Patents by Inventor Wen-Chih Lu

Wen-Chih Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10770602
    Abstract: An optical sensor includes pixels disposed in a substrate and a light collimating layer disposed on the substrate. The light collimating layer includes a first light-shielding layer, first transparent pillars, a second light-shielding layer, and second transparent pillars. The first light-shielding layer is disposed on the substrate. The first transparent pillars through the first light-shielding layer are correspondingly disposed on the pixels. The second light-shielding layer is disposed on the first light-shielding layer and the first transparent pillars. The second transparent pillars through the second light-shielding layer are correspondingly disposed on the first transparent pillars. The top surface area of each of the first transparent pillars is not equal to the bottom surface area of each of the second transparent pillars.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: September 8, 2020
    Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Hsin-Hui Lee, Han-Liang Tseng, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen, Hsueh-Jung Lin, Wen-Chih Lu, Ting-Jung Lu
  • Patent number: 10768673
    Abstract: A hinge structure including a first screw rod, a sliding rod, and a second screw rod is provided. The first screw rod comprises a threaded shaft. The sliding rod is sleeved on the threaded shaft. The second screw rod is sleeved on the sliding rod. The threaded shaft has a first helical slot. The sliding rod has a first guiding portion and a second guiding portion, and the first guiding portion is coupled to the first helical slot. The second screw rod has a second helical slot, and the second guiding portion is coupled to the second helical slot.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: September 8, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Wei-Chih Hsu, Ya-Hui Tseng, Chang-Kai Liu, Ming-Shun Lu, Wen-Jie Hsiao
  • Patent number: 10763288
    Abstract: A semiconductor device is provided. The semiconductor device includes a substrate. The substrate includes a plurality of pixels. The semiconductor device also includes a light collimator layer disposed on the substrate. The light collimator layer includes a transparent connection feature disposed on the substrate, and a plurality of transparent pillars disposed on the transparent connection feature. The plurality of transparent pillars cover the plurality of pixels, and the transparent connection feature connects to the plurality of transparent pillars. The plurality of transparent pillars and the transparent connection feature are made of a first material which includes a transparent material. The light collimator layer also includes a plurality of first light-shielding features disposed on the transparent connection feature. The top surface of one of the transparent pillars is level with the top surface of one of the first light-shielding features.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: September 1, 2020
    Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Hsin-Hui Lee, Han-Liang Tseng, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen, Hsueh-Jung Lin, Wen-Chih Lu, Ting-Jung Lu
  • Publication number: 20200266305
    Abstract: An optical sensor includes pixels disposed in a substrate and a light collimating layer disposed on the substrate. The light collimating layer includes a first light-shielding layer, first transparent pillars, a second light-shielding layer, and second transparent pillars. The first light-shielding layer is disposed on the substrate. The first transparent pillars through the first light-shielding layer are correspondingly disposed on the pixels. The second light-shielding layer is disposed on the first light-shielding layer and the first transparent pillars. The second transparent pillars through the second light-shielding layer are correspondingly disposed on the first transparent pillars. The top surface area of each of the first transparent pillars is not equal to the bottom surface area of each of the second transparent pillars.
    Type: Application
    Filed: February 20, 2019
    Publication date: August 20, 2020
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Hsin-Hui LEE, Han-Liang TSENG, Jiunn-Liang YU, Kwang-Ming LIN, Yin CHEN, Si-Twan CHEN, Hsueh-Jung LIN, Wen-Chih LU, Ting-Jung LU
  • Publication number: 20200266226
    Abstract: A semiconductor device is provided. The semiconductor device includes a substrate. The substrate includes a plurality of pixels. The semiconductor device also includes a light collimator layer disposed on the substrate. The light collimator layer includes a transparent connection feature disposed on the substrate, and a plurality of transparent pillars disposed on the transparent connection feature. The plurality of transparent pillars cover the plurality of pixels, and the transparent connection feature connects to the plurality of transparent pillars. The plurality of transparent pillars and the transparent connection feature are made of a first material which includes a transparent material. The light collimator layer also includes a plurality of first light-shielding features disposed on the transparent connection feature. The top surface of one of the transparent pillars is level with the top surface of one of the first light-shielding features.
    Type: Application
    Filed: February 15, 2019
    Publication date: August 20, 2020
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Hsin-Hui LEE, Han-Liang TSENG, Jiunn-Liang YU, Kwang-Ming LIN, Yin CHEN, Si-Twan CHEN, Hsueh-Jung LIN, Wen-Chih LU, Ting-Jung LU
  • Publication number: 20200249490
    Abstract: An optical sensor includes a plurality of pixels disposed in a substrate and a light collimating layer. The light collimating layer is disposed on the substrate. The light collimating layer includes a light-shielding layer, a plurality of transparent pillars, and a plurality of first dummy transparent pillars. The light-shielding layer is disposed on the substrate. The plurality of transparent pillars pass through the light-shielding layer and are disposed correspondingly on the plurality of pixels. The plurality of first dummy transparent pillars that pass through the light-shielding layer are disposed on a first peripheral region of the light collimating layer, wherein the plurality of first dummy transparent pillars surround the plurality of transparent pillars from a top view.
