Abstract: A display panel including a circuit board, a plurality of bonding pads, a plurality of light emitting devices, and a plurality of solder patterns is provided. The bonding pads are disposed on the circuit board, and each includes a first metal layer and a second metal layer. The second metal layer is located between the first metal layer and the circuit board. The first metal layer includes an opening overlapping the second metal layer. A material of the first metal layer is different from a material of the second metal layer. The light emitting devices are electrically bonded to the bonding pads. Each of the solder patterns electrically connects one of the light emitting devices and one of the bonding pads. The solder patterns each contact the second metal layer through the opening of the first metal layer of one of the bonding pads to form a eutectic bonding.

Abstract: A method for performing memory access of a Flash cell of a Flash memory includes: performing a series of sensing operations respectively corresponding to a plurality of sensing voltages, wherein a sensing voltage of a specific sensing operation of the series of sensing operations has a sensing voltage determined according to a result of an initial sensing operation of the series of sensing operations; determining a threshold voltage of the Flash cell according to at least a digital value generated by the series of sensing operations; and using the determined threshold voltage to perform soft decoding of the Flash cell.

Abstract: A semiconductor device package includes a first passive component having a first surface and a second passive component having a second surface facing the first surface of the first passive component. The first surface has a recessing portion and the second surface includes a protruding portion within the recessing portion of the first surface of the first passive component. A contour of the protruding portion and a contour of the recessing portion are substantially matched. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: A method of preparing a tricyclic compound of formula (I), comprising the step of converting a compound of formula (II) into a compound of formula (III); and hydrogenating the compound of formula (III) in the presence of hydrogenation catalyst and hydrogen to form the tricyclic compound of formula (I); wherein R1 is H or a C1-3 alkyl group; and R2 is H, a halogen element or a C1-3 alkyl group.

Abstract: A semiconductor device package includes a first passive component having a first surface and a second passive component having a second surface facing the first surface of the first passive component. The first surface has a recessing portion and the second surface includes a protruding portion within the recessing portion of the first surface of the first passive component. A contour of the protruding portion and a contour of the recessing portion are substantially matched. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: An imaging method for computed tomographic system (1) includes following steps of: controlling a computed tomographic system (1) to receive a description operation for configuring description data; selecting one of a plurality of imaging parameter sets corresponding to different template data, wherein each imaging parameter set is used to maximize a contrast-to-noise ratio of the three-dimensional imaging data (34) matching with the corresponding template data; and, controlling the computed tomographic system (1) to execute a three-dimensional imaging operation according to the selected imaging parameter set for obtaining the three-dimensional imaging data (34). The present disclosed example has the ability of effectively reducing a technical threshold of operating the computed tomographic system (1) via automatically selecting the suitable one of the complex imaging parameter sets according to the comprehensible description operation.

Abstract: An antenna structure (10) includes an antenna feed-in element (1), a first antenna trace element (2), a second antenna trace element (3), a supporting element (4), a grounded-short-circuit element (5), a third antenna trace element (6) and a fourth antenna trace element (7). The first antenna trace element (2), the second antenna trace element (3), the third antenna trace element (6) and the fourth antenna trace element (7) which have vertical segments in different lengths form a multi-trace planar inverted-F antenna to obtain the best bandwidth covering the full band, so that the height of the antenna structure (10) is lower, the length is shorter and the structure is denser. The impedance matching of the antenna structure (10) is controlled easily. No external matching element is required. With the multi-trace and grounded-short-circuit design of the antenna structure (10), the better resonance in the LTE full band is obtained.

Abstract: A method of preparing a tricyclic compound of formula (I), comprising the step of converting a compound of formula (II) into a compound of formula (III); and hydrogenating the compound of formula (III) in the presence of hydrogenation catalyst and hydrogen to form the tricyclic compound of formula (I); wherein R1 is H or a C1-3 alkyl group; and R2 is H, a halogen element or a C1-3 alkyl group.

Abstract: A vehicle computer apparatus includes a circuit board (1) integrating an electronic control unit (10), a global navigation satellite system (20), a dedicated short-range communication technology system (30), a satellite digital audio radio service system (40), a long term evolution technology system (50), a wireless network system (60), a plurality of long term evolution technology antennas (2), a dedicated short-range communication technology antenna (3), a satellite digital audio radio service antenna (4), a global navigation satellite system antenna (5) and two wireless network antennas (6). Under the control of the electronic control unit (10), a variety of communication systems and a variety of navigation systems mentioned above can perform wireless calls, vehicle navigations and message transmissions between vehicles, so that the vehicle computer apparatus can be used in any country and place.

