Abstract: A card edge connector includes: a connector base having a card slot and plural terminals; a latch located at one end of the connector base for locking a card; and a releasing member. The releasing member includes two levers and a moving member, the levers are connected with the connector base in a pivoting manner, a first end of the lever is connected with the latch and an opposite second end of the lever is coupled to the moving member, wherein when the card is inserted into the slot and presses against the moving member downwards, the moving member drives the second ends of the levers to move downward, resulting in the first ends moving upwards to push the latch to lock with the card, and when the card is pulled out the moving member resets and drives the levers to release the latch from the card.

Abstract: A method of fabricating a semiconductor device includes the following steps. A plurality of doped regions are formed in a substrate. A first dielectric layer is formed on the substrate. A plurality of first contacts and second contacts are formed in the first dielectric layer to be connected to the plurality of doped regions. A memory element is formed on the first dielectric layer. The memory element is electrically connected to the second contact. A second dielectric layer is formed on the first dielectric layer. The second dielectric layer surrounds the memory element. A conductive line is formed in the second dielectric layer. A top surface of the conductive line is at a same level as a top surface of the memory element, and the conductive line is electrically connected to the plurality of first contacts.

Abstract: In an embodiment, an interposer has a first side, a first integrated circuit device attached to the first side of the interposer with a first set of conductive connectors, each of the first set of conductive connectors having a first height, a first die package attached to the first side of the interposer with a second set of conductive connectors, the second set of conductive connectors including a first conductive connector and a second conductive connector, the first conductive connector having a second height, the second conductive connector having a third height, the third height being different than the second height, a first dummy conductive connector being between the first side of the interposer and the first die package, an underfill disposed beneath the first integrated circuit device and the first die package, and an encapsulant disposed around the first integrated circuit device and the first die package.

Abstract: A teleconferencing system includes a system housing, a speaker enclosure configured within the system housing, a speaker mounted to the speaker enclosure, and one or more damping elements coupling the speaker enclosure to the system housing. The one or more damping elements suspend the speaker enclosure within the system housing such that the speaker enclosure is isolated and separated from the system. In some cases, the one or more damping elements provide the only structural coupling between the speaker enclosure and the system housing. The damping elements are laterally attached directly to the speaker housing with a resilient element.

Abstract: A light-emitting diode includes a semiconductor light-emitting stack and a distributed Bragg reflector (DBR) structure. The semiconductor light-emitting stack has a first surface and a second surface opposite to each other. The DBR structure is disposed on one of the first surface and the second surface of the semiconductor light-emitting stack, and includes at least one set of light-transmitting layers including at least two of the light-transmitting layers which have different refractive indices and roughened interface.

Abstract: A light-emitting diode includes a semiconductor light-emitting stack and a distributed Bragg reflector (DBR) structure. The semiconductor light-emitting stack has a first surface and a second surface opposite to each other. The DBR structure is disposed on one of the first surface and the second surface of the semiconductor light-emitting stack, and includes at least one set of first light-transmitting layers and at least one set of second light-transmitting layers stacked on each other in the first direction. The first light-transmitting layers has interface roughness greater than that of the second light-transmitting layers.

Abstract: A composition for improving the solubility of poorly soluble substances is provided. The composition for improving the solubility of poorly soluble substances includes 60-97% by weight of cyclodextrin and/or a derivative thereof, 0.5-4% by weight of at least one water-soluble polymer and 0.4-30% by weight of at least one water-soluble stabilizer, wherein the at least one water-soluble stabilizer includes caffeine, and wherein the poorly soluble substance is a tyrosine kinase inhibitor.

Abstract: A composition for improving the solubility of poorly soluble substances is provided. The composition includes about 40-99.5% by weight of cyclodextrin and/or derivatives thereof; about 0.05-10% by weight of at least one water-soluble polymer; and about 0.05-60% by weight of at least one water-soluble stabilizer.

Abstract: A light-emitting device includes a substrate and an epitaxial unit. The substrate has a first and a second surface. The substrate is formed on the first surface with a plurality of protrusions. The epitaxial unit includes a first semiconductor layer, an active layer, and a second semiconductor layer that are sequentially disposed on the first surface of the substrate. The first surface of the substrate has a first area that is not covered by the epitaxial unit, and a second area this is covered by the epitaxial unit. A height difference (h2) between the first area and the second area is no greater than 1 ?m. A display apparatus and a lighting apparatus are also disclosed.

Abstract: A light emitting diode device includes a substrate having a substrate surface, an epitaxial structure having an epitaxial surface opposite to the substrate surface, and a plurality of bridging electrodes disposed on the epitaxial surface. The epitaxial structure includes first, second and third light emitting units spacedly and sequentially disposed on the substrate surface. A projection of the second light emitting unit has a first edge and a second edge that is connected with and perpendicular to the first edge. The epitaxial surface has an operating zone on the second light emitting unit that is adapted to be pushed by an ejector pin. A length of the second edge is equal to or greater than a diameter of the operating zone.

Abstract: A contact lens with sustained-release property is provided. The contact lens includes a polymer, pseudorotaxane embedded in the polymer, and a stabilizer embedded in the pseudorotaxane. The polymer is polymerized by monomer materials. The monomer materials include ethyl methacrylate, ethylene glycol dimethacrylate, methacrylic acid, 2-hydroxyethyl methacrylate, or a combination thereof. The stabilizer includes surfactant, amino acid with a polar side chain, oligopeptide containing at least one amino acid with a polar side chain, purine or its derivative, or a combination thereof.

Abstract: A light-emitting diode includes a semiconductor light-emitting stack and a distributed Bragg reflector (DBR) structure. The semiconductor light-emitting stack has a first surface and a second surface opposite to each other. The DBR structure is disposed on one of the first surface and the second surface of the semiconductor light-emitting stack, and includes at least one set of first light-transmitting layers and at least one set of second light-transmitting layers stacked on each other in the first direction. The first light-transmitting layers has interface roughness greater than that of the second light-transmitting layers.

Abstract: A composition for improving the solubility of poorly soluble substances is provided. The composition includes about 40-99.5% by weight of cyclodextrin and/or derivatives thereof; about 0.05-10% by weight of at least one water-soluble polymer; and about 0.05-60% by weight of at least one water-soluble stabilizer.