Patents by Inventor Wen-Chi Cheng
Wen-Chi Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230403037Abstract: Methods, systems, and apparatus for using antennas for millimeter wave contactless communication. One of the apparatuses is a communication device that includes a transducer configured to convert electrical signals into extremely high frequency (EHF) electromagnetic signals, the EHF electromagnetic signals substantially emitted from a first surface of the communication device, wherein the transducer is positioned on a substrate of the communication device, and an integrated circuit coupled to the substrate, wherein the transducer includes multiple parallel resonant antenna elements in an array.Type: ApplicationFiled: August 28, 2023Publication date: December 14, 2023Inventors: Giriraj Mantrawadi, Bojana Zivanovic, Wen-Chi Cheng
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Publication number: 20230403038Abstract: Methods, systems, and apparatus for using antennas for millimeter wave contactless communication. One of the apparatuses is a communication device that includes a transducer configured to convert electrical signals into extremely high frequency (EHF) electromagnetic signals, the EHF electromagnetic signals substantially emitted from a first surface of the communication device, wherein the transducer is positioned on a substrate of the communication device, and an integrated circuit coupled to the substrate, wherein the transducer includes multiple parallel resonant antenna elements in an array.Type: ApplicationFiled: August 28, 2023Publication date: December 14, 2023Inventors: Giriraj Mantrawadi, Bojana Zivanovic, Wen-Chi Cheng
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Patent number: 11784670Abstract: Methods, systems, and apparatus for using antennas for millimeter wave contactless communication. One of the apparatuses is a communication device that includes a transducer configured to convert electrical signals into extremely high frequency (EHF) electromagnetic signals, the EHF electromagnetic signals substantially emitted from a first surface of the communication device, wherein the transducer is positioned on a substrate of the communication device, and an integrated circuit coupled to the substrate, wherein the transducer includes multiple parallel resonant antenna elements in an array.Type: GrantFiled: March 31, 2021Date of Patent: October 10, 2023Assignee: Molex, LLCInventors: Giriraj Mantrawadi, Bojana Zivanovic, Wen-Chi Cheng
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Publication number: 20220329271Abstract: Methods, systems, and apparatus for using antennas for millimeter wave contactless communication. One of the apparatuses is a communication device that includes a transducer configured to convert electrical signals into extremely high frequency (EHF) electromagnetic signals, the EHF electromagnetic signals substantially emitted from a first surface of the communication device, wherein the transducer is positioned on a substrate of the communication device, and an integrated circuit coupled to the substrate, wherein the transducer includes multiple parallel resonant antenna elements in an array.Type: ApplicationFiled: March 31, 2021Publication date: October 13, 2022Inventors: Giriraj Mantrawadi, Bojana Zivanovic, Wen-Chi Cheng
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Patent number: 10596095Abstract: A method for moisturizing skin using P-113 peptide, which comprises administering to the skin of a subject a composition containing a P-113 peptide, wherein the P-113 peptide comprises the sequence of SEQ ID NO: 1. P-113 peptide is hypoallergenic and non-cytotoxic, which means it does not cause harms or allergies to the skin and can be used as an ingredient of cosmetic products. The P-113 peptide fragment has moisture absorption and moisture retention effects, therefore it can be formulated with other ingredients of moisturizing cosmetic products, enhancing the moisturizing effect of other moisturizing ingredients. In addition, the P-113 peptide fragment is capable of inhibiting the production of MMP-9 and thus decreases collagen degradation, thereby achieving the anti-wrinkle and anti-aging effects. The cosmetic disclosed herein comprises not only the peptide, but also active ingredients of cosmetic products and essence liquid formulations.Type: GrantFiled: February 4, 2016Date of Patent: March 24, 2020Assignee: PACGEN LIFE SCIENCE CORPORATIONInventors: Wen-Chi Cheng, Ming-Sun Liu, Frank Lin
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Patent number: 10183059Abstract: A method for treating a microbial infection in a subject includes administering to the subject a pharmaceutical composition which has a therapeutically effective amount of an antimicrobial peptide containing a derivative of P-113.Type: GrantFiled: July 6, 2017Date of Patent: January 22, 2019Assignee: General Biologicals CorporationInventors: Wen-Chi Cheng, Guan-Yu Lin, Yao-Peng Xue, Chung-Yu Lan, Frank Lin
