Patents by Inventor Wen Chieh Yang
Wen Chieh Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240345337Abstract: An optical device is provided. The optical device includes a first photonic component and a second photonic component. The first photonic component is configured to communicate with the second photonic component through a first optical path or an electrical path depending on a distance between the first photonic component and the second photonic component.Type: ApplicationFiled: April 14, 2023Publication date: October 17, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Tai-Hsiang LIU, Hung-Yi LIN, Wen Chieh YANG
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Publication number: 20240345343Abstract: An electronic device includes a first transducer, a second transducer and a bridging component. The second transducer is spaced apart from the first transducer. The bridging component is configured for lateral optical-signal coupling with the first transducer and the second transducer.Type: ApplicationFiled: April 14, 2023Publication date: October 17, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU, Wen Chieh YANG
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Publication number: 20240302589Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a first photonic component, a second photonic component, and an interposer. The first photonic component is disposed over the second photonic component. The interposer is optically coupled between the first photonic component and the second photonic component. The interposer is configured to define a first signal path therebetween.Type: ApplicationFiled: March 10, 2023Publication date: September 12, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU, Wen Chieh YANG
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Publication number: 20240264369Abstract: An optoelectronic package includes a first photonic component, an optical connection element and an optical component. The optical connection element is disposed at least partially over the first photonic component. The optical component is disposed at least partially over the first photonic component. The optical connection element and the optical component are spaced apart from each other.Type: ApplicationFiled: February 3, 2023Publication date: August 8, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU, Wen Chieh YANG
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Patent number: 11309295Abstract: A semiconductor device package includes a first passive component having a first surface and a second passive component having a second surface facing the first surface of the first passive component. The first surface has a recessing portion and the second surface includes a protruding portion within the recessing portion of the first surface of the first passive component. A contour of the protruding portion and a contour of the recessing portion are substantially matched. A method of manufacturing a semiconductor device package is also disclosed.Type: GrantFiled: August 26, 2019Date of Patent: April 19, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Wen Hung Huang, Wen Chieh Yang
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Patent number: 11021483Abstract: A method of preparing a tricyclic compound of formula (I), comprising the step of converting a compound of formula (II) into a compound of formula (III); and hydrogenating the compound of formula (III) in the presence of hydrogenation catalyst and hydrogen to form the tricyclic compound of formula (I); wherein R1 is H or a C1-3 alkyl group; and R2 is H, a halogen element or a C1-3 alkyl group.Type: GrantFiled: August 1, 2019Date of Patent: June 1, 2021Assignee: Formosa Laboratories, Inc.Inventors: Wen-Chieh Yang, Mei-Jing Lee, Hsueh-Chen Lee, Lung-Hsiang Li
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Publication number: 20210066264Abstract: A semiconductor device package includes a first passive component having a first surface and a second passive component having a second surface facing the first surface of the first passive component. The first surface has a recessing portion and the second surface includes a protruding portion within the recessing portion of the first surface of the first passive component. A contour of the protruding portion and a contour of the recessing portion are substantially matched. A method of manufacturing a semiconductor device package is also disclosed.Type: ApplicationFiled: August 26, 2019Publication date: March 4, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wen Hung HUANG, Wen Chieh YANG
