Patents by Inventor Wen-Cheng Yang

Wen-Cheng Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10145371
    Abstract: Cryogenic pump apparatuses include nanostructure material to achieve an ultra-high vacuum level. The nanostructure material can be mixed with either an adsorbent material or a fixed glue layer which is utilized to fix the adsorbent material. The nanostructure material's good thermal conductivity and adsorption properties help to lower working temperature and extend regeneration cycle of the cryogenic pumps.
    Type: Grant
    Filed: October 22, 2013
    Date of Patent: December 4, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Surendra Babu Anantharaman, Wen-Cheng Yang, Chung-En Kao, Victor Y. Lu, Wei Chin
  • Patent number: 10121698
    Abstract: Semiconductor device metallization systems and methods are disclosed. In some embodiments, a metallization system for semiconductor devices includes a mainframe, and a plurality of modules disposed proximate the mainframe. One of the plurality of modules comprises a physical vapor deposition (PVD) module and one of the plurality of modules comprises an ultraviolet light (UV) cure module.
    Type: Grant
    Filed: January 16, 2017
    Date of Patent: November 6, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Hsiang-Huan Lee, Shau-Lin Shue, Kuang-Kuo Koai, Hai-Ching Chen, Tung-Ching Tseng, Wen-Cheng Yang, Chung-En Kao, Ming-Han Lee, Hsin-Yen Huang
  • Publication number: 20180166285
    Abstract: A method for forming a semiconductor device structure is provided. The method includes disposing a semiconductor substrate in a physical vapor deposition (PVD) chamber. The method also includes introducing a plasma-forming gas into the PVD chamber, and the plasma-forming gas contains an oxygen-containing gas. The method further includes applying a radio frequency (RF) power to a metal target in the PVD chamber to excite the plasma-forming gas to generate plasma. In addition, the method includes directing the plasma towards the metal target positioned in the PVD chamber such that an etch stop layer is formed over the semiconductor substrate.
    Type: Application
    Filed: October 12, 2017
    Publication date: June 14, 2018
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ya-Ling LEE, Shing-Chyang PAN, Keng-Chu LIN, Wen-Cheng YANG, Chih-Tsung LEE, Victor Y. LU
  • Publication number: 20170125290
    Abstract: Semiconductor device metallization systems and methods are disclosed. In some embodiments, a metallization system for semiconductor devices includes a mainframe, and a plurality of modules disposed proximate the mainframe. One of the plurality of modules comprises a physical vapor deposition (PVD) module and one of the plurality of modules comprises an ultraviolet light (UV) cure module.
    Type: Application
    Filed: January 16, 2017
    Publication date: May 4, 2017
    Inventors: Hsiang-Huan Lee, Shau-Lin Shue, Kuang-Kuo Koai, Hai-Ching Chen, Tung-Ching Tseng, Wen-Cheng Yang, Chung-En Kao, Ming-Han Lee, Hsin-Yen Huang
  • Patent number: 9548241
    Abstract: Semiconductor device metallization systems and methods are disclosed. In some embodiments, a metallization system for semiconductor devices includes a mainframe, and a plurality of modules disposed proximate the mainframe. One of the plurality of modules comprises a physical vapor deposition (PVD) module and one of the plurality of modules comprises an ultraviolet light (UV) cure module.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: January 17, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiang-Huan Lee, Shau-Lin Shue, Keith Kuang-Kuo Koai, Hai-Ching Chen, Tung-Ching Tseng, Wen-Cheng Yang, Chung-En Kao, Ming-Han Lee, Hsin-Yen Huang
  • Publication number: 20160360843
    Abstract: A multifunctional suit cover structure contains: a body. The body includes a rear side plate and two front side plates. The rear side plate has an extending part and two grips, the two front side plates are symmetrically connected with the rear side plate, and a first toothed section is arranged around a connection portion of the two front side plates. Each front side plate has at least one first pocket, and a first zipper is pulled along the first toothed section to control a connection and a removal of the two front side plates, two second toothed sections are arranged on two outer sides of the body. Two peripheral pieces are coupled with the body, a third toothed section is formed on an outer side of each peripheral piece, and a second zipper is pulled to control a connection of each second toothed section and the third toothed section.
    Type: Application
    Filed: June 10, 2015
    Publication date: December 15, 2016
    Inventor: Wen-Cheng Yang
  • Patent number: 9472502
    Abstract: Some embodiments relate to a method of manufacturing an integrated circuit device. In this method a dielectric layer is formed over a substrate. The dielectric layer comprises an opening arranged within the dielectric layer. A first cobalt liner is formed along bottom and sidewall surfaces of the opening. A barrier liner is formed on exposed surfaces of the first cobalt liner. A bulk cobalt layer is formed in the opening and over the barrier liner to fill a remaining space of the opening.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: October 18, 2016
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ya-Ling Lee, Wen-Cheng Yang, Victor Y. Lu
  • Publication number: 20160181152
    Abstract: Semiconductor device metallization systems and methods are disclosed. In some embodiments, a metallization system for semiconductor devices includes a mainframe, and a plurality of modules disposed proximate the mainframe. One of the plurality of modules comprises a physical vapor deposition (PVD) module and one of the plurality of modules comprises an ultraviolet light (UV) cure module.