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Publication number: 20180028426Abstract: The present invention provides a use of a composition in preparing a cosmetic having moisturizing effect, wherein the composition comprises a P-113 peptide, wherein the P-113 peptide comprises the sequence of SEQ ID NO: 1. It is hypoallergenic and non-cytotoxic, which means it does not cause harms or allergies to the skin and can be used as an ingredient of cosmetic products. The P-113 peptide fragment has moisture absorption and moisture retention effects, therefore it can be formulated with other ingredients of moisturizing cosmetic products, enhancing the moisturizing effect of other moisturizing ingredients. In addition, the P-113 peptide fragment is capable of inhibiting the production of MMP-9 and thus decreases collagen degradation, thereby achieving the anti-wrinkle and anti-aging effects. The cosmetic of the present invention comprises not only the peptide, but also active ingredients of cosmetic products and essence liquid formulations.Type: ApplicationFiled: February 4, 2016Publication date: February 1, 2018Applicant: PACGEN LIFE SCIENCE CORPORATIONInventors: Wen-Chi Cheng, Ming-Sun Liu, Frank Lin
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Patent number: 9856302Abstract: An antimicrobial peptide which is a derivative of the peptide P-113. The amino acid sequence of the antimicrobial peptide is SEQ ID NO: 4 or SEQ ID NO: 5, in which the C-terminus is or is not modified with a NH2.Type: GrantFiled: April 27, 2017Date of Patent: January 2, 2018Assignee: GENERAL BIOLOGICALS CORPORATIONInventors: Wen-Chi Cheng, Ming-Sun Liu, Frank Lin, Chung-Yu Lan, Guan-Yu Lin, Hsueh-Fen Chen
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Publication number: 20170319654Abstract: A method for treating a microbial infection in a subject includes administering to the subject a pharmaceutical composition which has a therapeutically effective amount of an antimicrobial peptide containing a derivative of P-113.Type: ApplicationFiled: July 6, 2017Publication date: November 9, 2017Applicant: GENERAL BIOLOGICALS CORPORATIONInventors: Wen-Chi Cheng, Guan-Yu Lin, Yao-Peng Xue, Chung-Yu Lan, Frank Lin
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Publication number: 20170233445Abstract: The present invention provides an antimicrobial peptide, wherein the antimicrobial peptide comprises SEQ ID NO: 4.Type: ApplicationFiled: April 27, 2017Publication date: August 17, 2017Applicant: GENERAL BIOLOGICALS CORPORATIONInventors: Wen-Chi Cheng, Ming-Sun Liu, Frank Lin, Chung-Yu Lan, Guan-Yu Lin, Hsueh-Fen Chen
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Publication number: 20170211131Abstract: The present invention provides a method for evaluating oral health, in particularly for evaluating a risk for suffering from periodontal disease, comprising: (1) providing an oral sample of a subject; (2) detecting at least two indicator microbes in the oral sample; and (3) analyzing amounts of the at least two indicator microbes; wherein when each of the amounts of the at least two indicator microbes is higher than a standard value for an amount of a corresponding indicator microbe, it indicates that the subject has a high risk for suffering from periodontal disease.Type: ApplicationFiled: November 2, 2016Publication date: July 27, 2017Applicant: GENERAL BIOLOGICALS CORPORATIONInventors: Wen-Chi Cheng, YI-RU CHANG, YU-SHAN WEI, Ming-Sun Liu, HONG-LIN CHAN, Frank Lin
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Publication number: 20170022256Abstract: The present invention provides an anti-bacterial peptide which has anti-fungal and anti-bacterial effect. The anti-bacterial peptide is a novel peptide sequence, wherein the peptide sequence comprises a sequence of at least two SEQ ID NO: 1. The present invention also provides a method for treating a subject infected with a fungus and a bacterium, which comprises providing the subject with an anti-bacterial peptide, wherein the anti-bacterial peptide comprises a sequence of at least two SEQ ID NO: 1.Type: ApplicationFiled: June 6, 2016Publication date: January 26, 2017Applicant: GENERAL BIOLOGICALS CORPORATIONInventors: Wen-Chi Cheng, Ming-Sun Liu, Frank Lin, Chung-Yu Lan, Guan-Yu Lin, Hsueh-Fen Chen
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Patent number: 9117697Abstract: The present disclosure relates to a semiconductor substrate and a method for making the same. The semiconductor substrate includes an insulation layer, a first circuit layer, a second circuit layer, a plurality of conductive vias and a plurality of bumps. The first circuit layer is embedded in a first surface of the insulation layer, and exposed from the first surface of the insulation layer. The second circuit layer is located on a second surface of the insulation layer and electrically connected to the first circuit layer through the conductive vias. The bumps are directly located on part of the first circuit layer, where the lattice of the bumps is the same as that of the first circuit layer.Type: GrantFiled: June 12, 2014Date of Patent: August 25, 2015Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Chun-Che Lee, Yuan-Chang Su, Wen-Chi Cheng, Guo-Cheng Liao, Yi-Chuan Ding
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Publication number: 20140367837Abstract: The present disclosure relates to a semiconductor substrate and a method for making the same. The semiconductor substrate includes an insulation layer, a first circuit layer, a second circuit layer, a plurality of conductive vias and a plurality of bumps. The first circuit layer is embedded in a first surface of the insulation layer, and exposed from the first surface of the insulation layer. The second circuit layer is located on a second surface of the insulation layer and electrically connected to the first circuit layer through the conductive vias. The bumps are directly located on part of the first circuit layer, where the lattice of the bumps is the same as that of the first circuit layer.Type: ApplicationFiled: June 12, 2014Publication date: December 18, 2014Inventors: Chun-Che LEE, Yuan-Chang SU, Wen-Chi CHENG, Guo-Cheng LIAO, Yi-Chuan DING
