Patents by Inventor Wen-Chih Liao
Wen-Chih Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145431Abstract: A method includes: attaching a first die and a second die to a substrate, the first die comprising a conductive via; forming a die spacer between the first die and the second die; thinning the first die and the second die, wherein after thinning the first die and the second die, the die spacer protrudes a first height above an upper surface of the first die; depositing an insulating layer over the first die and the second die; planarizing the insulating layer, wherein after planarizing, the insulating layer has a first thickness above the first die and a second thickness above the die spacer; attaching a third die and a fourth die to the first die and the second die; and attaching a support substrate to the third die and the fourth die.Type: ApplicationFiled: January 6, 2023Publication date: May 2, 2024Inventors: Yung-Lung Chen, Ming-Yun Liao, Yi-Hsiu Chen, Wen-Chih Chiou
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Publication number: 20240136444Abstract: A flash memory device and method of making the same are disclosed. The flash memory device is located on a substrate and includes a floating gate electrode, a tunnel dielectric layer located between the substrate and the floating gate electrode, a smaller length control gate electrode and a control gate dielectric layer located between the floating gate electrode and the smaller length control gate electrode. The length of a major axis of the smaller length control gate electrode is less than a length of a major axis of the floating gate electrode.Type: ApplicationFiled: December 22, 2023Publication date: April 25, 2024Inventors: Yu-Chu Lin, Chi-Chung Jen, Wen-Chih Chiang, Yi-Ling Liu, Huai-Jen Tung, Keng-Ying Liao
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Patent number: 11935981Abstract: A photo-detecting device includes a first semiconductor layer with a first dopant, a light-absorbing layer, a second semiconductor layer, and a semiconductor contact layer. The second semiconductor layer is located on the first semiconductor layer and has a first region and a second region, the light absorbing layer is located between the first semiconductor layer and the second semiconductor layer and has a third region and a fourth region, the semiconductor contact layer contacts the first region. The first region includes a second dopant and a third dopant, the second region includes second dopant, and the third region includes third dopant. The semiconductor contact layer has a first thickness greater than 50 ? and smaller than 1000 ?.Type: GrantFiled: June 30, 2021Date of Patent: March 19, 2024Assignee: EPISTAR CORPORATIONInventors: Chu-Jih Su, Chia-Hsiang Chou, Wei-Chih Peng, Wen-Luh Liao, Chao-Shun Huang, Hsuan-Le Lin, Shih-Chang Lee, Mei Chun Liu, Chen Ou
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Publication number: 20240068754Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a plurality of heat conducting components, a pipe connected to the evaporator to form a loop, and a working fluid filled in the loop. An exterior of the evaporator has a heat conducting zone thermally contacted with the heat source to absorb heat generated from the heat source. The heat conducting components are disposed in the evaporator, located at an interior of the evaporator corresponding to the heat conducting zone. The heat conducting components are in pillar shape or rib shape respectively. The working fluid in liquid passes through the evaporator, absorbs heat, and is transformed into vapor to flow out of the evaporator. Each of the heat conducting components in rib shape is oriented in a flow direction of the working fluid.Type: ApplicationFiled: November 9, 2023Publication date: February 29, 2024Applicant: Acer IncorporatedInventors: Yung-Chih Wang, Jau-Han Ke, Wen-Neng Liao, Cheng-Wen Hsieh
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Patent number: 11911951Abstract: A matte film for hot pressing and a manufacturing method thereof are provided. The manufacturing method includes steps of forming at least one polyester composition into an unstretched polyester thick film and stretching the unstretched polyester thick film in a machine direction (MD) and a transverse direction (TD). The polyester composition includes 81% to 97.9497% by weight of a polyester resin, 0.02% to 2% by weight of an antioxidative ingredient, 0.0003% to 1% by weight of a nucleating agent, 0.01% to 2% by weight of a flow aid, 0.01% to 2% by weight of a polyester modifier, 0.01% to 2% by weight of an inorganic filler, and 2% to 10% by weight of silica particles. The polyester resin has an intrinsic viscosity between 0.60 dl/g and 0.80 dl/g.Type: GrantFiled: September 4, 2020Date of Patent: February 27, 2024Assignee: NAN YA PLASTICS CORPORATIONInventors: Te-Chao Liao, Wen-Cheng Yang, Wen-Jui Cheng, Chia-Yen Hsiao, Chien-Chih Lin
