Abstract: A semiconductor device includes a first region and a second region, and the second region surrounds the first region. The semiconductor device includes at least one electronic unit, a redistribution structure, a plurality of first pads, and a plurality of second pads. The redistribution structure may be electrically connected to at least one electronic unit. A plurality of first pads are arranged on the redistribution structure and correspondingly to the first region. There is a first pitch between two adjacent first pads. A plurality of second pads are arranged on the redistribution structure and correspondingly to the second region. There is a second pitch between two adjacent second pads, so that the first pitch is smaller than the second pitch.

Abstract: A semiconductor device includes a substrate, a bottom electrode, a ferroelectric layer, a noble metal electrode, and a non-noble metal electrode. The bottom electrode is over the substrate. The ferroelectric layer is over the bottom electrode. The noble metal electrode is over the ferroelectric layer. The non-noble metal electrode is over the noble metal electrode.

Abstract: The present invention discloses a method for assembling a camera module. The method includes putting plural conductive bumps on a conductive contact of a substrate such that a large conductive bump is formed, and pressing the substrate and an image chip together such that the conductive contact contacts with a pad formed on the image chip through the large conductive bump to combine the conductive contact and the pad. Since there is no contact between the substrate and the image chip but the large conductive bump, the method decreases the probability for fracture between the substrate and the image chip and improves the quality of the camera module.

Abstract: An optical image system includes an image pickup module, a swinging mechanism, a first swinging calibration element and a second swinging calibration element. When the optical image system is tilted because of handshaking, the image pickup module is swung by the swinging mechanism. At the same time, the first swinging calibration element and the second swinging calibration element detect whether the image pickup module is swung to an ideal position where the handshaking problem is eliminated.

Abstract: The present invention discloses a method for assembling a camera module. The method includes putting plural conductive bumps on a conductive contact of a substrate such that a large conductive bump is formed, and pressing the substrate and an image chip together such that the conductive contact contacts with a pad formed on the image chip through the large conductive bump to combine the conductive contact and the pad. Since there is no contact between the substrate and the image chip but the large conductive bump, the method decreases the probability for fracture between the substrate and the image chip and improves the quality of the camera module.

Abstract: An optical image system includes an image pickup module, a swinging mechanism, a first swinging calibration element and a second swinging calibration element. When the optical image system is tilted because of handshaking, the image pickup module is swung by the swinging mechanism. At the same time, the first swinging calibration element and the second swinging calibration element detect whether the image pickup module is swung to an ideal position where the handshaking problem is eliminated.

Abstract: A radiator grille having two vertical end walls, two longitudinal series of openings respectively formed on the two vertical end walls, and a plurality of channel tile-like grille portions arranged in parallel between the vertical end walls and formed integral with one another, the channel tile-like grille portions having transversely extended openings for enabling the radiator grille to be curved for easy installation in any of a variety of motor vehicles.