Patents by Inventor Wen-Chang Huang

Wen-Chang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12294002
    Abstract: An integrated circuit package and a method of forming the same are provided. The method includes attaching an integrated circuit die to a first substrate. A dummy die is formed. The dummy die is attached to the first substrate adjacent the integrated circuit die. An encapsulant is formed over the first substrate and surrounding the dummy die and the integrated circuit die. The encapsulant, the dummy die and the integrated circuit die are planarized, a topmost surface of the encapsulant being substantially level with a topmost surface of the dummy die and a topmost surface of the integrated circuit die. An interior portion of the dummy die is removed. A remaining portion of the dummy die forms an annular structure.
    Type: Grant
    Filed: May 15, 2024
    Date of Patent: May 6, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin, Heh-Chang Huang, Hsing-Kuo Hsia, Chih-Chieh Hung, Ying-Ching Shih, Chin-Fu Kao, Wen-Hsin Wei, Li-Chung Kuo, Chi-Hsi Wu, Chen-Hua Yu
  • Publication number: 20250141220
    Abstract: An ESD protection circuit is coupled to a first pad and includes an ESD detection circuit, a P-type transistor, an N-type transistor, and a discharge circuit. The ESD detection circuit determines whether an ESD event occurs on the first pad to generate a detection signal at a first node. The P-type transistor comprises a source coupled to the first pad, a drain coupled to a second node, and a gate coupled to the first node. The N-type transistor comprises a drain coupled to the second node, a source coupled to a ground, and a gate coupled to a second pad. The discharge circuit is coupled between the first pad and the ground and controlled by a driving signal at the second node. When the ESD protection circuit is in an operation mode, the first pad receives a first voltage, and a second pad receives a second voltage.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 1, 2025
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Chih-Hsuan LIN, Shao-Chang HUANG, Yeh-Ning JOU, Chieh-Yao CHUANG, Hwa-Chyi CHIOU, Wen-Hsin LIN, Kai-Chieh HSU, Ting-Yu CHANG, Hsien-Feng LIAO
  • Publication number: 20250102804
    Abstract: An optical waveguide element, including a first optical waveguide, a second optical waveguide, a third optical waveguide, and a grating, is provided. The second optical waveguide is disposed on the first optical waveguide. The third optical waveguide is disposed on the second optical waveguide. The grating is disposed between the first optical waveguide and the second optical waveguide. A refractive index of the second optical waveguide is smaller than a refractive index of the first optical waveguide and a refractive index of the third optical waveguide. A head-mounted display is also provided.
    Type: Application
    Filed: July 16, 2024
    Publication date: March 27, 2025
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Wen-Chang Hung, Ting-Wei Huang, Bo-Kai Zhang, Ji-Ping Sheng
  • Patent number: 12261133
    Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes: providing an interposer having a front surface and a back surface, the interposer comprising a substrate, at least one routing region, and at least one non-routing region; forming at least one warpage-reducing trench in the at least one non-routing region, wherein the at least one warpage-reducing trench extends from the front surface of the interposer to a first depth, the first depth smaller than a thickness between the front surface and the back surface of the interposer; depositing a warpage-relief material in the at least one warpage-reducing trench; and bonding the group of IC dies to the front surface of the interposer.
