Patents by Inventor Wen-Bing Chou

Wen-Bing Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5773733
    Abstract: The present invention provides an alumina-aluminum nitride-nickel (Al.sub.2 O.sub.3 -AlN-Ni) composite which can be prepared by pressureless sintering Al.sub.2 O.sub.3 and NiAl alloy powders or by pressureless sintering Al.sub.2 O.sub.3, Ni and Al powders in a nitrogen-containing atmosphere. The mechanical properties and the thermal conductivity of the obtained composite are better than those of alumina alone, while the electrical resistivity of the composite remains high. The composite thus is suitable for use as an electronic substrate or package.
    Type: Grant
    Filed: April 12, 1996
    Date of Patent: June 30, 1998
    Assignee: National Science Council
    Inventors: Wei-Hsing Tuan, Wen-Bing Chou, Shun-Tai Chang