Patents by Inventor Wen-Chin Lan

Wen-Chin Lan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DIRECT TYPE BACKLIGHT MODULE AND APPLICATION THEREOF
    Publication number: 20110102709
    Abstract: A direct type backlight module and an application thereof are described. The direct type backlight module comprises a rear frame module and a light source, wherein the light source is deposed on the rear frame module. The rear frame module comprises a plurality of frameworks, wherein the frameworks are combined to form a frame. The direct type backlight module is suitable for applying in a liquid crystal display (LCD) device.
    Type: Application
    Filed: January 12, 2011
    Publication date: May 5, 2011
    Applicant: CHI MEI OPTOELECTRONICS CORP.
    Inventors: Wen-Chin LAN, I Han LIU
  • DIRECT TYPE BACKLIGHT MODULE AND APPLICATION THEREOF
    Publication number: 20070229731
    Abstract: A direct type backlight module and an application thereof are described. The direct type backlight module comprises a rear frame module and a light source, wherein the light source is deposed on the rear frame module. The rear frame module comprises a plurality of frameworks, wherein the frameworks are combined to form a frame. The direct type backlight module is suitable for applying in a liquid crystal display (LCD) device.
    Type: Application
    Filed: March 7, 2007
    Publication date: October 4, 2007
    Applicant: CHI MEI OPTOELECTRONICS CORP.
    Inventors: Wen-Chin LAN, I LIU
  • FLAT PANEL DISPLAY HAVING BACKLIGHT MODULE
    Publication number: 20070189042
    Abstract: A backlight module includes a metal back plate having a front surface, an insulating layer disposed on the front surface of the metal back plate, a metal layout layer disposed on the insulating layer, the metal layout layer including signal lines, and at least one light emitting diode coupled to the signal lines of the metal layout layer.
    Type: Application
    Filed: February 7, 2007
    Publication date: August 16, 2007
    Applicant: CHI MEI OPTOELECTRONICS CORPORATION
    Inventors: Wei-Ming Pai, Wen-Chin Lan, Wen-Tsung Lin