Abstract: An integrated motor and drive assembly is disclosed and includes a housing, a motor and a drive. The housing includes a motor-accommodation portion and a drive-accommodation portion. The drive includes a power board and a control board. The power board is made of a high thermal conductivity substrate and includes a power element and an encoder disposed on the first side, the first side faces the motor, the power board and the motor are stacked along a first direction, and the second side contacts the housing to from a heat-dissipating route. The control board is disposed adjacent to the power board. The control board and the power board are arranged along a second direction perpendicular to the first direction, and the first direction is parallel to an axial direction of the motor. A part of the power board and a part of the control board are directly contacted to form an electrical connection.

Abstract: The present invention provides compounds useful as inhibitors of PDK1. The present invention also provides compositions thereof, and methods of treating PDK1-mediated diseases.

Abstract: A radioactive waste acid is recycled. The waste acid is a fluoboric waste acid. The waste acid contains a lot of oxides and radioactive nuclei. The waste fluoboric acid is processed to obtain a purified fluoboric acid. The amount of radioactive nuclei is greatly reduced. Thus, the present invention has a simple procedure with low cost and reduced power consumption.

Abstract: A method for forming a non-volatile memory device includes: (a) forming an isolation structure on a circuit-forming surface of a semiconductor substrate to define an array of cell forming regions; (b) forming a gate structure array including a plurality of gate structures disposed above the cell forming regions and each having a first side and a second side; (c) performing ion implantation to form drain regions and a common source region; and (d) forming drain contacts to the drain regions, and a common source contact to the common source region.

Abstract: A manufacturing method of tunnel oxide of NOR flash memory controls the temperature and thickness of tunnel oxide in a gate structure to prevent a channel region to change its doping concentration and range due to a high-temperature manufacturing process, so as to overcome the leakage current and improve the reliability of storing data.

Abstract: Disclosed is a method for making a refractory material from aluminum residues of aluminum recycling. At first, the aluminum residues is mixed with adhesive solution so that the percentage by weight of the adhesive solution is 5 wt % to 10 wt %. The mixture is granulated into grains. The grains are filled in a mold, pressed and then removed from the mold so that the grains are turned into a green body. The green body is heated in a furnace at a range of temperature from 1100° C. to 1400° C. so that the grains are sintered and become a refractory material.

Abstract: The present disclosure uses aluminum residues to fabricate artificial stones. The aluminum residues are obtained from a recycle process of aluminum scrap. The aluminum residues is made into dross and baghouse dust as raw materials for the artificial stones. The artificial stones thus made are improved in characteristics of mechanical strength, hardness, abrasion resistance, flame resistance and anti-oxidation. Hence, the present disclosure reduces impacts to the nature; obtains derived products from recycled aluminum residues; increases commercial income; decreases cost for handling aluminum residues; and saves the use of aluminum oxide, aluminium hydroxide or silicon oxide on making artificial stones. The artificial stones thus made are fit to be used in fields of green material, green construction and green industry.

Abstract: Disclosed is a method for making a refractory material from aluminum residues of aluminum recycling. At first, the aluminum residues is mixed with adhesive solution so that the percentage by weight of the adhesive solution is 5 wt % to 10 wt %. The mixture is granulated into grains. The grains are filled in a mold, pressed and then removed from the mold so that the grains are turned into a green body. The green body is heated in a furnace at a range of temperature from 1100° C. to 1400° C. so that the grains are sintered and become a refractory material.

Abstract: Slag fiber is used to fabricate a friction material. Friction factor and abrasion loss of the friction material are controlled. The friction material can be used to make linings. Thus, slag fiber can be used as a replacement for natural material to make a friction material, and waste is thus recycled.

Abstract: Disclosed is a method for making fiber paper. In this method, mineral fibers and PVA resin are blended in water, thus forming first solution. Polymer fibers and PVA resin are blended in water, thus forming second solution. The first solution is mixed with the second solution. A wet paper-making machine is used to make mineral fiber paper from the mixture.

Abstract: A porous soundproof board is fabricated Recycled waste, like slag, is used for fabrication. Slag and ceramics are mixed to be poured into a network foam carrier. Then, the soundproof board is fabricated through sintering. Thus the board fabricated has great added values and is environmental protected with low cost.

