Patents by Inventor Wen-Chan Yu

Wen-Chan Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Water-and-dust proof structure for a notebook computer heat sink
    Patent number: 7262963
    Abstract: The present invention is to provide a water-and-dust proof structure for a notebook computer heat sink having a chip set and a heat sink module, characterized by comprising (between the chip set and the heat sink module): a separation plate comprising a receptacle having a prescribed hole therein, the separation plate cooperating with a casing of the notebook computer to form a space inside the notebook computer so that the heat sink module and the chip set on the main board of the notebook computer are separatedly located in different spaces inside the notebook computer and closely contact each other through the receptacle of the separation plate; a resilient frame formed to cooperate with the receptacle of the separation plate and having a prescribed hole therein; a resilient piece formed to cooperated with the prescribed hole and having multiple resilient curve portions; and arranging the resilient frame into the receptacle of the separation plate, the heat sink module cooperating with the resilient piece
    Type: Grant
    Filed: March 21, 2006
    Date of Patent: August 28, 2007
    Assignee: Twinhead International Corp.
    Inventors: Wen-Chan Yu, Shu-Shian Liau
  • Water-and-dust proof structure for a notebook computer heat sink
    Publication number: 20060262507
    Abstract: The present invention is to provide a water-and-dust proof structure for a notebook computer heat sink having a chip set and a heat sink module, characterized by comprising (between the chip set and the heat sink module): a separation plate comprising a receptacle having a prescribed hole therein, the separation plate cooperating with a casing of the notebook computer to form a space inside the notebook computer so that the heat sink module and the chip set on the main board of the notebook computer are separatedly located in different spaces inside the notebook computer and closely contact each other through the receptacle of the separation plate; a resilient frame formed to cooperate with the receptacle of the separation plate and having a prescribed hole therein; a resilient piece formed to cooperated with the prescribed hole and having multiple resilient curve portions; and arranging the resilient frame into the receptacle of the separation plate, the heat sink module cooperating with the resilient piece
    Type: Application
    Filed: March 21, 2006
    Publication date: November 23, 2006
    Applicant: Twinhead International Corp.
    Inventors: Wen-Chan Yu, Shu-Shian Liau