Patents by Inventor Wen Bin Qu

Wen Bin Qu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Memory device system with stacked packages
    Patent number: 8288860
    Abstract: An integrated circuit package system includes: providing a base package of an elongated rectangular-box shape containing first electrical circuitry and including: forming a rectangular contact strip on and adjacent to a first end of the base package; and forming a base contact pad on and adjacent to a second end of the base package for connection to an electrical interconnect.
    Type: Grant
    Filed: September 9, 2008
    Date of Patent: October 16, 2012
    Assignee: Stats Chippac Ltd.
    Inventors: Chee Keong Chin, Yu Feng Feng, Wen Bin Qu
  • MEMORY DEVICE SYSTEM WITH STACKED PACKAGES
    Publication number: 20090072378
    Abstract: An integrated circuit package system includes: providing a base package of an elongated rectangular-box shape containing first electrical circuitry and including: forming a rectangular contact strip on and adjacent to a first end of the base package; and forming a base contact pad on and adjacent to a second end of the base package for connection to an electrical interconnect.
    Type: Application
    Filed: September 9, 2008
    Publication date: March 19, 2009
    Inventors: Chee Keong Chin, Yu Feng Feng, Wen Bin Qu