Patents by Inventor Wen-Chieh Lai

Wen-Chieh Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230192501
    Abstract: The present invention relates to silicon-based powders and a method for producing the silicon-based powders. The method for producing the silicon-based powders includes a hydrolysis step of a silicon precursor having an alkoxy group, a condensation step and a drying step. By a specific weight ratio of water to the silicon precursor having the alkoxy group and a silicon precursor having a secondary amino group and an alkyl group, in the method for producing the silicon-based powders, the condensation step can be performed without organic solvents, and a modification on silicon-based gels can be performed to enhance a safety of processes and a hydrophobicity of the resulted silicon-based powders, and decrease a thermal conductivity and a bulk density of the resulted silicon-based powders.
    Type: Application
    Filed: December 16, 2022
    Publication date: June 22, 2023
    Inventors: Wen-Bee KUO, Ming-Hung CHENG, Wan-Tun HUNG, Yu-Cheng CHEN, Wen-Hung TSENG, Kuo-Ming HUANG, Wen-Chieh LAI, Shang-Shih LI, Wen-Yuan CHEN, Hsin TSENG, Hsun-Ku LEE, Yu-Hsin CHEN
  • Publication number: 20230192541
    Abstract: The present invention relates to a fiber composite material and a method for producing the fiber composite material. The method for producing the fiber composite material includes a hydrolysis step of a silicon precursor having an alkoxy group, an in-situ condensation step and a drying step. A specific silicon precursor having a secondary amino group and alkyl groups is used therein, as well as a specific weight ratio of the silicon precursor to a fiber material, the in-situ condensation step can be performed in the absence of organic solvents in the method for producing the fiber composite material, and a hydrophobic modification on silicon-based gels can be performed, thereby simplifying the process, decreasing a thermal conductivity of the resulted fiber composite material and preventing drop dust of the resulted fiber composite material.
    Type: Application
    Filed: December 13, 2022
    Publication date: June 22, 2023
    Inventors: Wen-Bee KUO, Ming-Hung CHENG, Wan-Tun HUNG, Yu-Cheng CHEN, Wen-Hung TSENG, Kuo-Ming HUANG, Wen-Chieh LAI, Shang-Shih LI, Wen-Yuan CHEN, Hsin TSENG, Hsun-Ku LEE, Yu-Hsin CHEN
  • Patent number: 8861687
    Abstract: An integrated hybrid circuit includes a transmission unit, a transceiver coil, a transceiver circuit, a hybrid matching circuit, and a receiving circuit. The transmission unit generates a pair of upstream signals according to a user transmission signal. The transceiver coil transmits the pair of upstream signals to a central office through a pair of twisted pair, and receiving a pair of downstream signals from the central office through the pair of twisted pair. The hybrid matching circuit receives an adjustment signal to adjust selective impedances. The receiving circuit receives the pair of downstream signals from the central office, and generates the adjustment signal according to downstream and upstream rates and signals from the hybrid matching circuit. The transmission unit adjusts transmission power and bandwidth of the transmission unit and the receiving unit adjusts filter bandwidth of the receiving unit according to the adjustment signal for optimizing upstream and downstream rates.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: October 14, 2014
    Assignee: Realtek Semiconductor Corp.
    Inventors: Cheng-Hsien Li, Wen-Chieh Lai, Chih-Chiang Liao
  • Publication number: 20140010356
    Abstract: An integrated hybrid circuit includes a transmission unit, a transceiver coil, a transceiver circuit, a hybrid matching circuit, and a receiving circuit. The transmission unit generates a pair of upstream signals according to a user transmission signal. The transceiver coil transmits the pair of upstream signals to a central office through a pair of twisted pair, and receiving a pair of downstream signals from the central office through the pair of twisted pair. The hybrid matching circuit receives an adjustment signal to adjust selective impedances. The receiving circuit receives the pair of downstream signals from the central office, and generates the adjustment signal according to downstream and upstream rates and signals from the hybrid matching circuit. The transmission unit adjusts transmission power and bandwidth of the transmission unit and the receiving unit adjusts filter bandwidth of the receiving unit according to the adjustment signal for optimizing upstream and downstream rates.
    Type: Application
    Filed: July 8, 2013
    Publication date: January 9, 2014
    Inventors: Cheng-Hsien Li, Wen-Chieh Lai, Chih-Chiang Liao