Patents by Inventor Wen-Chieh Wen

Wen-Chieh Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diode package and projection apparatus
    Patent number: 8378365
    Abstract: A light emitting diode (LED) package including a carrier, at least one LED chip, and a light guide element is provided. The LED chip is disposed on the carrier. The light guide element including a light transmissive body, a light integration part, a reflective film, and a support part is disposed on the carrier and above the LED chip. The light integration part connected to the light transmissive body and disposed between the light transmissive body and the LED chip has a light incident surface facing the LED chip and at least one side. The side connects the light transmissive body and the light incident surface. The reflective film is disposed on the side. The support part leaning on the carrier is connected to the light transmissive body and surrounds the light integration part. The light transmissive body, the light integration part, and the support part are integrally formed.
    Type: Grant
    Filed: September 15, 2009
    Date of Patent: February 19, 2013
    Assignee: Young Optics Inc.
    Inventors: Mei-Ling Chen, Wen-Chieh Wen, Haw-Woei Pan, Chao-Shun Chen
  • LIGHT EMITTING DIODE PACKAGE AND PROJECTION APPARATUS
    Publication number: 20120099085
    Abstract: A light emitting diode package including a carrier, at least one LED chip, and a light guide element. The LED chip is disposed on the carrier. The light guide element including a light transmissive body, a light integration part, a reflective film, and a support part is disposed on the carrier and located above the LED chip. The light integration part connected to the light transmissive body and disposed between the light transmissive body and the LED chip has a light incident surface facing the LED chip and at least one side surface. The side surface connects the light transmissive body and the light incident surface. The reflective film is disposed on the side surface. The support part leaning on the carrier is connected to the light transmissive body and surrounds the light integration part. The light transmissive body, the light integration part, and the support part are integrally formed.
    Type: Application
    Filed: December 30, 2011
    Publication date: April 26, 2012
    Applicant: YOUNG OPTICS INC.
    Inventors: Mei-Ling Chen, Wen-Chieh Wen, Haw-Woei Pan, Chao-Shun Chen
  • LIGHT EMITTING DIODE PACKAGE AND PROJECTION APPARATUS
    Publication number: 20100155756
    Abstract: A light emitting diode (LED) package including a carrier, at least one LED chip, and a light guide element is provided. The LED chip is disposed on the carrier. The light guide element including a light transmissive body, a light integration part, a reflective film, and a support part is disposed on the carrier and above the LED chip. The light integration part connected to the light transmissive body and disposed between the light transmissive body and the LED chip has a light incident surface facing the LED chip and at least one side. The side connects the light transmissive body and the light incident surface. The reflective film is disposed on the side. The support part leaning on the carrier is connected to the light transmissive body and surrounds the light integration part. The light transmissive body, the light integration part, and the support part are integrally formed.
    Type: Application
    Filed: September 15, 2009
    Publication date: June 24, 2010
    Applicant: YOUNG OPTICS INC.
    Inventors: Mei-Ling Chen, Wen-Chieh Wen, Haw-Woei Pan, Chao-Shun Chen
  • Bicycle frame section exterior
    Patent number: D768544
    Type: Grant
    Filed: May 7, 2015
    Date of Patent: October 11, 2016
    Inventor: Wen-chieh Wen