Patents by Inventor Wen-Chieh Wei

Wen-Chieh Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090136073
    Abstract: A microphone having a first shell with a cavity region is disclosed. A PCB and a sound receiving member are mounted within the cavity region. A brace is disposed over the cavity region having opposite ribs located against two opposite sides of the PCB. A push button is operably mounted on the brace and is adapted to be moveably operated to actuate the PCB ON or OFF.
    Type: Application
    Filed: November 27, 2007
    Publication date: May 28, 2009
    Inventors: Ching-Wen Chang, Fang-Chang Hsieh, Wen-Chieh Wei
  • Publication number: 20080083957
    Abstract: A micro-electromechanical system package includes a substrate, a group of components, isolative stuff and a conductive shield. The substrate is made with an upper face and a lower face. The group is mounted on the upper face of the substrate. The isolative stuff seals the group and the upper face of the substrate, thus protecting the group from moisture. The conductive shield covers the isolative stuff, thus protecting the group from electromagnetic interference.
    Type: Application
    Filed: October 5, 2006
    Publication date: April 10, 2008
    Inventors: Wen-Chieh Wei, Hong-Ching Her, Shih-Chin Gong, Chih-Wei Chang
  • Publication number: 20080083958
    Abstract: A micro-electromechanical system package includes a substrate, a set of components, at least one solder pad, a frame, a peripheral shield and a top shield. The set is provided on the substrate. At least one solder pad is attached to the substrate opposite to the set. A frame is provided on the substrate. A peripheral shield is provided on the substrate around the set. The isolative stuff seals the set. The isolative stuff defines a tunnel. The top shield is provided on the isolative stuff for shielding the set from electromagnetic interference. The top shield includes a column inserted through the tunnel and connected to the solder pad.
    Type: Application
    Filed: January 5, 2007
    Publication date: April 10, 2008
    Inventors: Wen-Chieh Wei, Hong-Ching Her, Shih-Chin Gong, Chih-Wei Chang
  • Publication number: 20080075308
    Abstract: A silicon condenser microphone includes a silicon substrate defining an air chamber, a back plate mounted on the silicon substrate, a diaphragm arranged between the silicon substrate and the back plate and a suspension device arranged between the diaphragm and the silicon substrate. The back plate includes at least one acoustic aperture defined therein and a support device formed thereon. The diaphragm is arranged between the silicon substrate and the back plate so that an effective area thereof is determined by the support device. The suspension device is arranged between the diaphragm and the silicon substrate so that lateral movement of the diaphragm is prevented while vertical movement of the diaphragm is allowed. An edge of the diaphragm is abutted against the support device when the diaphragm is moved towards the back plate.
    Type: Application
    Filed: August 30, 2006
    Publication date: March 27, 2008
    Inventors: Wen-Chieh Wei, Hong-Ching Her, Shih-Chin Gong, Cyuan-Sian Jeng
  • Patent number: 6072887
    Abstract: A receiver-transmitter for communication equipment is composed of a yoke iron, a magnet and a magnetic pole piece. The yoke iron has a recess in which the magnet and the magnetic pole piece are located. The recess is provided in the bottom thereof with a plurality of locating columns, whereas the magnetic pole piece is provided with a plurality of locating slots. The magnet is securely located in a locating space which is confined by the locating columns. The magnetic pole piece is located at the top of the magnet such that the locating slots of the magnetic pole piece are engaged with the locating columns of the recess.
    Type: Grant
    Filed: March 6, 1998
    Date of Patent: June 6, 2000
    Assignee: Merry Electronics Co., Ltd.
    Inventor: Wen-Chieh Wei