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Patent number: 11421941Abstract: A stackable heat pipe assembly and method of making the same comprising first and second conductive metal plates, a conductive metal tube, and a working pipe is provided. The first and second conductive metal plates have first and second contact sides and first and second attachment sides, respectfully. The first conductive metal plate has a through hole therethrough. The first and second attachment sides have first and second planar central portions and first and second walls, first and second top ledges, and first and second expanded walls theresurrounding, respectively. The conductive metal tube has an inner wall having a wick structure thereon. A plurality of brazing rings are used to braze the working pipe to the through hole and the first and second planar central portions to the first and second attachment rim ends, respectively. Either of the first or second contact sides contacts a heat source and is stackable.Type: GrantFiled: January 16, 2021Date of Patent: August 23, 2022Inventor: Wen Chih Liao
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Publication number: 20210140717Abstract: A stackable heat pipe assembly and method of making the same comprising first and second conductive metal plates, a conductive metal tube, and a working pipe is provided. The first and second conductive metal plates have first and second contact sides and first and second attachment sides, respectfully. The first conductive metal plate has a through hole therethrough. The first and second attachment sides have first and second planar central portions and first and second walls, first and second top ledges, and first and second expanded walls theresurrounding, respectively. The conductive metal tube has an inner wall having a wick structure thereon. A plurality of brazing rings are used to braze the working pipe to the through hole and the first and second planar central portions to the first and second attachment rim ends, respectively. Either of the first or second contact sides contacts a heat source and is stackable.Type: ApplicationFiled: January 16, 2021Publication date: May 13, 2021Inventor: Wen Chih Liao
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Patent number: 10900720Abstract: A stackable heat pipe assembly and method of making the same comprising first and second conductive metal plates, a conductive metal tube, and a working pipe is provided. The first and second conductive metal plates have first and second contact sides and first and second attachment sides, respectfully. The first conductive metal plate has a through hole therethrough. The first and second attachment sides have first and second planar central portions and first and second walls, first and second top ledges, and first and second expanded walls theresurrounding, respectively. The conductive metal tube has an inner wall having a wick structure thereon. A plurality of brazing rings are used to braze the working pipe to the through hole and the first and second planar central portions to the first and second attachment rim ends, respectively. Either of the first or second contact sides contacts a heat source and is stackable.Type: GrantFiled: October 14, 2018Date of Patent: January 26, 2021Inventor: Wen Chih Liao
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Publication number: 20200116433Abstract: A stackable heat pipe assembly and method of making the same comprising first and second conductive metal plates, a conductive metal tube, and a working pipe is provided. The first and second conductive metal plates have first and second contact sides and first and second attachment sides, respectfully. The first conductive metal plate has a through hole therethrough. The first and second attachment sides have first and second planar central portions and first and second walls, first and second top ledges, and first and second expanded walls theresurrounding, respectively. The conductive metal tube has an inner wall having a wick structure thereon. A plurality of brazing rings are used to braze the working pipe to the through hole and the first and second planar central portions to the first and second attachment rim ends, respectively. Either of the first or second contact sides contacts a heat source and is stackable.Type: ApplicationFiled: October 14, 2018Publication date: April 16, 2020Inventor: Wen Chih Liao
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Patent number: 10451723Abstract: The invention discloses a signal processing apparatus of a CW-radar sensing system, comprising of a transmitting unit, a transmitting antenna and a receiving device. The transmitting unit produces a first frequency conversion signal and a second frequency conversion signal which are transmitted by the transmitting antenna serially and alternatively. A receiving antenna respectively receives the echo signal of the first frequency conversion signal and the second frequency conversion signal, and a mixing-LPF (lowpass filtering) module mixes the echo signal with a first frequency conversion signal and a second frequency conversion signal which are produced by a local oscillator and carries out lowpass filtering for the signals as to obtain a beat frequency signal of the above signals.Type: GrantFiled: December 20, 2016Date of Patent: October 22, 2019Inventors: Jung-Min Chiu, Lih-Jye Tzou, Wen-Chih Liao
