Abstract: An electronic device includes a first substrate; a second substrate arranged opposite to the first substrate; a first electrode layer disposed on the first substrate; a display medium layer disposed between the first electrode layer and the second substrate; and a first metal element, wherein the first metal element is fixed on the first electrode layer through a conductive glue and an insulating glue; wherein in a normal direction of the first substrate, the conductive glue and the insulating glue are overlapped.

Abstract: A wavelength conversion element includes a base plate and a rotating device. The base plate has a first surface and a second surface. The first surface is configured to allow a fluorescent layer to dispose on. The base plate includes some first grooves and some second grooves. The first grooves are disposed on the first surface around a center of the base plate. The second grooves are disposed on the second surface around the center. The first grooves and the second grooves are staggered from each other along a rotating direction. The base plate has some through holes. Each of the through holes communicates with the second surface and the corresponding first groove. The rotating device is connected with the base plate and configured to drive the base plate to rotate about an axis along the rotating direction. The axis passes through the center.

Abstract: An electronic device is provided, including a frame, a backlight module, a working panel, and a tape. The frame includes a side wall and a back plate. The side wall includes an outer surface. The extension direction of the back plate is different from the extension direction of the side wall. The backlight module is disposed on the back plate. The working panel and the back plate are disposed on the opposite sides of the backlight module. The tape is in contact with at least a portion of the outer surface and the working panel.

Abstract: An electronic device includes a first substrate; a second substrate arranged opposite to the first substrate; a first electrode layer disposed on the first substrate; a second electrode layer disposed on the second substrate; a display medium layer disposed between the first electrode layer and the second electrode layer; a sealant disposed between the first electrode layer and the second electrode layer to surround the display medium layer; and a first metal element extending along a first direction, wherein the first metal element is fixed onto the first electrode layer through a conductive glue and a first insulating glue.

Abstract: A wavelength converting device includes a diffused-reflecting layer, a substrate, and a photoluminescence layer. The diffused-reflecting layer has a first surface and a second surface facing away from the first surface, and the diffused-reflecting layer includes a hydrophilic binder and a lipophilic binder. The substrate is on the first surface of the diffused-reflecting layer. The photoluminescence layer is on the second surface of the diffused-reflecting layer.

Abstract: A wavelength conversion member includes a substrate, a phosphor layer, and a ventilated blade. The substrate is configured to rotate based on an axis. The phosphor layer is disposed on the substrate. The ventilated blade is disposed on the substrate and has a pore density between 10 ppi and 500 ppi or a volume porosity between 5% and 95%.

Abstract: An electronic device includes a first substrate; a second substrate arranged opposite to the first substrate; a first electrode layer disposed on the first substrate; a second electrode layer disposed on the second substrate; a display medium layer disposed between the first electrode layer and the second electrode layer; a sealant disposed between the first electrode layer and the second electrode layer to surround the display medium layer; and a first metal element extending along a first direction, wherein the first metal element is fixed onto the first electrode layer through a conductive glue and a first insulating glue.

Abstract: A wavelength conversion element includes a base plate and a rotating device. The base plate has a first surface and a second surface. The first surface is configured to allow a fluorescent layer to dispose on. The base plate includes some first grooves and some second grooves. The first grooves are disposed on the first surface around a center of the base plate. The second grooves are disposed on the second surface around the center. The first grooves and the second grooves are staggered from each other along a rotating direction. The base plate has some through holes. Each of the through holes communicates with the second surface and the corresponding first groove. The rotating device is connected with the base plate and configured to drive the base plate to rotate about an axis along the rotating direction. The axis passes through the center.

Abstract: A wavelength converting device includes a diffused-reflecting layer, a substrate, and a photoluminescence layer. The diffused-reflecting layer has a first surface and a second surface facing away from the first surface, and the diffused-reflecting layer includes a hydrophilic binder and a lipophilic binder. The substrate is on the first surface of the diffused-reflecting layer. The photoluminescence layer is on the second surface of the diffused-reflecting layer.