    Type: Application
    Filed: January 31, 2019
    Publication date: August 6, 2020
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Hsin-Hui LEE, Han-Liang TSENG, Jiunn-Liang YU, Kwang-Ming LIN, Yin CHEN, Si-Twan CHEN, Hsueh-Jung LIN, Wen-Chih LU, Ting-Jung LU
  • Publication number: 20200251506
    Abstract: An optical sensor includes pixels disposed in a substrate. A light collimating layer is disposed on the substrate and includes a transparent layer, a light-shielding layer, and transparent pillars. The transparent layer blanketly disposed on the substrate covers the pixels and the region between the pixels. The light-shielding layer is disposed on the transparent layer and between the transparent pillars. The transparent pillars penetrating through the light-shielding layer are correspondingly disposed on the pixels.
    Type: Application
    Filed: February 1, 2019
    Publication date: August 6, 2020
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Hsin-Hui LEE, Han-Liang TSENG, Jiunn-Liang YU, Kwang-Ming LIN, Yin CHEN, Si-Twan CHEN, Hsueh-Jung LIN, Wen-Chih LU, Ting-Jung LU
  • Publication number: 20200081503
    Abstract: A hinge structure including a first screw rod, a sliding rod, and a second screw rod is provided. The first screw rod comprises a threaded shaft. The sliding rod is sleeved on the threaded shaft. The second screw rod is sleeved on the sliding rod. The threaded shaft has a first helical slot. The sliding rod has a first guiding portion and a second guiding portion, and the first guiding portion is coupled to the first helical slot. The second screw rod has a second helical slot, and the second guiding portion is coupled to the second helical slot.
    Type: Application
    Filed: November 18, 2019
    Publication date: March 12, 2020
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Wei-Chih Hsu, Ya-Hui Tseng, Chang-Kai Liu, Ming-Shun Lu, Wen-Jie Hsiao
  • Patent number: 10520986
    Abstract: A hinge structure including a first screw rod, a sliding rod, and a second screw rod is provided. The first screw rod comprises a threaded shaft. The sliding rod is sleeved on the threaded shaft. The second screw rod is sleeved on the sliding rod. The threaded shaft has a first helical slot. The sliding rod has a first guiding portion and a second guiding portion, and the first guiding portion is coupled to the first helical slot. The second screw rod has a second helical slot, and the second guiding portion is coupled to the second helical slot.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: December 31, 2019
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Wei-Chih Hsu, Ya-Hui Tseng, Chang-Kai Liu, Ming-Shun Lu, Wen-Jie Hsiao
  • Publication number: 20190355640
    Abstract: Disclosed herein is a package comprising a first die having a first redistribution layer (RDL) disposed on a first side of a first substrate and a second die having a second RDL disposed on a first side of a second substrate, with the first RDL bonded to the second RDL. A third die having a third RDL is disposed on a first side of a third substrate, the third die mounted over the second die, with the second die disposed between the first die and the third die. First vias extend through, and are electrically isolated from, the second substrate, with the first vias each contacting a conductive element in the first RDL or the second RDL. Second vias extend through, and are electrically isolated from, the third substrate, with the second vias each contacting a conductive element in the third RDL or one of the first vias.
    Type: Application
    Filed: August 5, 2019
    Publication date: November 21, 2019
    Inventors: Chen-Hua Yu, Ming-Fa Chen, Wen-Sen Lu, Wen-Chih Chiou, Wen-Ching Tsai
  • Patent number: 10373885
    Abstract: Disclosed herein is a package comprising a first die having a first redistribution layer (RDL) disposed on a first side of a first substrate and a second die having a second RDL disposed on a first side of a second substrate, with the first RDL bonded to the second RDL. A third die having a third RDL is disposed on a first side of a third substrate, the third die mounted over the second die, with the second die disposed between the first die and the third die. First vias extend through, and are electrically isolated from, the second substrate, with the first vias each contacting a conductive element in the first RDL or the second RDL. Second vias extend through, and are electrically isolated from, the third substrate, with the second vias each contacting a conductive element in the third RDL or one of the first vias.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: August 6, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Ming-Fa Chen, Wen-Sen Lu, Wen-Chih Chiou, Wen-Ching Tsai
  • Publication number: 20040217311
    Abstract: A new and improved fully-sealing throttle valve which is capable of selectively varying or stopping the flow of gas from one gas flow channel to an adjacent gas flow channel. The throttle valve includes a valve body in which is slidably disposed a tapered valve plug having a tapered plug sealing surface. A motor operably engages the valve plug for progressively moving the valve plug toward a correspondingly-tapered, complementary valve plug seat in the valve body in order to impede flow of gas between the plug sealing surface and the valve plug seat, through the valve body. The motor is capable of moving the plug sealing surface of the valve plug in firm engagement with the valve plug seat of the valve body to selectively prevent further flow of gas through the valve body.
    Type: Application
    Filed: April 29, 2003
    Publication date: November 4, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Wen-Chih Lu