a first active device region from a second active device region, and the second trench isolation region comprises a plurality of trench dummy features for reducing loading effect. A first gate electrode is formed on the first active device region and a second gate electrode on the second active device region. The first active device region is masked, while the second active device region and the trench dummy features are exposed. An ion implantation process is then performed to implant dopant species into the second active device region.

Abstract: An integrated circuit die includes thereon a first device region, a second device region and a non-active region. A first implant mask, which covers the second device region and the non-active region, while exposing the first device region, is formed over the semiconductor substrate. Dopant species are implanted into the exposed semiconductor substrate within the first device region to form first doping regions therein. A second implant mask is formed over the semiconductor substrate. The second implant mask covers the first device region, while exposing the second device region and a portion of the non-active region. Dopant species are implanted into the exposed semiconductor substrate within the second device region to form second doping regions therein.

Abstract: A semiconductor substrate having an integrated circuit die area surrounded by a scribe lane is provided. Within the integrated circuit die area, a first trench isolation region and a second trench isolation region are formed on the semiconductor substrate, wherein the first trench isolation region isolates a first active device region from a second active device region, and the second trench isolation region comprises a plurality of trench dummy features for reducing loading effect. A first gate electrode is formed on the first active device region and a second gate electrode on the second active device region. The first active device region is masked, while the second active device region and the trench dummy features are exposed. An ion implantation process is then performed to implant dopant species into the second active device region.

Abstract: An integrated circuit die includes thereon a first device region, a second device region and a non-active region. A first implant mask, which covers the second device region and the non-active region, while exposing the first device region, is formed over the semiconductor substrate. Dopant species are implanted into the exposed semiconductor substrate within the first device region to form first doping regions therein. A second implant mask is formed over the semiconductor substrate. The second implant mask covers the first device region, while exposing the second device region and a portion of the non-active region. Dopant species are implanted into the exposed semiconductor substrate within the second device region to form second doping regions therein.