Abstract: The subject disclosure relates to a system and method for testing units-under-test (UUT) with a thermal shock. The thermal shock testing system can include a chamber having an inlet and an outlet, the chamber being configured to provide a thermal shock to a unit-under-test (UUT), a pump configured to fluidly connect to the inlet of the chamber and direct a temperature controlled liquid through a channel embedded in the chamber, and a boiler and a chiller fluidly connected to the pump, the temperature of the liquid being controlled by at least one valve configured to alternatively direct hot or cold fluid to the inlet of the chamber.

Abstract: The subject disclosure relates to a system and method for testing units-under-test (UUT) with a thermal shock. The thermal shock testing system can include a chamber having an inlet and an outlet, the chamber being configured to provide a thermal shock to a unit-under-test (UUT), a pump configured to fluidly connect to the inlet of the chamber and direct a temperature controlled liquid through a channel embedded in the chamber, and a boiler and a chiller fluidly connected to the pump, the temperature of the liquid being controlled by at least one valve configured to alternatively direct hot or cold fluid to the inlet of the chamber.

Abstract: An example automated driving system computer can include a board, one or more processors coupled to the board, a first layer of a first thermal interface material applied on the one or more processors, a heat spreader having a first side and a second side, the first side in contact with the first layer of the first thermal interface material, a second layer of a second thermal interface material applied on the second side of the heat spreader, and a cold plate in contact with the second layer of the second thermal interface material.

Abstract: The subject disclosure relates to a system and method for testing units-under-test (UUT) with a thermal shock. The thermal shock testing system can include a chamber having an inlet and an outlet, the chamber being configured to provide a thermal shock to a unit-under-test (UUT), a pump configured to fluidly connect to the inlet of the chamber and direct a temperature controlled liquid through a channel embedded in the chamber, and a boiler and a chiller fluidly connected to the pump, the temperature of the liquid being controlled by at least one valve configured to alternatively direct hot or cold fluid to the inlet of the chamber.

Abstract: There is provided a heat dissipating device. An exemplary heat dissipating device comprises a thermally conductive plate that is adapted to be disposed adjacent to at least one heat generating device. The thermally conductive plate has surface features configured to promote turbulent airflow over the thermally conductive plate, the thickness of the surface features being approximately equal to or less than the thickness of the plate.

Abstract: There is provided a heat dissipating device. An exemplary heat dissipating device comprises a thermally conductive plate that is adapted to be disposed adjacent to at least one heat generating device. The thermally conductive plate has surface features configured to promote turbulent airflow over the thermally conductive plate, the thickness of the surface features being approximately equal to or less than the thickness of the plate.