Abstract: Disclosed is a method for making fiber paper. In this method, mineral fibers and PVA resin are blended in water, thus forming first solution. Polymer fibers and PVA resin are blended in water, thus forming second solution. The first solution is mixed with the second solution. A wet paper-making machine is used to make mineral fiber paper from the mixture.

Abstract: Slag fiber is used to fabricate a friction material. Friction factor and abrasion loss of the friction material are controlled. The friction material can be used to make linings. Thus, slag fiber can be used as a replace of natural material to make a friction material, and waste is thus recycled.

Abstract: There is disclosed an environmentally friendly method for recovering gold, silver, copper and iron from valuable metal-contained plasma-molten slag. At first, plasma is used to burn the used printed circuit boards, thus producing the slag. Then, the slag is grinded. Then, leaching, crystallization, precipitation, replacement and electric winning are conducted to recover gold, silver, copper and iron.

Abstract: A method is disclosed for recycling precious metal from used printed circuit boards. The used printed circuit boards are roasted with plasma at 800 degrees Celsius for less than 10 minutes, thus producing exhaust and residue that contains the precious metal. The exhaust is treated with an exhaust-treatment system before it is released to the atmosphere. The residue is ground and turned into scraps of a diameter smaller than 2 mm. The scraps are subjected to magnetic separation, thus separating ferromagnetic scraps from non-ferromagnetic scraps. The ferromagnetic scraps are refined. The non-ferromagnetic scraps are screened, thus separating tiny non-ferromagnetic scraps from big non-ferromagnetic scraps. The tiny non-ferromagnetic scraps contain silver and gold. The big non-ferromagnetic scraps contain copper.

Abstract: A semiconductor package substrate proposed by the invention includes a base body and a plurality of finger pads disposed on surface of the base body, wherein the finger pads are arranged in such a way that an angle is formed between connecting line of centers of two adjacent finger pads and the direction in which the finger pads are arranged. The finger pads are waterdrop shaped finger pads with arc ends and angle ends alternately disposed on surface of the substrate, alternately disposed waterdrop shaped finger pads and arc shaped finger pads, or alternately disposed arc shaped finger pads at a predetermined spacing. According to the present invention, distance between adjacent finger pads is reduced and problem of short circuit as a result of erroneous contact between bonding wire and adjacent finger pad is prevented.

Abstract: Incinerator ashes, which is obtained after treating municipal solid waste, incinerator ashes or its plasma vitrified slag is made into mineral fibers. Cullet is added during manufacturing the mineral fibers for conditioning. The mineral fibers thus obtained have a good strength and could raise value of recycled product. In addition, it could reduce impact of the incinerator ashes to the environment and environmental protection is achieved.

Abstract: Incinerator ashes, which is obtained after treating municipal solid waste, incinerator ashes or its plasma vitrified slag is made into mineral fibers. Cullet is added during manufacturing the mineral fibers for conditioning. The mineral fibers thus obtained have a good strength and could raise value of recycled product. In addition, it could reduce impact of the incinerator ashes to the environment and environmental protection is achieved.

Abstract: A semiconductor package substrate proposed by the invention includes a base body and a plurality of finger pads disposed on surface of the base body, wherein the finger pads are arranged in such a way that an angle is formed between connecting line of centers of two adjacent finger pads and the direction in which the finger pads are arranged. The finger pads are waterdrop shaped finger pads with arc ends and angle ends alternately disposed on surface of the substrate, alternately disposed waterdrop shaped finger pads and arc shaped finger pads, or alternately disposed arc shaped finger pads at a predetermined spacing. According to the present invention, distance between adjacent finger pads is reduced and problem of short circuit as a result of erroneous contact between bonding wire and adjacent finger pad is prevented.

Abstract: A semiconductor substrate having a body and a plurality of finger pads formed thereon is disclosed. Each of the finger pads includes two expanding portions respectively and a connecting portion formed therebetween. The finger pads are alternately arranged on the body in a manner that one of the expanding portions of one of the finger pads is disposed in position corresponding to the connecting portion of an adjacent one of the finger pads, so as to reduce pitches between the finger pads horizontally and vertically, provide sufficient spaces for wire bonding, and prevent a wire bonder from mistakenly recognizing a lead trace coupled to the finger pad as another finger pad.