    Type: Grant
    Filed: April 8, 2024
    Date of Patent: March 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Yang Hsieh, Chien-Chang Lee, Chia-Ping Lai, Wen-Chung Lu, Cheng-Kang Huang, Mei-Shih Kuo, Chih-Ai Huang
  • Patent number: 12218166
    Abstract: A metal grid within a trench isolation structure on the back side of an image sensor is coupled to a contact pad so that a voltage on the metal grid is continuously variable with a voltage on the contact pad. One or more conductive structures directly couple the metal grid to a contact pad. The conductive structures may bypass a front side of the image sensor. A bias voltage on the metal grid may be varied through the contact pad whereby a trade-off between reducing cross-talk and increasing quantum efficiency may be adjusted dynamically in accordance with the application of the image sensor, its environment of use, or its mode of operation.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: February 4, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo, Shih-Han Huang
  • Publication number: 20190000021
    Abstract: The rainmaking device includes a first pipe member, a connection member, and a second pipe member. The first pipe member is installed adjacent to a warm water source. The first pipe member has an intake facing the warm water source. A number of blowers configured around the intake. The connection member is connected between the first and second pipe members. The second pipe member has a cone shape whose aperture gradually decreases upward. Through the blowers, the first and second pipe members, wet air above the warm water source of 22-25 degrees is drawn up to a high altitude. Tiny ice crystals attract surrounding water vapor and become larger and heavier. They will then drop as rain when the buoyance can no longer support them. The latent heat released would power the convection of surrounding air so that a chain reaction may be triggered, and cumulonimbus would become rain and fall.
    Type: Application
    Filed: July 3, 2017
    Publication date: January 3, 2019
    Inventor: Bill Wen-Chang Huang
  • Publication number: 20150204008
    Abstract: A manufacturing method of a colored high-strength fiber has a preparation step, a dyeing step and a post-processing step. In the preparation step: a high-strength fiber substrate is surface-treated by solvent, and a surface of the high-strength fiber substrate is fractured, such that a surface-treated substrate is manufactured. In the dyeing step: the surface-treated substrate is plated, wherein multiple metal ions are combined with a surface of the surface-treated substrate, such that a dyed substrate is manufactured. In the post-processing step: the dyed substrate is surface-cleaned to remove remaining agents caused by the dyeing step, such that the colored high-strength fiber is manufactured.
    Type: Application
    Filed: January 22, 2014
    Publication date: July 23, 2015
    Inventor: Wen-Chang HUANG
  • Patent number: 8096252
    Abstract: A ship hull structure includes a main hull and a movable rearbody having an engine and a propeller. The movable rearbody is located at a lower side of a stern of the main hull, connected with an aft of the main hull to form an integral unit by a hinge linking device allowing the rearbody to pivot up and down. By a block, a crane or a winch and through a chain or a hanging wire, a pivoting angle of the movable rearbody with respect to the main hull can be adjusted and controlled. A bottom of the hull can be provided with at least one, usually plural, air cushion recess, which is filled with pressurized air to reduce a viscous force between a bottom of the ship and water.
    Type: Grant
    Filed: July 8, 2009
    Date of Patent: January 17, 2012
    Inventor: Bill Wen-Chang Huang
  • Publication number: 20100064959
    Abstract: A ship hull structure includes a main hull and a movable rearbody having an engine and a propeller. The movable rearbody is located at a lower side of a stern of the main hull, connected with an aft of the main hull to form an integral unit by a hinge linking device allowing the rearbody to pivot up and down. By a block, a crane or a winch and through a chain or a hanging wire, a pivoting angle of the movable rearbody with respect to the main hull can be adjusted and controlled. A bottom of the hull can be provided with at least one, usually plural, air cushion recess, which is filled with pressurized air to reduce a viscous force between a bottom of the ship and water. When a ship of this kind of structure is sailing, the rearbody can be lifted up by the block or the winch, allowing part of the propeller to be separated from a water surface to reduce resistance in the water that the engine can achieve a required rotational speed (RPM) in a short time.
    Type: Application
    Filed: July 8, 2009
    Publication date: March 18, 2010
    Inventor: Bill Wen-Chang HUANG
  • Publication number: 20060061002
    Abstract: A method for making a wood-like plate by using a mold structure comprises the steps of pushing a wood texture layer into the mold opening of the slit to enclosing the material feeding mold seat; guiding foaming material into the feeding opening of the material feeding mold seat; and forwarding the wood texture layer to encloses the shaped foam plate tightly adhered on the wood texture layer. By the expanding force of the foaming material, the wood texture layer will resist against the inner surface of the slit in an inner section of the material receiving mold seat since the length of the material feeding mold seat is shorter than the material receiving mold seat. The material is foamed as a wood-like plate along the shaping channel and then enclosed by the wood texture layer as a wood like plate. A device for processing the method is also enclosed.