Abstract: An antenna structure (10) includes an antenna feed-in element (1), a first antenna trace element (2), a second antenna trace element (3), a supporting element (4), a grounded-short-circuit element (5), a third antenna trace element (6) and a fourth antenna trace element (7). The first antenna trace element (2), the second antenna trace element (3), the third antenna trace element (6) and the fourth antenna trace element (7) which have vertical segments in different lengths form a multi-trace planar inverted-F antenna to obtain the best bandwidth covering the full band, so that the height of the antenna structure (10) is lower, the length is shorter and the structure is denser. The impedance matching of the antenna structure (10) is controlled easily. No external matching element is required. With the multi-trace and grounded-short-circuit design of the antenna structure (10), the better resonance in the LTE full band is obtained.

Abstract: An equalizer apparatus includes a feedforward filter, a slicer circuit and a feedback circuit. The feedforward filter processes an input signal. The slicer circuit includes a Viberbi decoding circuit coupled to the feedforward filter, and performs a Viberbi algorithm based decision operation to generate a decision signal according to an output signal of the feedforward filter and a feedback signal of the feedback filter. The feedback filter generates the feedback signal according to the decision result signal.

Abstract: An imaging method for computed tomographic system (1) includes following steps of: controlling a computed tomographic system (1) to receive a description operation for configuring description data; selecting one of a plurality of imaging parameter sets corresponding to different template data, wherein each imaging parameter set is used to maximize a contrast-to-noise ratio of the three-dimensional imaging data (34) matching with the corresponding template data; and, controlling the computed tomographic system (1) to execute a three-dimensional imaging operation according to the selected imaging parameter set for obtaining the three-dimensional imaging data (34). The present disclosed example has the ability of effectively reducing a technical threshold of operating the computed tomographic system (1) via automatically selecting the suitable one of the complex imaging parameter sets according to the comprehensible description operation.

Abstract: An equalizing apparatus includes a feedforward filter, a soft slicer and a feedback filter. The feedforward filter processes an input signal. The soft slicer performs a soft decision according to an input signal of the feedforward filter and a feedback signal of the feedback filter to generate a decision result signal. The feedback filter generates the feedback signal according to the decision result signal.

Abstract: An equalizer apparatus includes a feedforward filter, a slicer circuit and a feedback circuit. The feedforward filter processes an input signal. The slicer circuit includes a Viberbi decoding circuit coupled to the feedforward filter, and performs a Viberbi algorithm based decision operation to generate a decision signal according to an output signal of the feedforward filter and a feedback signal of the feedback filter. The feedback filter generates the feedback signal according to the decision result signal.

Abstract: An equalizing apparatus includes a feedforward filter, a soft slicer and a feedback filter. The feedforward filter processes an input signal. The soft slicer performs a soft decision according to an input signal of the feedforward filter and a feedback signal of the feedback filter to generate a decision result signal. The feedback filter generates the feedback signal according to the decision result signal.

Abstract: A deformed dipole is suggested with trace elements configured for wideband LTE and GPS operation. The deformed dipole comprises a first dipole conductor disposed on a first surface and first side of the circuit board and a second dipole conductor disposed on an opposite surface and opposite side of the circuit board.

Abstract: A method for calculating an error of a sampling clock is provided. The sampling clock is used for sampling a signal to generate a first sample data group and a second sample data group. Each of the first and second sample data groups includes a header having a predetermined sequence. The method includes: performing a correlation operation on the first and second sample data groups with data of the predetermined format to obtain first and second correlation results, respectively; comparing the first and second correlation results to generate a sample data group offset; and generating the error of the sampling clock according to the sample data group offset and a time difference between the first and second sample data groups.

Abstract: A capacitance detection apparatus for a touch panel includes an N number of capacitors. The detection apparatus generates an N number of different input signals, and provides an ith input signal of the input signals to an ith capacitor. The N number of input signals correspond to a delayed sequence of a maximum length sequence or the maximum length sequence. The detection apparatus sums up an N number of response signals, which are generated after providing the N number of input signals to the N number of capacitors, to generate a summed signal. The summed signal is multiplied by the ith input signal and integrated to generate an ith integrated signal. The detection apparatus estimates capacitance values of the N number of capacitors according to the N number of integrated signals, respectively.

Abstract: A deformed dipole is suggested with trace elements configured for wideband LTE and GPS operation. The deformed dipole comprises a first dipole conductor disposed on a first surface and first side of the circuit board and a second dipole conductor disposed on an opposite surface and opposite side of the circuit board.