Patents by Inventor Wen-Chang Peng

Wen-Chang Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor photo-detecting device
    Patent number: 11935981
    Abstract: A photo-detecting device includes a first semiconductor layer with a first dopant, a light-absorbing layer, a second semiconductor layer, and a semiconductor contact layer. The second semiconductor layer is located on the first semiconductor layer and has a first region and a second region, the light absorbing layer is located between the first semiconductor layer and the second semiconductor layer and has a third region and a fourth region, the semiconductor contact layer contacts the first region. The first region includes a second dopant and a third dopant, the second region includes second dopant, and the third region includes third dopant. The semiconductor contact layer has a first thickness greater than 50 ? and smaller than 1000 ?.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: March 19, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Chu-Jih Su, Chia-Hsiang Chou, Wei-Chih Peng, Wen-Luh Liao, Chao-Shun Huang, Hsuan-Le Lin, Shih-Chang Lee, Mei Chun Liu, Chen Ou
  • Electroplating systems and methods
    Patent number: 7837850
    Abstract: An electroplating system is provided. The system comprises a reaction tank, a tube, and a video bubble detector. The reaction tank, having a first diameter, contains a plating solution. The tube, connecting to the reaction tank, comprises an inflow tube and a branch, wherein the inflow tube inputs the plating solution into the reaction tank, and the branch has an enlarged part having the first diameter. The video bubble detector, mounted on the enlarged part of the branch, detects the presence of a bubble in the plating solution flowing through the branch.
    Type: Grant
    Filed: September 28, 2005
    Date of Patent: November 23, 2010
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Da Guo, Pin-Chieh Hu, Hung-Cheng Chen, Kuan-Hsiao Lin, Wen-Chang Peng, Hsiao-Pin Shih, Chyi-Shyuan Chern
  • Cleaning device
    Publication number: 20070251035
    Abstract: A cleaning device. The cleaning device, for cleaning a brush of a wafer scrubber, includes a cup and a dummy pad. The dummy pad is disposed in the cup. The brush rubs against the dummy pad. A method of cleaning a brush of a wafer scrubber, comprising providing a cup with a dummy pad disposed in the cup, and rubbing the brush against the dummy pad.
    Type: Application
    Filed: May 1, 2006
    Publication date: November 1, 2007
    Inventors: Wen-Chang Peng, Ming-Da Guo, Chyi-Shyung Chern, Chang-Jung Wu
  • Electroplating systems and methods
    Publication number: 20070068818
    Abstract: An electroplating system is provided. The system comprises a reaction tank, a tube, and a video bubble detector. The reaction tank, having a first diameter, contains a plating solution. The tube, connecting to the reaction tank, comprises an inflow tube and a branch, wherein the inflow tube inputs the plating solution into the reaction tank, and the branch has an enlarged part having the first diameter. The video bubble detector, mounted on the enlarged part of the branch, detects the presence of a bubble in the plating solution flowing through the branch.
    Type: Application
    Filed: September 28, 2005
    Publication date: March 29, 2007
    Inventors: Ming-Da Guo, Pin-Chieh Hu, Hung-Cheng Chen, Kuan-Hsiao Lin, Wen-Chang Peng, Hsiao-Pin Shih, Chyi-Shyuan Chern