Patents by Inventor Wen-Chia Liu

Wen-Chia Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250072295
    Abstract: A method of fabricating a semiconductor device includes the following steps. A plurality of doped regions are formed in a substrate. A first dielectric layer is formed on the substrate. A plurality of first contacts and second contacts are formed in the first dielectric layer to be connected to the plurality of doped regions. A memory element is formed on the first dielectric layer. The memory element is electrically connected to the second contact. A second dielectric layer is formed on the first dielectric layer. The second dielectric layer surrounds the memory element. A conductive line is formed in the second dielectric layer. A top surface of the conductive line is at a same level as a top surface of the memory element, and the conductive line is electrically connected to the plurality of first contacts.
    Type: Application
    Filed: November 13, 2024
    Publication date: February 27, 2025
    Applicant: Winbond Electronics Corp.
    Inventors: Wen-Chia Ou, Chih-Chao Huang, Min-Chih Wei, Yu-Ting Chen, Chi-Ching Liu
  • Patent number: 8090969
    Abstract: A circuit includes a primary transceiver, a secondary transceiver, and control logic. The primary transceiver communicates information via a primary communication link. The secondary transceiver communicates information via a secondary communication link. The control logic is operatively coupled to the primary and secondary transceivers. The control logic selectively powers down the primary transceiver based on primary communication link traffic trigger information and causes communication using the secondary transceiver instead of the primary transceiver based on the primary communication link traffic trigger information.
    Type: Grant
    Filed: August 29, 2007
    Date of Patent: January 3, 2012
    Assignee: ATI Technologies ULC
    Inventors: Salem Emara, Joel D. Wilke, William W. L. Hui, Wen-Chia Liu
  • Publication number: 20090061918
    Abstract: A circuit includes a primary transceiver, a secondary transceiver, and control logic. The primary transceiver communicates information via a primary communication link. The secondary transceiver communicates information via a secondary communication link. The control logic is operatively coupled to the primary and secondary transceivers. The control logic selectively powers down the primary transceiver based on primary communication link traffic trigger information and causes communication using the secondary transceiver instead of the primary transceiver based on the primary communication link traffic trigger information.
    Type: Application
    Filed: August 29, 2007
    Publication date: March 5, 2009
    Applicant: ATI Technologies ULC
    Inventors: Salem Emara, Joel D. Wilke, William W.L. Hui, Wen-Chia Liu