Patents by Inventor Wen-Chih Lu
Wen-Chih Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240107414Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for switching a secondary cell to a primary cell. A user equipment (UE) monitors a first radio condition of the UE for beams of a primary cell and a second radio condition for beams of one or more secondary cells configured for the UE in carrier aggregation. The UE transmits a request to configure a candidate beam of at least one candidate secondary cell as a new primary cell in response to the first radio condition not satisfying a first threshold and the second radio condition for the at least one candidate secondary cell satisfying a second threshold. A base station determines to reconfigure at least one secondary cell as the new primary cell. The base station and the UE perform a handover of the UE to the new primary cell.Type: ApplicationFiled: September 23, 2022Publication date: March 28, 2024Inventors: Yu-Chieh HUANG, Kuhn-Chang LIN, Jen-Chun CHANG, Wen-Hsin HSIA, Chia-Jou LU, Sheng-Chih WANG, Chenghsin LIN, Yeong Leong CHOO, Chun-Hsiang CHIU, Chihhung HSIEH, Kai-Chun CHENG, Chung Wei LIN
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Publication number: 20240090230Abstract: A memory array and an operation method of the memory array are provided. The memory array includes first and second ferroelectric memory devices formed along a gate electrode, a channel layer and a ferroelectric layer between the gate electrode and the channel layer. The ferroelectric memory devices include: a common source/drain electrode and two respective source/drain electrodes, separately in contact with a side of the channel layer opposite to the ferroelectric layer, wherein the common source/drain electrode is disposed between the respective source/drain electrodes; and first and second auxiliary gates, capacitively coupled to the channel layer, wherein the first auxiliary gate is located between the common source/drain electrode and one of the respective source/drain electrodes, and the second auxiliary gate is located between the common source/drain electrode and the other respective source/drain electrode.Type: ApplicationFiled: January 9, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wen-Ling Lu, Chen-Jun Wu, Ya-Yun Cheng, Sheng-Chih Lai, Yi-Ching Liu, Yu-Ming Lin, Feng-Cheng Yang, Chung-Te Lin
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Patent number: 11315964Abstract: An optical sensor includes pixels disposed in a substrate. A light collimating layer is disposed on the substrate and includes a transparent layer, a light-shielding layer, and transparent pillars. The transparent layer blanketly disposed on the substrate covers the pixels and the region between the pixels. The light-shielding layer is disposed on the transparent layer and between the transparent pillars. The transparent pillars penetrating through the light-shielding layer are correspondingly disposed on the pixels.Type: GrantFiled: February 1, 2019Date of Patent: April 26, 2022Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATIONInventors: Hsin-Hui Lee, Han-Liang Tseng, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen, Hsueh-Jung Lin, Wen-Chih Lu, Ting-Jung Lu
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Publication number: 20220029035Abstract: A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.Type: ApplicationFiled: October 8, 2021Publication date: January 27, 2022Applicant: Vanguard International Semiconductor CorporationInventors: Hsin-Hui LEE, Han-Liang TSENG, Jiunn-Liang YU, Kwang-Ming LIN, Yin CHEN, Si-Twan CHEN, Hsueh-Jung LIN, Wen-Chih LU, Chih-Hsien CHEN
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Patent number: 11177397Abstract: A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.Type: GrantFiled: January 9, 2020Date of Patent: November 16, 2021Assignee: Vanguard International Semiconductor CorporationInventors: Hsin-Hui Lee, Han-Liang Tseng, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen, Hsueh-Jung Lin, Wen-Chih Lu, Chih-Hsien Chen
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Publication number: 20210217906Abstract: A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.Type: ApplicationFiled: January 9, 2020Publication date: July 15, 2021Applicant: Vanguard International Semiconductor CorporationInventors: Hsin-Hui LEE, Han-Liang TSENG, Jiunn-Liang YU, Kwang-Ming LIN, Yin CHEN, Si-Twan CHEN, Hsueh-Jung LIN, Wen-Chih LU, Chih-Hsien CHEN
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Patent number: 10935805Abstract: An optical sensor includes a plurality of pixels disposed in a substrate and a light collimating layer. The light collimating layer is disposed on the substrate. The light collimating layer includes a light-shielding layer, a plurality of transparent pillars, and a plurality of first dummy transparent pillars. The light-shielding layer is disposed on the substrate. The plurality of transparent pillars pass through the light-shielding layer and are disposed correspondingly on the plurality of pixels. The plurality of first dummy transparent pillars that pass through the light-shielding layer are disposed on a first peripheral region of the light collimating layer, wherein the plurality of first dummy transparent pillars surround the plurality of transparent pillars from a top view.Type: GrantFiled: January 31, 2019Date of Patent: March 2, 2021Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATIONInventors: Hsin-Hui Lee, Han-Liang Tseng, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen, Hsueh-Jung Lin, Wen-Chih Lu, Ting-Jung Lu
