Abstract: A semiconductor package includes a bottom substrate and a top substrate space apart from the bottom substrate such that the bottom substrate and the top substrate define a gap therebetween. A logic die and a memory die are mounted on a top surface of the bottom substrate in a side-by-side fashion. The logic die may have a thickness not less than 125 micrometers. A connection structure is disposed between the bottom substrate and the top substrate around the logic die and the memory die to electrically connect the bottom substrate with the top substrate. A sealing resin fills in the gap between the bottom substrate and the top substrate and sealing the logic die, the memory die, and the connection structure in the gap.

Abstract: A package-on-package includes a first package and a second package on the first package. The first package includes a bottom substrate and a top substrate space apart from the bottom substrate such that the bottom substrate and the top substrate define a gap therebetween. A logic die and an IC device are mounted on the bottom substrate in a side-by-side configuration. The logic die has a thickness not less than 125 micrometer. Copper cored solder balls are disposed between around the logic die and the IC device to electrically connect the bottom substrate with the top substrate. A sealing resin is filled into the gap between the bottom substrate and the top substrate and seals the logic die, the IC device, and the copper cored solder balls in the gap.

Abstract: A semiconductor package includes a bottom substrate and a top substrate space apart from the bottom substrate such that the bottom substrate and the top substrate define a gap therebetween. A logic die is mounted on a top surface of the bottom substrate in a flip-chip fashion. The logic die has a thickness of 125-350 micrometers. The logic die comprises an active front side, a passive rear side, and an input/output pad provided on the active front side. A plurality of copper cored solder balls is disposed between the bottom substrate and the top substrate around the logic die to electrically connect the bottom substrate with the top substrate. A sealing resin fills in the gap between the bottom substrate and the top substrate and seals the logic die and the plurality of copper cored solder balls in the gap.

Abstract: A stackable raising seedling device has a device body and a floating planting board. The device body has raising seeding hole parts disposed at intervals and holes disposed intervals. The raising seeding hole pans and the holes are staggered in parallel and with each other along a first direction, the raising seeding hole part and the holes are staggered in parallel with each other along a second direction, and the holes of the first direction and the raising seeding hole parts of the second direction are adjacently arranged. The raising seeding hole pan can receive a culture medium layer, the culture medium layer has an agar gel, and the agar gel is composed of a plant growth nutrient, agar powder and water. The present disclosure improves the overall seed germination rate and the quality of planted crops when massively planting the planted crops.

Abstract: The invention provides a display device, which includes a display panel and at least one optical device. The display panel has a display region and a display surface. The at least one optical device is overlapped with the display panel. The optical device has a low-reflectivity sealant pattern. An angle of 45 degrees is included between the display surface of the display panel and a connecting line of a side edge of the display region and the low-reflectivity sealant pattern. An inner edge of the low-reflectivity sealant pattern and the display region are located on the same side of the connecting line. The display device of the invention has good light emitting uniformity at different viewing angles.

Abstract: A method for controlling an ultraviolet lamp for even and uniform irradiation of curable glue on a product includes obtaining tilt data of a platform of a machine, where the tilt data comprises a tilt direction and a tilt angle, and calculating a tilt amplitude of the platform of the machine based on the tilt data. The method further includes determining an ultraviolet lamp as a target to be adjusted based on the tilt direction, and obtaining an adjustment range of the target ultraviolet lamp based on the calculated tilt amplitude, and sending the adjustment range to an ultraviolet lamp adjustment device to adjust the target ultraviolet lamp. So that ultraviolet light emitted by the target ultraviolet lamp can illuminate the product to be irradiated on the platform in parallel.