    Type: Application
    Filed: September 29, 2005
    Publication date: March 23, 2006
    Inventors: Wen-Chang Huang, Sung-Bo Cheng
  • Publication number: 20040013757
    Abstract: A device for making a wood-like plate comprises a material receiving mold seat and a material feeding mold seat. A shaping channel is in an inner side of a material receiving mold seat. A material feeding mold seat is located in mold openings of the material receiving mold seat. A plurality of feeding openings is formed longitudinally along the material feeding mold seat for being filled with foaming material. A slit is formed as the material feeding mold seat being located in the material receiving mold seat. A wood texture layer enclosing material feeding mold seat. Heated foaming material is fed into the feeding openings of the material feeding mold seat and outputted from the feeding openings at another side so as to form a shape like the shaping channel. The wood texture layer moves forwards and then encloses the shaped foam plate so as to form a wood-like plate.
    Type: Application
    Filed: July 22, 2002
    Publication date: January 22, 2004
    Inventors: Wen-Chang Huang, Sung-Bo Cheng
  • Patent number: 6431099
    Abstract: This invention discloses a novel ship design especially suitable for ocean-going merchant vessels and oil tankers. A ship is rendered into two or more independent ship bodies, and these separate ship bodies are joined together by means of hinge; thus the name sectioned ship. In one embodiment of the invention a sectioned ship comprises a fore ship body and an aft ship body, and, by means of a hinge means located in the middle part, i.e., the adjoining surface of said two ship bodies, the two ship bodies are vertically pivotably joined to form a ship. In another embodiment of the invention, a sectioned ship comprises a fore ship body, an aft ship body, and at least one intermediate ship body, and by means of two hinge means located at the two ends of the intermediate ship body these ship bodies are vertically pivotably connected to form a single body.
    Type: Grant
    Filed: October 30, 2000
    Date of Patent: August 13, 2002
    Inventor: Bill Wen-Chang Huang
  • Patent number: 5762018
    Abstract: A cross-shaped float platform for use at sea watching and fishing, including 4 long trunk buoys having a plurality of columns connected to form in a cross-shaped float, a structural suspension frame mounted on the columns, decks suspendedly disposed on the lower part of the suspension frame at the middle part of the columns and stretching between the two sides (port and starboard) and along the longitudinal direction, a central connecting member pivotedly connected to each of the buoys, reinforcing elements provided at each connecting portion of the buoys, and a sun canopy mounted on the suspension frame for covering the deck. The cross-shaped fishing float platform can be separated out from the connecting member and folded up to form a dual composite float to facilitate its entry or leave from small harbors or ports.
    Type: Grant
    Filed: November 14, 1996
    Date of Patent: June 9, 1998
    Inventor: Wen-Chang Huang
  • Patent number: 5339761
    Abstract: A hydrofoil craft according to the invention is provided on the bottom of the hull with at least one, usually several, air cushion recesses arranged along the middle of the bottom in a fore-and-aft direction. The air cushion recesses each forms a groove having the upwardly indented bottom, the upper wall front end, to be deeper and becoming shallower toward the rear end and resembling a triangle or sector in shape when viewed in a longitudinal section and generally to be a rectangle in shape when viewed in a plane. The angle from the shallowest end of the air cushion recess to the deepest end is within 1.degree. to 30.degree. and the two side walls on the sides of the bulwarks of the recess extend a little to the lower parts of the fore-and-aft end walls. The hydrofoils are mounted across the lower parts of the air cushion recesses and are close to the air cushion recesses.
    Type: Grant
    Filed: February 23, 1993
    Date of Patent: August 23, 1994
    Assignees: Wen-Chang Huang, Te-Yaung Chu
    Inventor: Wen-Chang Huang
  • Patent number: D440804
    Type: Grant
    Filed: July 13, 2000
    Date of Patent: April 24, 2001
    Inventors: Wen-Chang Huang, Sung-Po Cheng