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Patent number: 10770602Abstract: An optical sensor includes pixels disposed in a substrate and a light collimating layer disposed on the substrate. The light collimating layer includes a first light-shielding layer, first transparent pillars, a second light-shielding layer, and second transparent pillars. The first light-shielding layer is disposed on the substrate. The first transparent pillars through the first light-shielding layer are correspondingly disposed on the pixels. The second light-shielding layer is disposed on the first light-shielding layer and the first transparent pillars. The second transparent pillars through the second light-shielding layer are correspondingly disposed on the first transparent pillars. The top surface area of each of the first transparent pillars is not equal to the bottom surface area of each of the second transparent pillars.Type: GrantFiled: February 20, 2019Date of Patent: September 8, 2020Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATIONInventors: Hsin-Hui Lee, Han-Liang Tseng, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen, Hsueh-Jung Lin, Wen-Chih Lu, Ting-Jung Lu
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Patent number: 10763288Abstract: A semiconductor device is provided. The semiconductor device includes a substrate. The substrate includes a plurality of pixels. The semiconductor device also includes a light collimator layer disposed on the substrate. The light collimator layer includes a transparent connection feature disposed on the substrate, and a plurality of transparent pillars disposed on the transparent connection feature. The plurality of transparent pillars cover the plurality of pixels, and the transparent connection feature connects to the plurality of transparent pillars. The plurality of transparent pillars and the transparent connection feature are made of a first material which includes a transparent material. The light collimator layer also includes a plurality of first light-shielding features disposed on the transparent connection feature. The top surface of one of the transparent pillars is level with the top surface of one of the first light-shielding features.Type: GrantFiled: February 15, 2019Date of Patent: September 1, 2020Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATIONInventors: Hsin-Hui Lee, Han-Liang Tseng, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen, Hsueh-Jung Lin, Wen-Chih Lu, Ting-Jung Lu
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Publication number: 20200266226Abstract: A semiconductor device is provided. The semiconductor device includes a substrate. The substrate includes a plurality of pixels. The semiconductor device also includes a light collimator layer disposed on the substrate. The light collimator layer includes a transparent connection feature disposed on the substrate, and a plurality of transparent pillars disposed on the transparent connection feature. The plurality of transparent pillars cover the plurality of pixels, and the transparent connection feature connects to the plurality of transparent pillars. The plurality of transparent pillars and the transparent connection feature are made of a first material which includes a transparent material. The light collimator layer also includes a plurality of first light-shielding features disposed on the transparent connection feature. The top surface of one of the transparent pillars is level with the top surface of one of the first light-shielding features.Type: ApplicationFiled: February 15, 2019Publication date: August 20, 2020Applicant: Vanguard International Semiconductor CorporationInventors: Hsin-Hui LEE, Han-Liang TSENG, Jiunn-Liang YU, Kwang-Ming LIN, Yin CHEN, Si-Twan CHEN, Hsueh-Jung LIN, Wen-Chih LU, Ting-Jung LU
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Publication number: 20200266305Abstract: An optical sensor includes pixels disposed in a substrate and a light collimating layer disposed on the substrate. The light collimating layer includes a first light-shielding layer, first transparent pillars, a second light-shielding layer, and second transparent pillars. The first light-shielding layer is disposed on the substrate. The first transparent pillars through the first light-shielding layer are correspondingly disposed on the pixels. The second light-shielding layer is disposed on the first light-shielding layer and the first transparent pillars. The second transparent pillars through the second light-shielding layer are correspondingly disposed on the first transparent pillars. The top surface area of each of the first transparent pillars is not equal to the bottom surface area of each of the second transparent pillars.Type: ApplicationFiled: February 20, 2019Publication date: August 20, 2020Applicant: Vanguard International Semiconductor CorporationInventors: Hsin-Hui LEE, Han-Liang TSENG, Jiunn-Liang YU, Kwang-Ming LIN, Yin CHEN, Si-Twan CHEN, Hsueh-Jung LIN, Wen-Chih LU, Ting-Jung LU
