Abstract: A method includes bonding a first wafer to a second wafer, with a first plurality of dielectric layers in the first wafer and a second plurality of dielectric layers in the second wafer bonded between a first substrate of the first wafer and a second substrate in the second wafer. A first opening is formed in the first substrate, and the first plurality of dielectric layers and the second wafer are etched through the first opening to form a second opening. A metal pad in the second plurality of dielectric layers is exposed to the second opening. A conductive plug is formed extending into the first and the second openings.

Abstract: A semiconductor device package includes: (1) a substrate having a first surface; (2) a waveguide disposed in the substrate; and (3) an optical device including: (a) a first portion extending into the substrate and not extending beyond the first surface of the substrate, and (b) a second portion extending along the first surface of the substrate, wherein the second portion of the optical device comprises a protrusion and the substrate defines a groove extending from the first surface of the substrate, and wherein the protrusion of the second portion of the optical device engages with the groove of the substrate.

Abstract: A semiconductor device package includes: (1) a substrate having a first surface; (2) a waveguide disposed in the substrate; and (3) an optical device including: (a) a first portion extending into the substrate and not extending beyond the first surface of the substrate, and (b) a second portion extending along the first surface of the substrate, wherein the second portion of the optical device comprises a protrusion and the substrate defines a groove extending from the first surface of the substrate, and wherein the protrusion of the second portion of the optical device engages with the groove of the substrate.

Abstract: A semiconductor device package includes a substrate and an optical device. The optical device includes a first portion extending into the substrate and not extending beyond a first surface of the substrate. The optical device further includes a second portion extending along the first surface of the substrate.

Abstract: A semiconductor device package includes a substrate, electronic components disposed over a surface of the substrate, an encapsulant encapsulating the electronic components, and a conductive compartment structure. The conductive compartment structure separates at least one first electronic component from at least one second electronic component. The conductive compartment structure includes a first portion and a second portion, the second portion includes a first end connected to the first portion and a second end exposed from a lateral surface of the encapsulant, and a width of the second portion is less than a width of the first portion.

Abstract: A semiconductor device package includes a substrate and an optical device. The optical device includes a first portion extending into the substrate and not extending beyond a first surface of the substrate. The optical device further includes a second portion extending along the first surface of the substrate.

Abstract: A heat dissipation module configured on a substrate having a heat producing element thereon includes a holder configured on the substrate and a heat sink having a base opposite to the heat producing element and pivotally connected to the holder and capable of joining to the substrate with the heat producing element covered by the base.

Abstract: A heat dissipation module configured on a substrate having a heat producing element thereon includes a holder configured on the substrate and a heat sink having a base opposite to the heat producing element and pivotally connected to the holder and capable of joining to the substrate with the heat producing element covered by the base.

Abstract: A direct-type backlight module is disclosed, which includes a frame, at least one lamp support structure, at least one lamp and a diffusion plate. The frame has a bottom plate, and at least one opening is disposed in the bottom plate. The lamp support structure including a base and at least one holding and fixing member is fixed in the opening, wherein the base is disposed outside the bottom plate of the frame, and the holding and fixing member is disposed on the base and through the opening. The holding and fixing member has a lamp holding portion and a fixing portion, wherein the fixing portion is fixed in the opening, and the lamp holding portion is suitable for holding the lamp. The diffusion plate is disposed above the lamp.

Abstract: A circuit capable of updating the power supply specification of microprocessor and a method thereof are proposed. The circuit is disposed on a computer motherboard, and makes use of downloaded program data of the power supply specification of a new microprocessor a microprocessor is updated. The circuit uses a programmable memory IC to execute the program data of the power supply specification for automatically updating and modifying the required power supply specification of the microprocessor. Through a PWM control unit, a drive unit and a power switch, the required power supply specification of a new microprocessor can be provided for the microprocessor to perform boot actions.

Abstract: A volatile storage device and a serial mixed storage system having the same are provided. The system includes an access controller, a data transmission interface, a volatile storage module, a power supply module, an expansion interface and a non-volatile storage module. The volatile storage module and non-volatile storage module are connected in series via the expansion interface. The volatile storage module and the non-volatile storage module can be used to store data under the control of the access controller. Further, the power supply module can supply the stored electric power to the access controller, volatile storage module, and non-volatile storage module, so as to keep data stored in the volatile storage module or transfer the data to the non-volatile storage module, thereby avoiding data loss caused by power cutoff.

Abstract: An operating method is disclosed for dynamic physical network layer monitoring. A plurality of built-in or extended network interface cards in a computer are to be merged or separated for multitasking operation, redundancy or any emergent application through continuously monitoring the network status. The network devices connected with the computer are checked after switching the computer on in the first step. Next, the drivers thereof are loaded to activate and initialize the network devices, and the connection therebetween is established. Afterward, the method further includes determining whether the devices need to be re-activated by continuously monitoring the network status.

Abstract: A surround sound system includes a pair of front speakers, a pair of surround speakers, a pair of reflective elements and a control unit. The front speakers are positioned in front of a listener location. The surround speakers are positioned in front of the listener location for outputting directed sound columns. The reflective elements are positioned in rear of the listener location for receiving the directed sound columns of the surround speakers and then reflecting to the listener location. The control unit is electrically connected to the front speakers and the surround speakers, thereby to delay output of forward sound signals of the front speakers.

Abstract: An image display device and a method thereof are proposed to solve the problem of bad image processing performance of existent image display devices. The image display device comprises an image processing controller, a transmission interface for input of an image signal, a plurality of graphics processing unit for graphics acceleration, an image memory for storing the image signal, and a video signal generating module for providing a video signal to a display device. The graphics processing units respectively process the image signal in the image memory so that the image processing controller can control the video signal generating module to perform image modulation to the image signal according to the operation results of the graphics processing units. The video signal generating module then generates a video signal for output. Through these graphics processing units, the whole performance can be enhanced.

Abstract: A circuit capable of updating the power supply specification of microprocessor and a method thereof are proposed. The circuit is disposed on a computer motherboard, and makes use of downloaded program data of the power supply specification of a new microprocessor a microprocessor is updated. The circuit uses a programmable memory IC to execute the program data of the power supply specification for automatically updating and modifying the required power supply specification of the microprocessor. Through a PWM control unit, a drive unit and a power switch, the required power supply specification of a new microprocessor can be provided for the microprocessor to perform boot actions.

Abstract: A security system installed in the casing of a computer to detect the condition of the casing of the computer, the security system including a switch which is switched on when the casing of the computer is opened, or switched off when the casing of the computer is closed, and a logic circuit connected to the switch and triggered by the switch to output an alarm signal to a burglar alarm when the casing of the computer is opened.