Patents by Inventor Wen-Chien David Hsiao

Wen-Chien David Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6570743
    Abstract: The present invention extends the high resistance lead layers of a read head straight back into the head from each of the first and second edges of the read sensor. This lessens the length of each of the high resistance lead layers so that they do not have to be made thicker to satisfy resistance requirements. Accordingly, a lateral width of each high resistance lead portion along the ABS and a thickness thereof are chosen so as to minimize the thickness while yet satisfying the resistance requirements. Further, a method of making the first and second lead layers is provided that minimizes the thickness of the high resistance lead layers. Instead of constructing the high resistance lead layers first, the present method constructs the high resistance lead layers after defining a stripe height of the read sensor so that the lateral expanse of the high resistance lead layers is not altered by ion milling, which ion milling increases the resistance of the high resistance lead layers.
    Type: Grant
    Filed: July 14, 2000
    Date of Patent: May 27, 2003
    Assignee: International Business Machines Corporation
    Inventors: Glen Adam Garfunkel, Wen-Chien (David) Hsiao, Edward Hinpong Lee, Douglas Johnson Werner
  • Publication number: 20030058583
    Abstract: A write head has a variable throat height wherein the throat height is dependent upon the frequency of operation of the write head. At high frequency operation the throat height is small and at low frequency operation the throat height is large. The write head writes hard into a circular track of a rotating magnetic disk at all frequencies but not overly hard at low frequencies thereby avoiding excessive erase bands and adjacent track interference (ATI) on each side of the track being written.
    Type: Application
    Filed: September 26, 2001
    Publication date: March 27, 2003
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Quan-Chiu Harry Lam, Wen-Chien David Hsiao
  • Patent number: 6430011
    Abstract: The present invention extends the high resistance lead layers of a read head straight back into the head from each of the first and second edges of the read sensor. This lessens the length of each of the high resistance lead layers so that they do not have to be made thicker to satisfy resistance requirements. Accordingly, a lateral width of each high resistance lead portion along the ABS and a thickness thereof are chosen so as to minimize the thickness while yet satisfying the resistance requirements. Further, a method of making the first and second lead layers is provided that minimizes the thickness of the high resistance lead layers. Instead of constructing the high resistance lead layers first, the present method constructs the high resistance lead layers last so that the high resistance lead layers are not altered by subsequent processing steps.
    Type: Grant
    Filed: April 21, 2000
    Date of Patent: August 6, 2002
    Assignee: International Business Machines Corporation
    Inventors: Glen Adam Garfunkel, Wen Chien David Hsiao, Edward Hinpong Lee, Douglas Johnson Werner
  • Patent number: 6176005
    Abstract: The present invention extends the high resistance lead layers of a read head straight back into the head from each of the first and second edges of the read sensor. This lessens the length of each of the high resistance lead layers so that they do not have to be made thicker to satisfy resistance requirements. Accordingly, a lateral width of each high resistance lead portion along the ABS and a thickness thereof are chosen so as to minimize the thickness while yet satisfying the resistance requirements. Further, a method of making the first and second lead layers is provided that minimizes the thickness of the high resistance lead layers. Instead of constructing the high resistance lead layers first, the present method constructs the high resistance lead layers after defining a stripe height of the read sensor so that the lateral expanse of the high resistance lead layers is not altered by ion milling, which ion milling increases the resistance of the high resistance lead layers.
    Type: Grant
    Filed: December 15, 1998
    Date of Patent: January 23, 2001
    Assignee: International Business Machines Corporation
    Inventors: Glen Adam Garfunkel, Wen-Chien David Hsiao, Edward Hinpong Lee, Douglas Johnson Werner
  • Patent number: 6085406
    Abstract: The high resistance lead layers of a read head extend straight back into the head from each of the first and second edges of the read sensor. This lessens the length of each of the high resistance lead layers so that they do not have to be made thicker to satisfy resistance requirements. Accordingly, a lateral width of each high resistance lead portion along the ABS and a thickness thereof are chosen so as to minimize the thickness while yet satisfying the resistance requirements. Further, a method of making the first and second lead layers is provided that minimizes the thickness of the high resistance lead layers. Instead of constructing the high resistance lead layers first, the present method constructs the high resistance lead layers last so that the high resistance lead layers are not altered by subsequent processing steps.
    Type: Grant
    Filed: October 21, 1998
    Date of Patent: July 11, 2000
    Assignee: International Business Machines Corporation
    Inventors: Glen Adam Garfunkel, Wen Chien (David) Hsiao, Edward Hinpong Lee, Douglas Johnson Werner
  • Patent number: 6001235
    Abstract: A rotary plater and method of plating are provided which improve the uniformity of plating across a plating surface of a workpiece. A plating solution distribution device is located in a plating cup between an anode and a cathode in a spaced relationship therebetween and is centered about a vertical axis of the plating cup. A motor is provided for relatively rotating the cathode and the plating solution distribution device with respect to one another. The plating solution distribution device distributes the plating solution over the plating surface at a distribution rate which increases radially outwardly from the vertical axis. With this arrangement the volume of plating solution at the outer periphery of the plating surface is enriched with ions to promote plating uniformity.
    Type: Grant
    Filed: June 23, 1997
    Date of Patent: December 14, 1999
    Assignee: International Business Machines Corporation
    Inventors: David M. Arken, Andrew Chiu, Joseph John Fatula, Jr., Robert William Hitzfield, Wen-Chien David Hsiao, Yiping Hsiao