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Publication number: 20200249490Abstract: An optical sensor includes a plurality of pixels disposed in a substrate and a light collimating layer. The light collimating layer is disposed on the substrate. The light collimating layer includes a light-shielding layer, a plurality of transparent pillars, and a plurality of first dummy transparent pillars. The light-shielding layer is disposed on the substrate. The plurality of transparent pillars pass through the light-shielding layer and are disposed correspondingly on the plurality of pixels. The plurality of first dummy transparent pillars that pass through the light-shielding layer are disposed on a first peripheral region of the light collimating layer, wherein the plurality of first dummy transparent pillars surround the plurality of transparent pillars from a top view.Type: ApplicationFiled: January 31, 2019Publication date: August 6, 2020Applicant: Vanguard International Semiconductor CorporationInventors: Hsin-Hui LEE, Han-Liang TSENG, Jiunn-Liang YU, Kwang-Ming LIN, Yin CHEN, Si-Twan CHEN, Hsueh-Jung LIN, Wen-Chih LU, Ting-Jung LU
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Publication number: 20200251506Abstract: An optical sensor includes pixels disposed in a substrate. A light collimating layer is disposed on the substrate and includes a transparent layer, a light-shielding layer, and transparent pillars. The transparent layer blanketly disposed on the substrate covers the pixels and the region between the pixels. The light-shielding layer is disposed on the transparent layer and between the transparent pillars. The transparent pillars penetrating through the light-shielding layer are correspondingly disposed on the pixels.Type: ApplicationFiled: February 1, 2019Publication date: August 6, 2020Applicant: Vanguard International Semiconductor CorporationInventors: Hsin-Hui LEE, Han-Liang TSENG, Jiunn-Liang YU, Kwang-Ming LIN, Yin CHEN, Si-Twan CHEN, Hsueh-Jung LIN, Wen-Chih LU, Ting-Jung LU
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Patent number: 10572070Abstract: An optical device is provided. The optical device includes a substrate including a plurality of pixel units, a dielectric layer disposed on the substrate, a patterned light-transmitting layer disposed on the dielectric layer and corresponding to the plurality of pixel units, and a plurality of continuous light-shielding layers disposed on the dielectric layer and located on both sides of the patterned light-transmitting layer. A method for fabricating an optical device is also provided.Type: GrantFiled: June 25, 2018Date of Patent: February 25, 2020Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATIONInventors: Chih-Cherng Liao, Shih-Hao Liu, Wu-Hsi Lu, Ming-Cheng Lo, Chung-Ren Lao, Yun-Chou Wei, Yin Chen, Hsin-Hui Lee, Hsueh-Jung Lin, Wen-Chih Lu, Ting-Jung Lu
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Publication number: 20190391701Abstract: An optical device is provided. The optical device includes a substrate including a plurality of pixel units, a dielectric layer disposed on the substrate, a patterned light-transmitting layer disposed on the dielectric layer and corresponding to the plurality of pixel units, and a plurality of continuous light-shielding layers disposed on the dielectric layer and located on both sides of the patterned light-transmitting layer. A method for fabricating an optical device is also provided.Type: ApplicationFiled: June 25, 2018Publication date: December 26, 2019Applicant: Vanguard International Semiconductor CorporationInventors: Chih-Cherng LIAO, Shih-Hao LIU, Wu-Hsi LU, Ming-Cheng LO, Chung-Ren LAO, Yun-Chou WEI, Yin CHEN, Hsin-Hui LEE, Hsueh-Jung LIN, Wen-Chih LU, Ting-Jung LU
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Publication number: 20040217311Abstract: A new and improved fully-sealing throttle valve which is capable of selectively varying or stopping the flow of gas from one gas flow channel to an adjacent gas flow channel. The throttle valve includes a valve body in which is slidably disposed a tapered valve plug having a tapered plug sealing surface. A motor operably engages the valve plug for progressively moving the valve plug toward a correspondingly-tapered, complementary valve plug seat in the valve body in order to impede flow of gas between the plug sealing surface and the valve plug seat, through the valve body. The motor is capable of moving the plug sealing surface of the valve plug in firm engagement with the valve plug seat of the valve body to selectively prevent further flow of gas through the valve body.Type: ApplicationFiled: April 29, 2003Publication date: November 4, 2004Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventor: Wen-Chih Lu