Abstract: An isolated rat liver cancer stem cell line which is named as TW-1 is provided. A method for drug screening by using the isolated rat liver cancer stem cell line is also provided.

Abstract: A manufacturing method of a display device is disclosed. The method includes the following steps. A first substrate having a first region and a second region is provided. A second substrate is disposed on the first substrate. The second substrate is overlapping the first region. At least one drive IC is disposed on the second region. A protection layer is disposed on the second region. The protection layer is disposed enclosing the at least one drive IC. The protection layer has a maximum height larger than a maximum height of the at least one drive IC.

Abstract: An electronic device is provided, including a frame, a backlight module, a working panel, and a tape. The frame includes a side wall and a back plate. The side wall includes an outer surface. The extension direction of the back plate is different from the extension direction of the side wall. The backlight module is disposed on the back plate. The working panel and the back plate are disposed on the opposite sides of the backlight module. The tape is in contact with at least a portion of the outer surface and the working panel.

Abstract: An electronic device is provided, including a frame, a working panel, and a spacer. The frame includes a side wall. The working panel is disposed on the frame. The spacer is disposed between the frame and the working panel. At least a portion of the working panel and at least a portion of the spacer are in direct contact with an adhesive.

Abstract: A lighting device includes a wavelength conversion unit, a driving unit, and a light source. The wavelength conversion unit includes a main body and a fluorescent powder layer. The main body has a cylindrical outer surface. The fluorescent powder layer is disposed on the cylindrical outer surface. The driving unit is configured to drive the wavelength conversion unit to rotate around an axis. The cylindrical outer surface surrounds the axis. The light source is configured to emit light toward the fluorescent powder layer.

Abstract: A lighting device includes a wavelength conversion unit, a driving unit, and a light source. The wavelength conversion unit includes a main body and a fluorescent powder layer. The main body has a cylindrical outer surface. The fluorescent powder layer is disposed on the cylindrical outer surface. The driving unit is configured to drive the wavelength conversion unit to rotate around an axis. The cylindrical outer surface surrounds the axis. The light source is configured to emit light toward the fluorescent powder layer.

Abstract: A manufacturing method of a display device is disclosed. The method includes the following steps. A first substrate having a first region and a second region is provided. A second substrate is disposed on the first substrate. The second substrate is overlapping the first region. At least one drive IC is disposed on the second region. A protection layer is disposed on the second region. The protection layer is disposed enclosing the at least one drive IC. The protection layer has a maximum height larger than a maximum height of the at least one drive IC.

Abstract: An electronic device is provided, including a frame, a working panel and a cover plate. The frame includes a sidewall, and the sidewall includes an outer surface. At least a part of the working panel is disposed in the frame. The cover plate is disposed on the working panel and includes a surface, wherein a surface of the cover plate and an outer surface of the sidewall of the frame are fixed by using an adhesive, and the extension direction of the surface of the cover plate is different than the extension direction of the outer surface of the sidewall of the frame.

Abstract: An electronic device is provided, including a frame, a working panel and a cover plate. The frame includes a sidewall, and the sidewall includes an outer surface. At least a part of the working panel is disposed in the frame. The cover plate is disposed on the working panel and includes a surface, wherein a surface of the cover plate and an outer surface of the sidewall of the frame are fixed by using an adhesive, and the extension direction of the surface of the cover plate is different than the extension direction of the outer surface of the sidewall of the frame.

Abstract: A manufacturing method of a display device is disclosed. The method includes the following steps. A first substrate having a first region and a second region is provided. A second substrate is disposed on the first substrate. The second substrate is overlapping the first region. At least one drive IC is disposed on the second region. A protection layer is disposed on the second region, The protection layer is disposed enclosing the at least one drive IC. The protection layer has a maximum height larger than a maximum height of the at least one drive IC.

Abstract: A display device and a manufacturing method thereof are provided. The display device includes a first substrate, a second substrate, a drive IC and a protection layer. The first substrate has a first region and a second region. The second substrate is correspondingly disposed on the first region. The drive IC is disposed on the second region. The protection layer is disposed enclosing the drive IC, and the protection layer has a maximum height larger than the height of the drive IC.