Abstract: A method for controlling an ultraviolet lamp for even and uniform irradiation of curable glue on a product includes obtaining tilt data of a platform of a machine, where the tilt data comprises a tilt direction and a tilt angle, and calculating a tilt amplitude of the platform of the machine based on the tilt data. The method further includes determining an ultraviolet lamp as a target to be adjusted based on the tilt direction, and obtaining an adjustment range of the target ultraviolet lamp based on the calculated tilt amplitude, and sending the adjustment range to an ultraviolet lamp adjustment device to adjust the target ultraviolet lamp. So that ultraviolet light emitted by the target ultraviolet lamp can illuminate the product to be irradiated on the platform in parallel.

Abstract: A bonding device includes a body defining a cavity, a controller provided in the cavity, an intake device provided on the body and configured to fill gas into the cavity under the control of the controller, an exhaust device provided on the body and configured to remove the gas from the cavity under the control of the controller, a heating device provided in the cavity and configured to heat the gas in the cavity under the control of the controller, and a cooling device provided on a side of the cavity and configured to dissipate heat from the cavity. The intake device and the exhaust device are in communication with the cavity. The heating device, the intake device, and the exhaust device are electrically coupled to the controller.

Abstract: The present disclosure relates to a culture medium having an agar gel forming by at least one plant growth nutrient, agar powder and water, wherein the agar gel is 100 wt %. A culture medium manufacturing method, a culture medium structure and a culture medium structure usage method are also illustrated in the present disclosure. The culture medium structure has a culture medium of the above culture medium, a seeding board for receiving the culture medium layer, wherein the seeding board has a hollow body which has a top hole, a bottom hole opposite to the top hole and a top base disposed on a top peripheral of the hollow body, and the hollow body and the top base are integrally formed. Via the culture medium of the solid agar gel having the plant growth nutrient, growth health and quality of crops are enhanced.

Abstract: A light source module includes a light guide plate, a light source and a light regulating element. The light guide plate has a first light emitting surface and a second light emitting surface, and a light incident surface connected between the first light emitting surface and the second light emitting surface. The second light emitting surface has a plurality of microstructures. The light source is disposed adjacent to the light incident surface. The light regulating element is disposed adjacent to the second light emitting surface. A dual display device including the light source module, a first display panel and a second display panel is also provided. The first display panel is disposed on a side of the light guide plate facing the first light emitting surface. The second display panel is disposed on a side of the light regulating element that is away from the light guide plate.

Abstract: The invention provides a display device, which includes a display panel and at least one optical device. The display panel has a display region and a display surface. The at least one optical device is overlapped with the display panel. The optical device has a low-reflectivity sealant pattern. An angle of 45 degrees is included between the display surface of the display panel and a connecting line of a side edge of the display region and the low-reflectivity sealant pattern. An inner edge of the low-reflectivity sealant pattern and the display region are located on the same side of the connecting line. The display device of the invention has good light emitting uniformity at different viewing angles.

Abstract: A light source module includes a light guide plate, a first inverse prism sheet, a second inverse prism sheet, and a light source. The light guide plate has a light incident surface, a first light emitting surface and an opposing second light emitting surface. The second light emitting surface has a plurality of microstructures. Each microstructure is a recessed structure. The first inverse prism sheet is disposed beside the first light emitting surface of the light guide plate. The first inverse prism sheet includes a plurality of first prism columns. The first prism columns face the first light emitting surface. The second inverse prism sheet is disposed beside the second light emitting surface of the light guide plate. The second inverse prism sheet includes a plurality of second prism columns. The second prism columns face the second light emitting surface. The light source is disposed beside the light incident surface.

Abstract: A light source module includes a light guide plate, a light source and a light regulating element. The light guide plate has a first light emitting surface and a second light emitting surface, and a light incident surface connected between the first light emitting surface and the second light emitting surface. The second light emitting surface has a plurality of microstructures. The light source is disposed adjacent to the light incident surface. The light regulating element is disposed adjacent to the second light emitting surface. A dual display device including the light source module, a first display panel and a second display panel is also provided. The first display panel is disposed on a side of the light guide plate facing the first light emitting surface. The second display panel is disposed on a side of the light regulating element that is away from the light guide plate.

