Patents by Inventor Wen-Chen Chiang

Wen-Chen Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8357890
    Abstract: A method for fabricating image sensor is disclosed. The method includes the steps of: providing a substrate, wherein the substrate comprises a plurality of photodiodes; forming at least one dielectric layer and a passivation layer on surface of the substrate; using a patterned photomask to perform a first pattern transfer process for forming a plurality of trenches corresponding to each photodiode in the passivation layer; forming a plurality of color filters in the trenches; covering a planarizing layer on the color filters; and using the patterned photomask to perform a second pattern transfer process for forming a plurality of microlenses corresponding to each color filter on the planarizing layer.
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: January 22, 2013
    Assignee: United Microelectronics Corp.
    Inventors: Chi-Chung Chen, Wen-Chen Chiang, Yu-Tsung Lin
  • Publication number: 20120202311
    Abstract: A method of manufacturing image sensor includes the following steps. A substrate having a first region and a second region is provided. A plurality of image sensing components and a periphery circuit are formed on the substrate in the first region and the second region respectively. A first conductive layer and a first dielectric layer are formed on the substrate. An etch stop layer is formed on the first dielectric layer. A second conductive layer is formed on the etch stop layer in the second region. A second dielectric layer is formed on the substrate. The second dielectric layer on the etch stop layer in the first region is etched to be removed. The etch stop layer in the first region is removed to form a space. A color filter array is disposed in the space.
    Type: Application
    Filed: February 9, 2011
    Publication date: August 9, 2012
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Wen-Chen CHIANG, Ko-Ting Chen
  • Publication number: 20110108715
    Abstract: A method for fabricating image sensor is disclosed. The method includes the steps of: providing a substrate, wherein the substrate comprises a plurality of photodiodes; forming at least one dielectric layer and a passivation layer on surface of the substrate; using a patterned photomask to perform a first pattern transfer process for forming a plurality of trenches corresponding to each photodiode in the passivation layer; forming a plurality of color filters in the trenches; covering a planarizing layer on the color filters; and using the patterned photomask to perform a second pattern transfer process for forming a plurality of microlenses corresponding to each color filter on the planarizing layer.
    Type: Application
    Filed: November 10, 2009
    Publication date: May 12, 2011
    Inventors: Chi-Chung Chen, Wen-Chen Chiang, Yu-Tsung Lin