    Type: Application
    Filed: February 29, 2016
    Publication date: June 23, 2016
    Inventors: Hsiang-Huan Lee, Shau-Lin Shue, Keith Kuang-Kuo Koai, Hai-Ching Chen, Tung-Ching Tseng, Wen-Cheng Yang, Chung-En Kao, Ming-Han Lee, Hsin-Yen Huang
  • Patent number: 9318364
    Abstract: Semiconductor device metallization systems and methods are disclosed. In some embodiments, a metallization system for semiconductor devices includes a mainframe, and a plurality of modules disposed proximate the mainframe. One of the plurality of modules comprises a physical vapor deposition (PVD) module and one of the plurality of modules comprises an ultraviolet light (UV) cure module.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: April 19, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiang-Huan Lee, Shau-Lin Shue, Keith Kuang-Kuo Koai, Hai-Ching Chen, Tung-Ching Tseng, Wen-Cheng Yang, Chung-En Kao, Ming-Han Lee, Hsin-Yen Huang
  • Publication number: 20150197849
    Abstract: Semiconductor device metallization systems and methods are disclosed. In some embodiments, a metallization system for semiconductor devices includes a mainframe, and a plurality of modules disposed proximate the mainframe. One of the plurality of modules comprises a physical vapor deposition (PVD) module and one of the plurality of modules comprises an ultraviolet light (UV) cure module.
    Type: Application
    Filed: January 13, 2014
    Publication date: July 16, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsiang-Huan Lee, Shau-Lin Shue, Keith Kuang-Kuo Koai, Hai-Ching Chen, Tung-Ching Tseng, Wen-Cheng Yang, Chung-En Kao, Ming-Han Lee, Hsin-Yen Huang
  • Patent number: 9026241
    Abstract: The present disclosure relates to semiconductor tool monitoring system having multiple sensors configured to concurrently and independently monitor processing conditions of a semiconductor manufacturing tool. In some embodiments, the disclosed tool monitoring system comprises a first sensor system configured to monitor one or more processing conditions of a semiconductor manufacturing tool and to generate a first monitoring response based thereupon. A redundant, second sensor system is configured to concurrently monitor the one or more processing conditions of the manufacturing tool and to generate a second monitoring response based thereupon. A comparison element is configured to compare the first and second monitoring responses, and if the responses deviate from one another (e.g., have a deviation greater than a threshold value) to generate a warning signal. By comparing the first and second monitoring responses, errors in the sensor systems can be detected in real time, thereby preventing yield loss.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: May 5, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Cheng Yang, Chung-En Kao, You-Hua Chou, Ming-Chih Tsai, Chen-Chia Chiang, Bo-Hung Lin, Chin-Hsiang Lin
  • Publication number: 20150107273
    Abstract: Cryogenic pump apparatuses include nanostructure material to achieve an ultra-high vacuum level. The nanostructure material can be mixed with either an adsorbent material or a fixed glue layer which is utilized to fix the adsorbent material. The nanostructure material's good thermal conductivity and adsorption properties help to lower working temperature and extend regeneration cycle of the cryogenic pumps.
    Type: Application
    Filed: October 22, 2013
    Publication date: April 23, 2015
    Inventors: Surendra Babu Anantharaman, Wen-Cheng Yang, Chung-En Kao, Victor Y. Lu, Wei Chin
  • Publication number: 20130226327
    Abstract: The present disclosure relates to semiconductor tool monitoring system having multiple sensors configured to concurrently and independently monitor processing conditions of a semiconductor manufacturing tool. In some embodiments, the disclosed tool monitoring system comprises a first sensor system configured to monitor one or more processing conditions of a semiconductor manufacturing tool and to generate a first monitoring response based thereupon. A redundant, second sensor system is configured to concurrently monitor the one or more processing conditions of the manufacturing tool and to generate a second monitoring response based thereupon. A comparison element is configured to compare the first and second monitoring responses, and if the responses deviate from one another (e.g., have a deviation greater than a threshold value) to generate a warning signal. By comparing the first and second monitoring responses, errors in the sensor systems can be detected in real time, thereby preventing yield loss.