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Patent number: 10930028Abstract: An imaging method for computed tomographic system (1) includes following steps of: controlling a computed tomographic system (1) to receive a description operation for configuring description data; selecting one of a plurality of imaging parameter sets corresponding to different template data, wherein each imaging parameter set is used to maximize a contrast-to-noise ratio of the three-dimensional imaging data (34) matching with the corresponding template data; and, controlling the computed tomographic system (1) to execute a three-dimensional imaging operation according to the selected imaging parameter set for obtaining the three-dimensional imaging data (34). The present disclosed example has the ability of effectively reducing a technical threshold of operating the computed tomographic system (1) via automatically selecting the suitable one of the complex imaging parameter sets according to the comprehensible description operation.Type: GrantFiled: January 13, 2018Date of Patent: February 23, 2021Assignee: DELTA ELECTRONICS, INC.Inventors: Sih-Yu Chen, Jhih-Shian Lee, Wen-Chieh Yang, Fang-Jing Li
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Patent number: 10727596Abstract: An antenna structure (10) includes an antenna feed-in element (1), a first antenna trace element (2), a second antenna trace element (3), a supporting element (4), a grounded-short-circuit element (5), a third antenna trace element (6) and a fourth antenna trace element (7). The first antenna trace element (2), the second antenna trace element (3), the third antenna trace element (6) and the fourth antenna trace element (7) which have vertical segments in different lengths form a multi-trace planar inverted-F antenna to obtain the best bandwidth covering the full band, so that the height of the antenna structure (10) is lower, the length is shorter and the structure is denser. The impedance matching of the antenna structure (10) is controlled easily. No external matching element is required. With the multi-trace and grounded-short-circuit design of the antenna structure (10), the better resonance in the LTE full band is obtained.Type: GrantFiled: May 25, 2018Date of Patent: July 28, 2020Assignee: Taoglas LimitedInventors: Ronan Quinlan, Wen-Chieh Yang, Ming-Wei Chen
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Publication number: 20200165261Abstract: A method of preparing a tricyclic compound of formula (I), comprising the step of converting a compound of formula (II) into a compound of formula (III); and hydrogenating the compound of formula (III) in the presence of hydrogenation catalyst and hydrogen to form the tricyclic compound of formula (I); wherein R1 is H or a C1-3 alkyl group; and R2 is H, a halogen element or a C1-3 alkyl group.Type: ApplicationFiled: August 1, 2019Publication date: May 28, 2020Inventors: Wen-Chieh Yang, Mei-Jing Lee, Hsueh-Chen Lee, Lung-Hsiang Li
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Publication number: 20180342808Abstract: An antenna structure (10) includes an antenna feed-in element (1), a first antenna trace element (2), a second antenna trace element (3), a supporting element (4), a grounded-short-circuit element (5), a third antenna trace element (6) and a fourth antenna trace element (7). The first antenna trace element (2), the second antenna trace element (3), the third antenna trace element (6) and the fourth antenna trace element (7) which have vertical segments in different lengths form a multi-trace planar inverted-F antenna to obtain the best bandwidth covering the full band, so that the height of the antenna structure (10) is lower, the length is shorter and the structure is denser. The impedance matching of the antenna structure (10) is controlled easily. No external matching element is required. With the multi-trace and grounded-short-circuit design of the antenna structure (10), the better resonance in the LTE full band is obtained.Type: ApplicationFiled: May 25, 2018Publication date: November 29, 2018Inventors: Ronan Quinlan, Wen-Chieh YANG, Ming-Wei CHEN
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Publication number: 20180342796Abstract: A vehicle computer apparatus includes a circuit board (1) integrating an electronic control unit (10), a global navigation satellite system (20), a dedicated short-range communication technology system (30), a satellite digital audio radio service system (40), a long term evolution technology system (50), a wireless network system (60), a plurality of long term evolution technology antennas (2), a dedicated short-range communication technology antenna (3), a satellite digital audio radio service antenna (4), a global navigation satellite system antenna (5) and two wireless network antennas (6). Under the control of the electronic control unit (10), a variety of communication systems and a variety of navigation systems mentioned above can perform wireless calls, vehicle navigations and message transmissions between vehicles, so that the vehicle computer apparatus can be used in any country and place.Type: ApplicationFiled: May 25, 2018Publication date: November 29, 2018Inventors: Ronan Quinlan, Wen-Chieh YANG, Ming-Wei CHEN
