Patents by Inventor Wen-Chih Ho

Wen-Chih Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220209442
    Abstract: A connector assembly includes multiple terminals. Each terminal includes a conductive portion. The terminals include first and second high speed signal terminals and a low speed signal terminal. The conductive portions of the first and second high speed signal terminals and the low speed signal terminal are correspondingly defined as first, second and third conductive portions. An adapter board is located above a circuit board to be conductively connected to a cable directly or indirectly. The adapter board includes first and second signal circuit layers located at different heights. The first signal circuit layer includes a first high speed signal circuit conductively connecting the first conductive portion and a conductive wire of the cable. The second signal circuit layer includes a second high speed signal circuit conductively connecting the second conductive portion and another conductive wire of the cable. The third conductive portion is conductively connected to the circuit board.
    Type: Application
    Filed: November 15, 2021
    Publication date: June 30, 2022
    Inventors: Jun Liu, Chien Chih Ho, Wen Chang Chang
  • Patent number: 8407717
    Abstract: The present invention relates to a parallel processing method for a dual operating system, comprising building a main operating system and a sub operating system on an operating system kernel; executing a first application program in the main operating system and executing a second application program in the sub operating system; the operating system kernel transmitting an instruction or command received from a piece of hardware to the first application program; the first application program converting the instruction or command into program codes to be executed by the second application program; the first application program transmitting the program codes to the second application program; the second application program executing the program codes and saving the executed result in a memory or a file system; the first application program reading the executed result of the second application program from the memory or the file system; and the first application program transmitting the read result to the operat
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: March 26, 2013
    Assignees: Insyde Software Corporation, Acer Incorporated
    Inventor: Wen Chih Ho
  • Publication number: 20100319008
    Abstract: The present invention relates to a parallel processing method for a dual operating system, comprising building a main operating system and a sub operating system on an operating system kernel; executing a first application program in the main operating system and executing a second application program in the sub operating system; the operating system kernel transmitting an instruction or command received from a piece of hardware to the first application program; the first application program converting the instruction or command into program codes to be executed by the second application program; the first application program transmitting the program codes to the second application program; the second application program executing the program codes and saving the executed result in a memory or a file system; the first application program reading the executed result of the second application program from the memory or the file system; and the first application program transmitting the read result to the operat
    Type: Application
    Filed: March 11, 2010
    Publication date: December 16, 2010
    Applicants: INSYDE SOFTWARE CORPORATION, ACER INCORPORATED
    Inventor: Wen Chih Ho
  • Publication number: 20080084617
    Abstract: An optical module for an optical mouse utilizes the optical theory to provide the light signals as coordinates enabling the optical mouse to offer smoother response and precise tracking. The light coming from a light-emitting device forms the image through multiple transmissions, refractions and reflections, and the image reflects on a light signal acquisition device to provides the coordinates for the displacement of the optical mouse.
    Type: Application
    Filed: October 6, 2006
    Publication date: April 10, 2008
    Applicant: LIGHTING COSMOS TECHNOLOGIES, INC.
    Inventor: Wen-Chih Ho
  • Patent number: 6914261
    Abstract: A light emitting diode (LED) module illuminates under application of an electrical current for use in an electrical device as a light source. The LED module includes a plurality of epitaxy chips, an electrode set, and a substrate having good electrical insulation and good heat dissipation. The epitaxy chips, formed by cutting an epitaxy wafer, are mounted on the substrate. The LED module has good heat dissipation properties, thereby improving its illumination performance. The electrodes are arranged so that the illuminating area of the LED module is not shielded and can achieve full-area illumination through a large illumination area.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: July 5, 2005
    Assignee: Lambda Opto Technology Co., Ltd.
    Inventor: Wen-Chih Ho
  • Publication number: 20050079643
    Abstract: A method fabricates light-emitting chips having a heat-dissipating structure to enhance its work efficiency and applications. By means of an appropriate bonding technique, the method mainly attaches an insulating, heat-dissipating substrate that has metal electrodes, to a chip that has metal blocks. The module of combined chip and the heat-dissipating substrate is cut into light-emitting chips with a heat-dissipating structure to serve as the light source of light-emitting diodes.
    Type: Application
    Filed: October 10, 2003
    Publication date: April 14, 2005
    Inventor: Wen-Chih Ho
  • Publication number: 20050077839
    Abstract: A light emitting diode (LED) module illuminates under application of an electrical current for use in an electrical device as a light source. The LED module includes a plurality of epitaxy chips, an electrode set, and a substrate having good electrical insulation and good heat dissipation. The epitaxy chips, formed by cutting an epitaxy wafer, are mounted on the substrate. The LED module has good heat dissipation properties, thereby improving its illumination performance. The electrodes are arranged so that the illuminating area of the LED module is not shielded and can achieve full-area illumination through a large illumination area.
    Type: Application
    Filed: October 10, 2003
    Publication date: April 14, 2005
    Inventor: Wen-Chih Ho
  • Patent number: 6838702
    Abstract: A light emitting chip with heat dissipating structure, which emits light as electricity flows through and is applicable as the light source for LED. The light emitting chip is composed of epitaxy chip and electrodes, and uses insulating material with good heat-dissipation to form the substrate of the emission layer. To improve the heat dissipation rate, the substrate has plural openings filled with conducting metals, so the substrate has better heat conductivity and dissipation rate.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: January 4, 2005
    Assignee: Lambda Opto Technology Co., LTD
    Inventor: Wen-Chih Ho
  • Publication number: 20030038596
    Abstract: The present invention discloses a light-mixing layer and method. At the manufacturing stage, the present invention arranges the particles of the composition in the light-mixing layer in an particle-interlaced order, and makes the light-mixing layer excite another wavelength after absorbing the light emitted from a light source. These two kinds of lights are mixed in the light-mixing layer to obtain a complete light diffusion, light transformation and light mixture to generate a light source with a high uniformity, high brightness and stable color temperature.
    Type: Application
    Filed: February 28, 2002
    Publication date: February 27, 2003
    Inventor: Wen-Chih Ho