Patents by Inventor Wen-Cheng Tu

Wen-Cheng Tu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a tungsten-plug contact for a semiconductor device
    Patent number: 6020259
    Abstract: A method for forming a tungsten plug is disclosed herein. A TiSi.sub.2 layer is selectively formed in a contact hole by using chemical vapor deposition. Then, a TiN layer is formed on the surface of the contact hole and on the TiSi.sub.2 layer. Next, a tungsten layer is formed on the TiN layer and in the contact hole. A CMP is used to remove a portion of the tungsten layer and TiN layer for planarization.
    Type: Grant
    Filed: May 1, 1997
    Date of Patent: February 1, 2000
    Assignee: Mosel Vitelic, Inc.
    Inventors: Hsi-Chieh Chen, Guan-Jiun Yi, Wen-Cheng Tu, Kuo-Lun Tseng