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Patent number: 8175860Abstract: A method of identifying a drug candidate to a target protein for inhibiting shikimate pathway comprising (a) performing a molecular program for computing a molecule conformation and orientation relative to an active site of the target protein and selecting top-rank molecules, (b) generating protein-molecule interacting profiles and identifying conserved interactions and pharmacophore spots, (c) developing homologous pharmacophore models for identifying pharmacophore hot spots, (d) rescoring molecules selected from step (a) by their homologous pharmacophore scores, (e) selecting potential molecules having the highest homologous pharmacophore scores, and (f) acquiring corresponding real compounds of the potential molecules selected from step (c) and identifying their inhibitory activity on the target protein by bioassay.Type: GrantFiled: May 27, 2009Date of Patent: May 8, 2012Assignee: National Tsing Hua UniversityInventors: Wen-Ching Wang, Wen-Chi Cheng, Jinn-Moon Yang
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Publication number: 20100305152Abstract: The shikimate pathway links metabolism of carbohydrates to biosynthesis of aromatic compounds, which is an attractive target for the rational drug and herbicide design because it is essential in algae, higher plants, bacteria, and fungi, but absent from mammals. Thus, the present invention provides a method of inhibiting the growth of bacteria or fungi, especially Helicobacter pylori, through inhibiting enzymes in the shikimate pathway.Type: ApplicationFiled: May 27, 2009Publication date: December 2, 2010Applicant: NATIONAL TSING HUA UNIVERSITYInventors: WEN-CHING WANG, WEN-CHI CHENG, JINN-MOON YANG
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Patent number: 7812431Abstract: A leadframe includes a die pad and a plurality of leads corresponding to the die pad. The die pad for supporting a die is formed with a plurality of sides, each of the sides having at least one recess portion and at least one protrusion portion. The leads are substantially coplanar to the die pad. The leads include a plurality of first leads and a plurality of second leads. The first leads extend into the recess portions respectively, and the second leads are aligned with the protrusion portions. The length of the first leads is greater than that of the second leads. The length of wires electrically connecting the die to the leads or the die pad can be adjusted by the sides of the leadframe with the recess portion and the protrusion portion having a dimension corresponding to the leads, so as to save the manufacture cost of the leadframe.Type: GrantFiled: June 5, 2008Date of Patent: October 12, 2010Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Su-Tai Yang, Kuang-Chun Chou, Wen-Chi Cheng
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Publication number: 20090292992Abstract: A switching method includes: when a control unit receives a first command signal and determines that a host computing device is turned off and a power source is disabled, configuring the control unit to operate a switch unit in a first switch state and to enable the power source, thereby enabling audio and video playback of the host computing device; and when the control unit receives a second command signal and determines that the host computing device is turned off and the power source is disabled, configuring the control unit to operate the switch unit in a second switch state and to enable the power source, thereby enabling audio and video playback of an audio-and-video reproducing device. A computer system that includes the control unit, the host computing device, the power source, the switch unit, and the audio-and-video reproducing device is also disclosed.Type: ApplicationFiled: July 30, 2009Publication date: November 26, 2009Applicant: MICRO-STAR INTERNATIONAL CO., LTDInventors: Wen-Chi CHENG, Chung-Wen Chen
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Publication number: 20080303128Abstract: A leadframe includes a die pad and a plurality of leads corresponding to the die pad. The die pad for supporting a die is formed with a plurality of sides, each of the sides having at least one recess portion and at least one protrusion portion. The leads are substantially coplanar to the die pad. The leads include a plurality of first leads and a plurality of second leads. The first leads extend into the recess portions respectively, and the second leads are aligned with the protrusion portions. The length of the first leads is greater than that of the second leads. The length of wires electrically connecting the die to the leads or the die pad can be adjusted by the sides of the leadframe with the recess portion and the protrusion portion having a dimension corresponding to the leads, so as to save the manufacture cost of the leadframe.Type: ApplicationFiled: June 5, 2008Publication date: December 11, 2008Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Su-Tai Yang, Kuang-Chun Chou, Wen-Chi Cheng