Abstract: Disclosed are systems, apparatuses, processes, and computer-readable media to capture images. A method of processing image data includes determining a first region of interest (ROI) in an image. The first ROI is associated with a first object. The method can include determining one or more image characteristics of the first ROI. The method can further include determining whether to perform an upsampling process on image data in the first ROI based on the one or more image characteristics of the first ROI.

Abstract: A stapler includes a base, a handle pivotably connected to the base, and a magazine unit having a channel body which is pivotably attached to the base, a magazine body which is coaxially disposed to and movable relative to the channel body in a lengthwise direction, and a magazine ejection spring disposed to bias the magazine track to make an ejection movement. The magazine unit further has a damping module disposed on the magazine track and having two spring-biased damping members which are movable relative to the magazine track to be slidably moved on and frictionally engaged with inner wall surfaces of two outer lateral wails of the channel body so as to retard the ejection movement of the magazine track.

Abstract: A stapler includes a base, a handle pivotably connected to the base, and a magazine unit having a channel body which is pivotably attached to the base, a magazine body which is coaxially disposed to and movable relative to the channel body in a lengthwise direction, and a magazine ejection spring disposed to bias the magazine track to make an ejection movement. The magazine unit further has a damping module disposed on the magazine track and having two spring-biased damping members which are movable relative to the magazine track to be slidably moved on and frictionally engaged with inner wall surfaces of two outer lateral wails of the channel body so as to retard the ejection movement of the magazine track.

Abstract: A printed circuit board and the method of manufacturing the same are provided. The printed circuit board comprises a supporting plate having a front side and a rear side; a first adhesive layer placed on the front side of the supporting plate; and a front wire layer embedded into the first adhesive layer. The front wire layer includes at least one external contact portion for connecting an electronic component, wherein the surface of the external contact portion is coplanar with the surface of the first adhesive layer surrounding the external contact portion.

Abstract: A printed circuit board and the method of manufacturing the same are provided. The printed circuit board comprises a supporting plate having a front side and a rear side; a first adhesive layer placed on the front side of the supporting plate; and a front wire layer embedded into the first adhesive layer. The front wire layer includes at least one external contact portion for connecting an electronic component, wherein the surface of the external contact portion is coplanar with the surface of the first adhesive layer surrounding the external contact portion.

Abstract: A combined circuit board including a flexible circuit board (FCB), a rigid circuit board (RCB), and first and second conductive vias (CVs) is provided. The FCB includes a flexible dielectric layer (DL) and a circuit layer (CL) disposed thereon. The RCB includes a rigid DL and a CL including a main circuit (MC) and an out connection interface circuit (OCIC). The rigid DL is disposed on the FCB and includes first and second rigid dielectric portions (RDPs) apart from each other by a distance such that part of the FCB is exposed outside. The MC and the OCIC are disposed on the first and the second RDPs, respectively. The first CV disposed in the second RDP electrically connects a contact of the OCIC and the CL of the FCB. The second CV disposed in the first RDP electrically connects the MC and the CL of the FCB.