Abstract: A light-emitting device array includes a first light-emitting device, a second light-emitting device, and a third light-emitting device. A first beam shaping structure of the first light-emitting device is configured to convert light emitted by a first light-emitting structure of first light-emitting device into first structured light. A second beam shaping structure of the second light-emitting device is configured to convert light emitted by a second light-emitting structure of second light-emitting device into second structured light. Speckle patterns and spatial distributions of the first structured light and the second structured light on a projection plane are the same. A third beam shaping structure of the third light-emitting device is configured to convert light emitted by a third light-emitting structure of third light-emitting device into third structured light.

Abstract: An exemplary embodiment of the invention provides an image processing method for a virtual reality display system. The method includes: enabling a first shared buffer and a second shared buffer; performing an image capturing operation to obtain a first image from a virtual reality scene; storing the first image to the first shared buffer; in response to that the storing of the first image is finished, reading the first image from the first shared buffer; performing a depth estimation operation on the first image to obtain depth information corresponding to the first image; storing the depth information to the second shared buffer; in response to that the storing of the depth information is finished, reading the depth information from the second shared buffer; performing an image generation operation according to the depth information to generate a pair of second images corresponding to the virtual reality scene; and outputting the pair of second images by a display of the virtual reality display system.

Abstract: An image presenting method and a display apparatus are provided. The method includes: presenting at least one virtual screen and a tool bar image in a display interface of a rollable display; detecting a physical status of the rollable display; and adjusting presenting positions of the tool bar image and the at least one virtual screen in the display interface in response to a change in the physical status.

Abstract: An image presenting method and a display device are disclosed. The method includes: defining one vision region in a display interface of a foldable display via a first application programming interface; detecting a physical status of the foldable display; dividing the vision region into a first sub-vision region and a second sub-vision region in response to that the physical status of the foldable display is a folded status; and presenting a first desktop image and a second desktop image in the first sub-vision region and the second sub-vision region respectively via a second application programming interface, wherein one of the first desktop image and the second desktop image includes a toolbar image, and a presenting position of the toolbar image in the first sub-vision region or the second sub-vision region is variable.

Abstract: An imaging method, an electronic device and a video conference system are provided. The imaging method is used for performing video conference on a display. The imaging method includes the following steps. At least one video conference stream is received. When a 3D modeling command is received, a plurality of 2D frames shown on the display are captured. Based on the 2D frames, at least one 3D model is built. When a rending command corresponding to a viewing angle information is received, an adjusted image corresponding to the viewing angle information is rendered according to at least one 3D model.

Abstract: A package including a first carrier, a seed layer, wires, a die and a molding material is provided. The first carrier is removed to expose the seed layer after disposing a second carrier on the molding material, then the seed layer is removed to expose the wires, and a gold layer is deposited on each of the wires by immersion gold plating, finally a semiconductor device is obtained. The gold layer is provided to protect the wires from oxidation and improve solder joint reliability.

Abstract: A light-emitting device array includes a first light-emitting device, a second light-emitting device, and a third light-emitting device. A first beam shaping structure of the first light-emitting device is configured to convert light emitted by a first light-emitting structure of first light-emitting device into first structured light. A second beam shaping structure of the second light-emitting device is configured to convert light emitted by a second light-emitting structure of second light-emitting device into second structured light. Speckle patterns and spatial distributions of the first structured light and the second structured light on a projection plane are the same. A third beam shaping structure of the third light-emitting device is configured to convert light emitted by a third light-emitting structure of third light-emitting device into third structured light.

Abstract: Systems and methods are described for selecting models to perform monocular depth estimation. A computing device may receive a plurality of image and select an image from the plurality of images to evaluate a first machine-learning model and a plurality of machine-learning models are smaller than the first machine-learning model. The computing device may process the image using a first machine-learning model to generate a first predicted result. The computing device may also process the image using the plurality of machine-learning models to generate at least a second predicted result and a third test data set. The computing device may select a second machine-learning model from the plurality of machine-learning models based on a comparison of the first predicted result with the at least the second predicted result and the third test data set. The computing device may then process the plurality of images using the second machine-learning model.

Abstract: A system and a method for presenting three-dimensional content and a three-dimensional content calculation apparatus are provided. In the method, the calculation apparatus receives a request for presentation content including one or more images from a client device, receives the presentation content from a content delivery network according to the request, processes the images using a first machine-learning model to generate a first predicted result, processes the images using multiple machine-learning models to generate at least a second predicted result and a third predicted result, selects a second machine-learning model from the machine-learning models based on a comparison of the first predicted result with the at least the second predicted result and the third predicted result, processes the images using the second machine-learning model and sends a processing result to the client device. Accordingly, the client device generates a three-dimensional presentation of the presentation content.