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Patent number: 10044528Abstract: An equalizer apparatus includes a feedforward filter, a slicer circuit and a feedback circuit. The feedforward filter processes an input signal. The slicer circuit includes a Viberbi decoding circuit coupled to the feedforward filter, and performs a Viberbi algorithm based decision operation to generate a decision signal according to an output signal of the feedforward filter and a feedback signal of the feedback filter. The feedback filter generates the feedback signal according to the decision result signal.Type: GrantFiled: June 29, 2016Date of Patent: August 7, 2018Assignee: MSTAR SEMICONDUCTOR, INC.Inventors: Chih-Cheng Kuo, Wen-Chieh Yang, Tai-Lai Tung
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Publication number: 20180211416Abstract: An imaging method for computed tomographic system (1) includes following steps of: controlling a computed tomographic system (1) to receive a description operation for configuring description data; selecting one of a plurality of imaging parameter sets corresponding to different template data, wherein each imaging parameter set is used to maximize a contrast-to-noise ratio of the three-dimensional imaging data (34) matching with the corresponding template data; and, controlling the computed tomographic system (1) to execute a three-dimensional imaging operation according to the selected imaging parameter set for obtaining the three-dimensional imaging data (34). The present disclosed example has the ability of effectively reducing a technical threshold of operating the computed tomographic system (1) via automatically selecting the suitable one of the complex imaging parameter sets according to the comprehensible description operation.Type: ApplicationFiled: January 13, 2018Publication date: July 26, 2018Inventors: Sih-Yu CHEN, Jhih-Shian LEE, Wen-Chieh YANG, Fang-Jing LI
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Patent number: 9774477Abstract: An equalizing apparatus includes a feedforward filter, a soft slicer and a feedback filter. The feedforward filter processes an input signal. The soft slicer performs a soft decision according to an input signal of the feedforward filter and a feedback signal of the feedback filter to generate a decision result signal. The feedback filter generates the feedback signal according to the decision result signal.Type: GrantFiled: July 19, 2016Date of Patent: September 26, 2017Assignee: MStar Semiconductor, Inc.Inventors: Chih-Cheng Kuo, Wen-Chieh Yang, Tai-Lai Tung
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Publication number: 20170257232Abstract: An equalizer apparatus includes a feedforward filter, a slicer circuit and a feedback circuit. The feedforward filter processes an input signal. The slicer circuit includes a Viberbi decoding circuit coupled to the feedforward filter, and performs a Viberbi algorithm based decision operation to generate a decision signal according to an output signal of the feedforward filter and a feedback signal of the feedback filter. The feedback filter generates the feedback signal according to the decision result signal.Type: ApplicationFiled: June 29, 2016Publication date: September 7, 2017Inventors: Chih-Cheng KUO, Wen-Chieh YANG, Tai-Lai TUNG
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Publication number: 20170163453Abstract: An equalizing apparatus includes a feedforward filter, a soft slicer and a feedback filter. The feedforward filter processes an input signal. The soft slicer performs a soft decision according to an input signal of the feedforward filter and a feedback signal of the feedback filter to generate a decision result signal. The feedback filter generates the feedback signal according to the decision result signal.Type: ApplicationFiled: July 19, 2016Publication date: June 8, 2017Inventors: Chih-Cheng KUO, Wen-Chieh YANG, Tai-Lai TUNG
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Patent number: 9559423Abstract: A deformed dipole is suggested with trace elements configured for wideband LTE and GPS operation. The deformed dipole comprises a first dipole conductor disposed on a first surface and first side of the circuit board and a second dipole conductor disposed on an opposite surface and opposite side of the circuit board.Type: GrantFiled: October 8, 2013Date of Patent: January 31, 2017Assignee: TAOGLAS GROUP HOLDINGS LIMITEDInventors: Wen Chieh Yang, Ronan Quinlan
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Patent number: D762197Type: GrantFiled: September 12, 2014Date of Patent: July 26, 2016Assignee: TAOGLAS GROUP HOLDINGS LIMITEDInventors: Wen-Chieh Yang, Ronan Quinlan
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Patent number: RE48917Abstract: A deformed dipole is suggested with trace elements configured for wideband LTE and GPS operation. The deformed dipole comprises a first dipole conductor disposed on a first surface and first side of the circuit board and a second dipole conductor disposed on an opposite surface and opposite side of the circuit board.Type: GrantFiled: January 30, 2019Date of Patent: February 1, 2022Assignee: TAOGLAS GROUP HOLDINGS LIMITEDInventor: Wen Chieh Yang