Patents by Inventor Wen-Chih Ho
Wen-Chih Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220209442Abstract: A connector assembly includes multiple terminals. Each terminal includes a conductive portion. The terminals include first and second high speed signal terminals and a low speed signal terminal. The conductive portions of the first and second high speed signal terminals and the low speed signal terminal are correspondingly defined as first, second and third conductive portions. An adapter board is located above a circuit board to be conductively connected to a cable directly or indirectly. The adapter board includes first and second signal circuit layers located at different heights. The first signal circuit layer includes a first high speed signal circuit conductively connecting the first conductive portion and a conductive wire of the cable. The second signal circuit layer includes a second high speed signal circuit conductively connecting the second conductive portion and another conductive wire of the cable. The third conductive portion is conductively connected to the circuit board.Type: ApplicationFiled: November 15, 2021Publication date: June 30, 2022Inventors: Jun Liu, Chien Chih Ho, Wen Chang Chang
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Patent number: 8407717Abstract: The present invention relates to a parallel processing method for a dual operating system, comprising building a main operating system and a sub operating system on an operating system kernel; executing a first application program in the main operating system and executing a second application program in the sub operating system; the operating system kernel transmitting an instruction or command received from a piece of hardware to the first application program; the first application program converting the instruction or command into program codes to be executed by the second application program; the first application program transmitting the program codes to the second application program; the second application program executing the program codes and saving the executed result in a memory or a file system; the first application program reading the executed result of the second application program from the memory or the file system; and the first application program transmitting the read result to the operatType: GrantFiled: March 11, 2010Date of Patent: March 26, 2013Assignees: Insyde Software Corporation, Acer IncorporatedInventor: Wen Chih Ho
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Publication number: 20100319008Abstract: The present invention relates to a parallel processing method for a dual operating system, comprising building a main operating system and a sub operating system on an operating system kernel; executing a first application program in the main operating system and executing a second application program in the sub operating system; the operating system kernel transmitting an instruction or command received from a piece of hardware to the first application program; the first application program converting the instruction or command into program codes to be executed by the second application program; the first application program transmitting the program codes to the second application program; the second application program executing the program codes and saving the executed result in a memory or a file system; the first application program reading the executed result of the second application program from the memory or the file system; and the first application program transmitting the read result to the operatType: ApplicationFiled: March 11, 2010Publication date: December 16, 2010Applicants: INSYDE SOFTWARE CORPORATION, ACER INCORPORATEDInventor: Wen Chih Ho
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Publication number: 20080084617Abstract: An optical module for an optical mouse utilizes the optical theory to provide the light signals as coordinates enabling the optical mouse to offer smoother response and precise tracking. The light coming from a light-emitting device forms the image through multiple transmissions, refractions and reflections, and the image reflects on a light signal acquisition device to provides the coordinates for the displacement of the optical mouse.Type: ApplicationFiled: October 6, 2006Publication date: April 10, 2008Applicant: LIGHTING COSMOS TECHNOLOGIES, INC.Inventor: Wen-Chih Ho
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Patent number: 6914261Abstract: A light emitting diode (LED) module illuminates under application of an electrical current for use in an electrical device as a light source. The LED module includes a plurality of epitaxy chips, an electrode set, and a substrate having good electrical insulation and good heat dissipation. The epitaxy chips, formed by cutting an epitaxy wafer, are mounted on the substrate. The LED module has good heat dissipation properties, thereby improving its illumination performance. The electrodes are arranged so that the illuminating area of the LED module is not shielded and can achieve full-area illumination through a large illumination area.Type: GrantFiled: October 10, 2003Date of Patent: July 5, 2005Assignee: Lambda Opto Technology Co., Ltd.Inventor: Wen-Chih Ho
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Publication number: 20050079643Abstract: A method fabricates light-emitting chips having a heat-dissipating structure to enhance its work efficiency and applications. By means of an appropriate bonding technique, the method mainly attaches an insulating, heat-dissipating substrate that has metal electrodes, to a chip that has metal blocks. The module of combined chip and the heat-dissipating substrate is cut into light-emitting chips with a heat-dissipating structure to serve as the light source of light-emitting diodes.Type: ApplicationFiled: October 10, 2003Publication date: April 14, 2005Inventor: Wen-Chih Ho
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Publication number: 20050077839Abstract: A light emitting diode (LED) module illuminates under application of an electrical current for use in an electrical device as a light source. The LED module includes a plurality of epitaxy chips, an electrode set, and a substrate having good electrical insulation and good heat dissipation. The epitaxy chips, formed by cutting an epitaxy wafer, are mounted on the substrate. The LED module has good heat dissipation properties, thereby improving its illumination performance. The electrodes are arranged so that the illuminating area of the LED module is not shielded and can achieve full-area illumination through a large illumination area.Type: ApplicationFiled: October 10, 2003Publication date: April 14, 2005Inventor: Wen-Chih Ho
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Patent number: 6838702Abstract: A light emitting chip with heat dissipating structure, which emits light as electricity flows through and is applicable as the light source for LED. The light emitting chip is composed of epitaxy chip and electrodes, and uses insulating material with good heat-dissipation to form the substrate of the emission layer. To improve the heat dissipation rate, the substrate has plural openings filled with conducting metals, so the substrate has better heat conductivity and dissipation rate.Type: GrantFiled: October 10, 2003Date of Patent: January 4, 2005Assignee: Lambda Opto Technology Co., LTDInventor: Wen-Chih Ho
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Publication number: 20030038596Abstract: The present invention discloses a light-mixing layer and method. At the manufacturing stage, the present invention arranges the particles of the composition in the light-mixing layer in an particle-interlaced order, and makes the light-mixing layer excite another wavelength after absorbing the light emitted from a light source. These two kinds of lights are mixed in the light-mixing layer to obtain a complete light diffusion, light transformation and light mixture to generate a light source with a high uniformity, high brightness and stable color temperature.Type: ApplicationFiled: February 28, 2002Publication date: February 27, 2003Inventor: Wen-Chih Ho