Patents by Inventor Wen-Chin Stanley Yeh

Wen-Chin Stanley Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6166422
    Abstract: An integrated circuit structure is provided with an inductor formed therein which comprises a metal coil on an insulated surface over a semiconductor substrate, and a high magnetic susceptibility cobalt/nickel metal core located adjacent said metal coil, but spaced therefrom by one or more insulation layers. In one embodiment, the high magnetic susceptibility cobalt/nickel metal core is placed between lower and upper portions of the metal coil which are interconnected together by filled vias. In another embodiment, the metal coil is formed in a serpentine shape in one plane on an insulated surface over the semiconductor substrate, and the high magnetic susceptibility cobalt/nickel metal core is formed over the serpentine coil, but spaced from the serpentine coil by another insulation layer.
    Type: Grant
    Filed: May 13, 1998
    Date of Patent: December 26, 2000
    Assignee: LSI Logic Corporation
    Inventors: Linggian Qian, Wen-Chin Stanley Yeh