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Publication number: 20180172816Abstract: The invention discloses a signal processing apparatus of a CW-radar sensing system, comprising of a transmitting unit, a transmitting antenna and a receiving device. The transmitting unit produces a first frequency conversion signal and a second frequency conversion signal which are transmitted by the transmitting antenna serially and alternatively. A receiving antenna respectively receives the echo signal of the first frequency conversion signal and the second frequency conversion signal, and a mixing-LPF (lowpass filtering) module mixes the echo signal with a first frequency conversion signal and a second frequency conversion signal which are produced by a local oscillator and carries out lowpass filtering for the signals as to obtain a beat frequency signal of the above signals.Type: ApplicationFiled: December 20, 2016Publication date: June 21, 2018Inventors: Jung-Min CHIU, Lih-Jye TZOU, Wen-Chih LIAO
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Patent number: 8496161Abstract: The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor.Type: GrantFiled: February 20, 2012Date of Patent: July 30, 2013Inventor: Wen-Chih Liao
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Publication number: 20120145772Abstract: The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor.Type: ApplicationFiled: February 20, 2012Publication date: June 14, 2012Inventor: Wen-Chih Liao
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Patent number: 8176973Abstract: A heat sink assembly in accordance with the present invention increases heat dissipation area, improves heat dissipation efficiency and comprises a base, a core pipe, an outer pipe, a top cover and a working fluid. The base has a top surface. The core pipe is mounted securely on and protrudes from the top surface with an air-tight fit and comprises an inner surface, an outer surface, a wick, multiple holes and a top. The wick is formed on the inner and outer surface. The outer pipe is mounted securely on and protrudes from the base concentrically around the core pipe and comprises an inner surface, an outer surface, a wick and a top. The wick is formed on the inner surface. The holes are formed around the core pipe away from the base. The top cover closes the top of the core pipe and the top of the outer pipe.Type: GrantFiled: September 8, 2008Date of Patent: May 15, 2012Inventor: Wen-Chih Liao
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Publication number: 20100140331Abstract: The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor.Type: ApplicationFiled: February 12, 2010Publication date: June 10, 2010Inventor: Wen-Chih LIAO
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Patent number: 7703663Abstract: The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor.Type: GrantFiled: September 16, 2009Date of Patent: April 27, 2010Inventor: Wen-Chih Liao
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Publication number: 20100001040Abstract: The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor.Type: ApplicationFiled: September 16, 2009Publication date: January 7, 2010Applicant: Wen-Chih LiaoInventor: Wen-Chih LIAO
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Publication number: 20090159648Abstract: The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor.Type: ApplicationFiled: March 3, 2009Publication date: June 25, 2009Inventor: Wen-Chih LIAO
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Publication number: 20090071637Abstract: A heat sink assembly in accordance with the present invention increases heat dissipation area, improves heat dissipation efficiency and comprises a base, a core pipe, an outer pipe, a top cover and a working fluid. The base has a top surface. The core pipe is mounted securely on and protrudes from the top surface with an air-tight fit and comprises an inner surface, an outer surface, a wick, multiple holes and a top. The wick is formed on the inner and outer surface. The outer pipe is mounted securely on and protrudes from the base concentrically around the core pipe and comprises an inner surface, an outer surface, a wick and a top. The wick is formed on the inner surface. The holes are formed around the core pipe away from the base. The top cover closes the top of the core pipe and the top of the outer pipe.Type: ApplicationFiled: September 8, 2008Publication date: March 19, 2009Inventor: Wen-Chih LIAO
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Patent number: 7262966Abstract: A heat sink module for light and thin electronic equipment, where the module includes a concave top cover, and a bottom cover having on its top surface several equidistantly spaced heat conducting fins of a certain height separated by gaps. Copper powder may cover the concave side of the top cover, and in the gaps between the fins on the top surface of the bottom to form a heat conductor. The top cover and the bottom cover are fit and brazed together to form a unit, where the gaps between the fins form a plurality of connected heat-circulating chambers that are evacuated of air and completely filled with a working fluid. Also, a method of making a heat sink module for light and thin electronic equipment is described.Type: GrantFiled: May 11, 2005Date of Patent: August 28, 2007Assignee: Rhinol Tech Corp.Inventor: Wen-Chih Liao