Patents by Inventor Wen-Chen Lan

Wen-Chen Lan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9197337
    Abstract: A wireless signal transmission device is provided. The wireless signal transmission device includes a reflective surface and a receiver. The reflective surface reflects a wireless signal. The receiver receives the wireless signal reflected. The receiver includes a receiver body, a wave guide, a transmission unit and a medium sheet. The wave guide includes an opening end and a connection end connected thereto. The transmission unit is disposed in the wave guide adjacent to the connection end for receiving the wireless signal. The medium sheet is disposed in the wave guide, wherein the medium sheet comprises a first section and a second section, the first section is adjacent to the transmission unit, the second section is adjacent to the opening end, the first section has a first dielectric constant, the second section has a second dielectric constant, and the first dielectric constant is smaller than the second dielectric constant.
    Type: Grant
    Filed: July 13, 2012
    Date of Patent: November 24, 2015
    Assignee: Wistron NeWeb Corp.
    Inventors: Ta-Jen Wu, Wen-Tsai Tsai, Wen-Chen Lan
  • Patent number: 8493159
    Abstract: A radio frequency device is disclosed, which includes an isolation substrate, a ground layer, a first signal end, a second signal end, a radio frequency circuit, and an impedance unit. The isolation substrate includes a first plane and a second plane. The ground layer is disposed on the second plane of the isolation substrate for providing grounding. The first signal end is formed on the first plane of the isolation substrate. The second signal end is formed on the first plane of the isolation substrate and coupled to the ground layer. The radio frequency circuit is disposed on the first plane of the isolation substrate and coupled to the first signal end. The impedance unit is disposed on the first plane of the isolation substrate and coupled to the first signal end and the second signal end.
    Type: Grant
    Filed: September 21, 2010
    Date of Patent: July 23, 2013
    Assignee: Wistron NeWeb Corporation
    Inventors: Wen-Tsai Tsai, Wen-Chen Lan, Ta-Jen Wu
  • Publication number: 20130115873
    Abstract: A wireless signal transmission device is provided. The wireless signal transmission device includes a reflective surface and a receiver. The reflective surface reflects a wireless signal. The receiver receives the wireless signal reflected. The receiver includes a receiver body, a wave guide, a transmission unit and a medium sheet. The wave guide includes an opening end and a connection end connected thereto. The transmission unit is disposed in the wave guide adjacent to the connection end for receiving the wireless signal. The medium sheet is disposed in the wave guide, wherein the medium sheet comprises a first section and a second section, the first section is adjacent to the transmission unit, the second section is adjacent to the opening end, the first section has a first dielectric constant, the second section has a second dielectric constant, and the first dielectric constant is smaller than the second dielectric constant.
    Type: Application
    Filed: July 13, 2012
    Publication date: May 9, 2013
    Applicant: WISTRON NEWEB CORP.
    Inventors: Ta-Jen Wu, Wen-Tasi Tsai, Wen-Chen Lan
  • Patent number: 8169275
    Abstract: A circuit board with jumper structure is disclosed. The circuit board includes a substrate, a ground layer, a first signal transmission line, and a second signal transmission line. The ground layer is formed on a second plane of the substrate. The first signal transmission line is formed on a first plane of the substrate, and coupled to a first signal end and a second signal end. A first signal transmitted on the first signal transmission line in a combination method of a microstrip line to co-planar waveguide transition and a co-planar waveguide to microstrip line transition. The second signal transmission line is formed on the second plane of the substrate, and coupled to a third signal end and a fourth signal end. A second signal is transmitted on the second signal transmission line in the co-planar waveguide transmission.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: May 1, 2012
    Assignee: Wistron NeWeb Corporation
    Inventors: Wen-Tsai Tsai, Wen-Chen Lan
  • Publication number: 20110316641
    Abstract: A radio frequency device is disclosed, which includes an isolation substrate, a ground layer, a first signal end, a second signal end, a radio frequency circuit, and an impedance unit. The isolation substrate includes a first plane and a second plane. The ground layer is disposed on the second plane of the isolation substrate for providing grounding. The first signal end is formed on the first plane of the isolation substrate. The second signal end is formed on the first plane of the isolation substrate and coupled to the ground layer. The radio frequency circuit is disposed on the first plane of the isolation substrate and coupled to the first signal end. The impedance unit is disposed on the first plane of the isolation substrate and coupled to the first signal end and the second signal end.
    Type: Application
    Filed: September 21, 2010
    Publication date: December 29, 2011
    Inventors: Wen-Tsai Tsai, Wen-Chen Lan, Ta-Jen Wu
  • Publication number: 20110316644
    Abstract: A circuit board with jumper structure is disclosed. The circuit board includes a substrate, a ground layer, a first signal transmission line, and a second signal transmission line. The ground layer is formed on a second plane of the substrate. The first signal transmission line is formed on a first plane of the substrate, and coupled to a first signal end and a second signal end. A first signal transmitted on the first signal transmission line in a combination method of a microstrip line to co-planar waveguide transition and a co-planar waveguide to microstrip line transition. The second signal transmission line is formed on the second plane of the substrate, and coupled to a third signal end and a fourth signal end. A second signal is transmitted on the second signal transmission line in the co-planar waveguide transmission.
    Type: Application
    Filed: September 30, 2010
    Publication date: December 29, 2011
    Inventors: Wen-Tsai Tsai, Wen-Chen Lan