Patents by Inventor Wen Chin Tseng

Wen Chin Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7706663
    Abstract: Systems and methods for deriving content information about a work of multimedia content and embedding the derived content information in a multimedia bitstream to form a hybrid multimedia bitstream are disclosed. The embedded derived content information may be extracted from the multimedia bitstream by an executable module to assist in compressing the performance duration of the multimedia bitstream.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: April 27, 2010
    Assignee: Cyberlink Corp.
    Inventors: Jau Hsiung Huang, Ho Chao Huang, Wen Chin Tseng
  • Publication number: 20040000375
    Abstract: A multi-layer insert ring for engaging a shadow ring in a plasma etch chamber which includes at least two layers stacked together in an opening of the shadow ring. The multi-layer insert ring may be constructed by two layers or three layers by utilizing ground, reprocessed insert rings resulting in significant cost savings. Each of the layers of the multi-layer insert rings has a planar top surface and a planar bottom surface that is parallel to the planar top surface. Only the top layer need to be replaced after repeated usage of the insert ring in plasma etching processes.
    Type: Application
    Filed: June 27, 2002
    Publication date: January 1, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsiang-Hsing Liu, Chung-Feng Huang, Yang-Kai Fan, Kwang-Niang Tan, Wen-Chin Tseng