Patents by Inventor Wen-Chi Shih

Wen-Chi Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8510938
    Abstract: The present invention discloses a method for assembling a camera module. The method includes putting plural conductive bumps on a conductive contact of a substrate such that a large conductive bump is formed, and pressing the substrate and an image chip together such that the conductive contact contacts with a pad formed on the image chip through the large conductive bump to combine the conductive contact and the pad. Since there is no contact between the substrate and the image chip but the large conductive bump, the method decreases the probability for fracture between the substrate and the image chip and improves the quality of the camera module.
    Type: Grant
    Filed: November 22, 2010
    Date of Patent: August 20, 2013
    Assignee: Primax Electronics, Ltd.
    Inventors: Chien-Nan Yu, Chung-Feng Tsao, Hang-Kau Khor, Wen-Chi Shih, Ying-Chieh Chen, Yu-Hsiao Li
  • Patent number: 8319839
    Abstract: An optical image system includes an image pickup module, a swinging mechanism, a first swinging calibration element and a second swinging calibration element. When the optical image system is tilted because of handshaking, the image pickup module is swung by the swinging mechanism. At the same time, the first swinging calibration element and the second swinging calibration element detect whether the image pickup module is swung to an ideal position where the handshaking problem is eliminated.
    Type: Grant
    Filed: December 3, 2010
    Date of Patent: November 27, 2012
    Assignee: Primax Electronics Ltd.
    Inventors: Li-Pen Lin, Kuang-Che Chen, Wen-Chi Shih, Ying-Shou Chen
  • Publication number: 20120084976
    Abstract: The present invention discloses a method for assembling a camera module. The method includes putting plural conductive bumps on a conductive contact of a substrate such that a large conductive bump is formed, and pressing the substrate and an image chip together such that the conductive contact contacts with a pad formed on the image chip through the large conductive bump to combine the conductive contact and the pad. Since there is no contact between the substrate and the image chip but the large conductive bump, the method decreases the probability for fracture between the substrate and the image chip and improves the quality of the camera module.
    Type: Application
    Filed: November 22, 2010
    Publication date: April 12, 2012
    Applicant: PRIMAX ELECTRONICS LTD.
    Inventors: Chien-Nan Yu, Chung-Feng Tsao, Hang-Kau Khor, Wen-Chi Shih, Ying-Chieh Chen, Yu-Hsiao Li
  • Publication number: 20120044368
    Abstract: An optical image system includes an image pickup module, a swinging mechanism, a first swinging calibration element and a second swinging calibration element. When the optical image system is tilted because of handshaking, the image pickup module is swung by the swinging mechanism. At the same time, the first swinging calibration element and the second swinging calibration element detect whether the image pickup module is swung to an ideal position where the handshaking problem is eliminated.
    Type: Application
    Filed: December 3, 2010
    Publication date: February 23, 2012
    Applicant: PRIMAX ELECTRONICS LTD.
    Inventors: Li-Pen Lin, Kuang-Che Chen, Wen-Chi Shih, Ying-Shou Chen
  • Publication number: 20030000753
    Abstract: A radiator grille having two vertical end walls, two longitudinal series of openings respectively formed on the two vertical end walls, and a plurality of channel tile-like grille portions arranged in parallel between the vertical end walls and formed integral with one another, the channel tile-like grille portions having transversely extended openings for enabling the radiator grille to be curved for easy installation in any of a variety of motor vehicles.
    Type: Application
    Filed: June 28, 2001
    Publication date: January 2, 2003
    Inventor: Wen Chi Shih