    Type: Application
    Filed: February 24, 2012
    Publication date: August 29, 2013
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Cheng Yang, Chung-En Kao, You-Hua Chou, Ming-Chih Tsai, Chen-Chia Chiang, Bo-Hung Lin, Chin-Hsiang Lin
  • Patent number: 7947430
    Abstract: A method of forming 3D micro structures with high aspect ratios includes the steps of: disposing a mask, which has a plurality of through holes having at least two different sizes, on a substrate to expose the substrate through the through holes; forming a negative photoresist layer on the mask and the substrate; providing a light source to illuminate the negative photoresist layer through the substrate and the through holes of the mask so as to form a plurality of exposed portions and an unexposed portion; and removing the unexposed portion and leaving the exposed portions to form a plurality of pillars each having a bottom portion contacting the substrate and a top portion opposite to the bottom portion. A top area of the top portion is slightly smaller than a bottom area of the bottom portion, and the pillars are allowed to have at least two different heights.
    Type: Grant
    Filed: January 4, 2008
    Date of Patent: May 24, 2011
    Assignee: National Tsing Hua University
    Inventors: Chien-Chung Fu, Heng-Chi Huang, Wen-Cheng Yang
  • Publication number: 20090249665
    Abstract: A winding advertisement curtain on an electric winding door includes a winding unit and a cloth curtain, and the winding unit consists of an upper case, a winding shaft and a spring. The upper case is fixed on an outer surface of an upper case of an electric winding door, and the winding shaft is arranged in the upper case, possible to be counter -rotated by the spring. The cloth curtain, which has advertising patterns or words on its outer surface, has its upper end connected to the winding shaft and possible to be wound around it, and its lower end temporarily attached by sucking the lower end of the slats of the winding door. So the cloth curtain is possible to be pulled down or wound up automatically together with the slats of the winding door, and then the advertising patterns or words become visible when the cloth curtain is closed down, achieving advertising effect.
    Type: Application
    Filed: June 18, 2009
    Publication date: October 8, 2009
    Inventor: Wen-Cheng Yang
  • Publication number: 20080233522
    Abstract: A method of forming 3D micro structures with high aspect ratios includes the steps of: disposing a mask, which has a plurality of through holes having at least two different sizes, on a substrate to expose the substrate through the through holes; forming a negative photoresist layer on the mask and the substrate; providing a light source to illuminate the negative photoresist layer through the substrate and the through holes of the mask so as to form a plurality of exposed portions and an unexposed portion; and removing the unexposed portion and leaving the exposed portions to form a plurality of pillars each having a bottom portion contacting the substrate and a top portion opposite to the bottom portion. A top area of the top portion is slightly smaller than a bottom area of the bottom portion, and the pillars are allowed to have at least two different heights.
    Type: Application
    Filed: January 4, 2008
    Publication date: September 25, 2008
    Inventors: Chien-Chung Fu, Heng-Chi Huang, Wen-Cheng Yang
  • Publication number: 20070186454
    Abstract: A winding advertisement curtain on an electric winding door includes a winding unit and a cloth curtain, and the winding unit consists of an upper case, a winding shaft and a spring. The upper case is fixed on an outer surface of an upper case of an electric winding door, and the winding shaft is arranged in the upper case, possible to be counter-rotated by the spring. The cloth curtain, which has advertising patterns or words on its outer surface, has its upper end connected to the winding shaft and possible to be wound around it, and its lower end temporarily attached by sucking the lower end of the slats of the winding door. So the cloth curtain is possible to be pulled down or wound up automatically together with the slats of the winding door, and then the advertising patterns or words become visible when the cloth curtain is closed down, achieving advertising effect.
    Type: Application
    Filed: February 16, 2006
    Publication date: August 16, 2007
    Inventors: Wen-Cheng Yang, Hsiao-Yen Chou, Chien-Chang Chiu
  • Publication number: 20060176368
    Abstract: A visual watching device for an automobile for detecting the dead angle caused by the front posts and the rear posts includes a camera respectively deposited on the front posts and the rear posts, and a thin display respectively on the front and the rear posts, and a power source supplying the cameras and the displays with electricity. Then the images taken in by the cameras are transmitted to the displays so the driver can directly look at the images showing the traffic condition of the dead angles hidden by the front and the rear posts for taking proper prompt measures for keep safe the automobile and persons on it.
    Type: Application
    Filed: February 7, 2005
    Publication date: August 10, 2006
    Inventors: Wen-Cheng Yang, Hsiao-Yen Chou
  • Publication number: 20050098427
    Abstract: The present disclosure provides a system and method for providing improved film uniformity from an ion metal plasma source. The system includes a deposition chamber and a coil. The coil is comprised of a first metal and includes opposite terminal ends disposed within the deposition chamber. At least one of the opposite terminal ends of the coil is angled less than ninety degrees.
    Type: Application
    Filed: November 11, 2003
    Publication date: May 12, 2005
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jui-Mu Cho, Wen-Cheng Yang, Wen-Jung Yang, Y-Chih Lo, Tay-Lang Huang, Te-Hung Hsieh