Abstract: A distributed data processing system and a distributed data processing method are provided. The distributed data processing system includes a computing device and at least one additional computing device.

Abstract: A side by side image detection method and an electronic apparatus using the same are provided. The side by side image detection method includes the following steps. A first image with a first image size is obtained. A second image with a second image size that conforms to a side-by-side image format is detected within the first image by using a convolutional neural network model.

Abstract: An augmented reality (AR) system and an operation method thereof are provided. The AR system includes a target device and an AR device. The AR device captures the target device to generate a picture. The target device provides a digital content to the AR device. The AR device tracks the target device in the picture for an AR application. During the AR application, the AR device overlays the digital content on the target device in the picture.

Abstract: A method for providing voice option prompts is provided. The method is used in a switchboard device. The method includes receiving an incoming call from a client device. The method includes transmitting a voice option sound and a voice option prompt to the client device.

Abstract: This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead.

Abstract: A stereo image generation method and an electronic apparatus using the same are provided. The stereo image generation method includes the following steps. A two-dimensional (2D) original image corresponding to a first viewing angle is obtained, and a depth map of the 2D original image is estimated. Interpupillary distance information of a user is detected. A pixel shift processing is performed on the 2D original image according to the interpupillary distance information and the depth map to generate a reference image corresponding to a second viewing angle. An image inpainting processing is performed on the reference image to obtain a restored image. The restored image and the 2D original image are merged to generate a stereo image conforming to a stereo image format.

Abstract: This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces and through holes that pass through the conductive pads. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead.

Abstract: An exemplary embodiment of the invention provides an image processing method for a virtual reality display system. The method includes: enabling a first shared buffer and a second shared buffer; performing an image capturing operation to obtain a first image from a virtual reality scene; storing the first image to the first shared buffer; in response to that the storing of the first image is finished, reading the first image from the first shared buffer; performing a depth estimation operation on the first image to obtain depth information corresponding to the first image; storing the depth information to the second shared buffer; in response to that the storing of the depth information is finished, reading the depth information from the second shared buffer; performing an image generation operation according to the depth information to generate a pair of second images corresponding to the virtual reality scene; and outputting the pair of second images by a display of the virtual reality display system.

Abstract: A computer-executable method for generating a side-by-side three-dimensional (3D) image includes the steps of creating a 3D mesh and estimating depth information of the raw image. The method further includes the steps of updating the left mesh area and the right mesh area of the 3D mesh based on the estimated depth information of the raw image and projecting each of the mesh vertices of the left mesh area onto a coordinate system of the side-by-side 3D image based on a left eye position, and projecting each of the mesh vertices of the right mesh area onto the coordinate system of the side-by-side 3D image based on a right eye position. The method further obtains the side-by-side 3D image by coloring the left mesh area and the right mesh area projected onto the coordinate system of the side-by-side 3D image based on the raw image.

Abstract: A method for generating stereoscopic images is provided. The method includes: creating a three-dimensional mesh to obtain a stereoscopic scene and capturing a two-dimensional image of the stereoscopic scene; performing image preprocessing to obtain a first image in response to the two-dimensional image not being a side-by-side image; utilizing a graphics processing pipeline to perform depth estimation on the first image to obtain a depth image, to update the three-dimensional mesh according to a depth setting of the depth image, and to map the three-dimensional mesh to a corresponding coordinate system; utilizing the graphics processing pipeline to project the first image onto the mapped three-dimensional mesh to obtain an output three-dimensional mesh, and to capture an output side-by-side image from the output three-dimensional mesh; and utilizing the graphics processing pipeline to weave a left-eye and right-eye image into an output image, and to display the output image.

Abstract: A semiconductor package includes a substrate, first bumps, a first chip, metal pillars, second bumps and a second chip. The substrate includes first and second conductive pads which are located on a top surface of the substrate. Both ends of the first bumps are connected to the first conductive pads and the first chip, respectively. Both ends of the metal pillars are connected to the second conductive pads and one end of the second bumps, respectively. A cross-sectional area of each of the metal pillars is larger than that of each of the second bumps. The second chip is connected to the other end of the second bumps and located above the first chip.