Abstract: A cover used in a ventilation fan includes a noise reduction structure and a shelter. The noise reduction structure has an air inlet, a flat portion surrounding the air inlet, and a peripheral portion surrounding the flat portion. The sidewall of the flat portion extends in a vertical direction from the peripheral portion. The bottom surface of the flat portion extends in a horizontal direction from the sidewall, and is a flat surface. The shelter is disposed on the peripheral portion and covers the air inlet.

Abstract: An embedded type multifunctional integrated structure for integrating protection components and a method for manufacturing the same are disclosed. The present invention utilizes the concept of multi-layer design to integrate more than two passive components on a component structure that is adhered onto a substrate and is applied to a USB terminal in order to protect an electronic device that uses the USB. Hence, the present invention has an OCP function, an OVP function, and an anti-ESD function at the same time. Therefore, the present invention effectively integrates two or more passive components in order to increase functionality. Moreover, the present invention effectively reduces the size of the passive components on a PCB and reduces the number of solder joints.

Abstract: An embedded type multifunctional integrated structure and a method for manufacturing the same are disclosed. The present invention utilizes the concept of multi-layer design to integrated more than two passive components on a component structure that would be adhered to a substrate. Hence, the embedded type multifunctional integrated structure has an OCP function, an OVP function, an anti-EMI function, and an anti-ESD function at the same time. Therefore, the present invention effectively integrated two or more than one passive components in order to increase function of the embedded type multifunctional integrated structure. Moreover, the present invention effectively reduces the size of the passive components on a PCB and reduces the number of solder joints.

Abstract: A method of manufacturing an electronic protection device comprises: providing a substrate mother board with a top surface and a bottom surface; forming a first conductive layer and a second conductive layer on the top surface and the bottom surface, respectively; cutting the substrate mother board into a plurality of strip-shaped substrates; and forming insulating layers on surfaces of each of the strip-shaped substrates that are not covered by the first conductive layer and the second conductive layer.

Abstract: An embedded type multifunctional integrated structure for integrating protection components and a method for manufacturing the same are disclosed. The present invention utilizes the concept of multi-layer design to integrate more than two passive components on a component structure that is adhered onto a substrate and is applied to a USB terminal in order to protect an electronic device that uses the USB. Hence, the present invention has an OCP function, an OVP function, and an anti-ESD function at the same time. Therefore, the present invention effectively integrates two or more passive components in order to increase functionality. Moreover, the present invention effectively reduces the size of the passive components on a PCB and reduces the number of solder joints.

Abstract: An embedded type multifunctional integrated structure and a method for manufacturing the same are disclosed. The present invention utilizes the concept of multi-layer design to integrated more than two passive components on a component structure that would be adhered to a substrate. Hence, the embedded type multifunctional integrated structure has an OCP function, an OVP function, an anti-EMI function, and an anti-ESD function at the same time. Therefore, the present invention effectively integrated two or more than one passive components in order to increase function of the embedded type multifunctional integrated structure. Moreover, the present invention effectively reduces the size of the passive components on a PCB and reduces the number of solder joints.

Abstract: The present invention is an electrostatic discharge protection device having a low trigger voltage. The device can utilize a process of manufacturing a PCB to minimize costs and manufacturing time. The device comprises: a discharge area, which is essentially a space within the device and can be filled by a material having a desired breakdown voltage, and at least two electrode areas, wherein the two electrode areas are substantially electrically isolated from each other and simultaneously adjacent to or within the discharge area. When an electric potential difference between the electrode areas exceeds a predetermined value, a conductive path between the electrode areas will be created by discharging through the discharge area. The device is characterized in that each of the two electrodes is a part of a conductive plate, and the two conductive plates become a part of the device by pressing or adhering so that a gap for electric isolation exists between the two electrode areas.

Abstract: A method of manufacturing an electronic protection device comprises: providing a substrate mother board with a top surface and a bottom surface; forming a first conductive layer and a second conductive layer on the top surface and the bottom surface, respectively; cutting the substrate mother board into a plurality of strip-shaped substrates; and forming insulating layers on surfaces of each of the strip-shaped substrates that are not covered by the first conductive layer and the second conductive layer.

Abstract: The present invention relates to an end electrode structure of a surface-mounted resettable over-current protection device. A polymer-based sheet is punched with a mold for manufacturing a plurality of H-shaped through-holes separated at an equal interval, such that several strip-shaped sheets are formed. Then, a first pair of electrodes and a second pair of electrodes are manufactured on each of the strip-shaped sheets through an ordinary through-hole manufacturing process of a printed circuit board. Then, the sheet is divided into several strip-shaped devices, thereby forming several over-current protection devices with five-sided electrodes. Thereby, with the five-sided electrode, the device may be more easily adhered to a circuit board.