Abstract: A light source module includes a light guide plate, a first inverse prism sheet, a second inverse prism sheet, and a light source. The light guide plate has a light incident surface, a first light emitting surface and an opposing second light emitting surface. The second light emitting surface has a plurality of microstructures. Each microstructure is a concave structure. The first inverse prism sheet is disposed beside the first light emitting surface of the light guide plate. The first inverse prism sheet includes a plurality of first prism columns. The first prism columns face the first light emitting surface. The second inverse prism sheet is disposed beside the second light emitting surface of the light guide plate. The second inverse prism sheet includes a plurality of second prism columns. The second prism columns face the second light emitting surface. The light source is disposed beside the light incident surface.

Abstract: Provided are lyophilized formulations comprising pegylated arginine deiminase (ADI-PEG) and related reconstituted liquid compositions and methods of using the compositions for arginine depletion therapies, including for the treatment of various cancers.

Abstract: A server power transformer structure includes: a first iron core, a first projection being configured thereon; an axle body, in combination with the first projection, and configured with four copper foils and first spools, each copper foil, first spool being respectively put around the axle body, at least one first, second, third, fourth connection portion being extended from bottoms of the respective copper foils, and the first spool being sandwiched between each two adjacent copper foils; a second iron core, a second projection being configured thereon, a second spool being put around the second projection, and the second projection being in combination with the axle body; and a solder bar, having a combination portion, first and second through holes, the combination portion being in electric connection with a main board, the connection portions being inserted in and bonded with the respective through holes.

Abstract: An exemplary image sensor module includes a plate, an image sensor, and a number of conductive wires. The plate includes a top surface, a bottom surface, an light passing through hole, and a number of conductive pads on the top surface. The sensor includes a first surface and a number of bonding pads corresponding to the respective conductive pads. The first surface opposes the bottom surface. The first surface includes a light sensitive region aligned with the through hole, and a light insensitive region surrounding the light sensitive region. The insensitive region is mounted on the bottom surface. The bonding pads are arranged on the light insensitive region. The wires pass through the light passing through hole, and respectively electrically connect the bonding pads to the corresponding conductive pads.

Abstract: An exemplary image sensor module includes a plate, an image sensor, and a number of conductive wires. The plate includes a top surface, a bottom surface, a light passing through hole, a number of spaced receiving holes extending through the top surface and the bottom surface, and a number of conductive pads on the top surface. The receiving holes surround the through hole. The sensor includes a first surface and a number of bonding pads corresponding to the respective conductive pads. The first surface opposes the bottom surface, and is mounted on the bottom surface. The first surface includes a light sensitive region aligned with the through hole, and a light insensitive region surrounding the light sensitive region. The bonding pads are arranged on the light insensitive region. The wires pass through the respective receiving holes, and respectively electrically connect the bonding pads to the corresponding conductive pads.

Abstract: A light source device for a backlight module, including a heat sink; and a light bar including a plurality of light emitting diodes (LEDs) and a substrate on which the LEDs are electrically provided. The substrate is bonded to the heat sink via a bonding portion through which heat generated by LEDs is transferred to the heat sink. Also, a method for manufacturing a light source device, including providing a light bar having a plurality of LEDs thereon; providing a heat sink; and bonding a substrate of the light bar to an upper surface of the heat sink such that they are integrated firmly into one piece. In this way, the heat dissipation effect can be improved by means of preventing the substrate of the light bar from deforming and further separating from the heat sink.

Abstract: A camera module includes a square substrate, an image sensor, and a lens module. The square substrate includes a mounting surface. The mounting surface includes two opposing first sides and two opposing second sides perpendicular to the two first sides. The square substrate includes two first protrusions respectively arranged on the center of the two first sides and two second protrusions respectively arranged on the center of the two second sides. The image sensor is fixed on the mounting surface. The lens module is mounted on the substrate, abutting against the two first protrusions and the two second protrusions and housing the image sensor.