Patents by Inventor Wen-Chin Wu
Wen-Chin Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250133769Abstract: A 3D trenched MOSFET device includes a semiconductor substrate, an epitaxial layer, an epitaxial layer, a doped area, first doped wells, second doped wells, a trenched gate, first heavily-doped areas, a patterned insulation layer, and a conduction layer. The epitaxial layer is formed on the semiconductor substrate. The doped area, the first doped wells, and the second doped wells are formed in the epitaxial layer. The trenched gate, formed in the epitaxial layer and the first doped wells, penetrates through the doped area and surrounds the second doped wells. The bottoms of the first doped wells and the second doped wells are lower than the bottom of the trenched gate. The first heavily-doped areas are formed in the doped area. The first heavily-doped areas respectively surround the second doped wells and the trenched gate surrounds the first heavily-doped areas.Type: ApplicationFiled: October 24, 2023Publication date: April 24, 2025Applicant: Taipei ANJET CorporationInventors: Nobuo MACHIDA, Wen-Chin WU
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Publication number: 20250012143Abstract: An actuating system for a window shade includes a transmission axle rotatable about a longitudinal axis thereof, and a speed stabilizer including a housing having an inner wall, and a rotary plate disposed inside the housing and configured to rotationally couple to the transmission axle, the rotary plate carrying a plurality of friction elements angularly spaced apart from one another about the longitudinal axis of the transmission axis, the rotary plate being rotatable along with the transmission axle with the friction elements rubbing against the inner wall of the housing.Type: ApplicationFiled: July 3, 2024Publication date: January 9, 2025Applicant: Teh Yor Co., Ltd.Inventors: Chin-Tien HUANG, Wen-Chin WU
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Publication number: 20240146297Abstract: A gate driving device includes an operational amplifier, two impedances, a multiplexer, and an UVLO circuit. The operational amplifier has an output coupled to the gate of the SiC MOSFET, a positive power terminal coupled to a positive power rail, and a negative power terminal coupled to a negative power rail. The impedances are coupled in series and coupled between the output of the amplifier and a low-voltage terminal. The UVLO circuit is coupled to the multiplexer and the positive power rail and coupled to the positive power voltage of the positive power rail, a driving voltage, and an UVLO voltage. The UVLO circuit controls the multiplexer to transmit an off voltage or an on voltage to the positive input of the operational amplifier based on the positive power voltage, the driving voltage, and the UVLO voltage, thereby turning on or off the SiC MOSFET.Type: ApplicationFiled: October 28, 2022Publication date: May 2, 2024Applicant: Taipei ANJET CorporationInventors: Man Hay PONG, Wen-Chin Wu
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Patent number: 11962292Abstract: A gate driving device includes an operational amplifier, two impedances, a multiplexer, and an UVLO circuit. The operational amplifier has an output coupled to the gate of the SiC MOSFET, a positive power terminal coupled to a positive power rail, and a negative power terminal coupled to a negative power rail. The impedances are coupled in series and coupled between the output of the amplifier and a low-voltage terminal. The UVLO circuit is coupled to the multiplexer and the positive power rail and coupled to the positive power voltage of the positive power rail, a driving voltage, and an UVLO voltage. The UVLO circuit controls the multiplexer to transmit an off voltage or an on voltage to the positive input of the operational amplifier based on the positive power voltage, the driving voltage, and the UVLO voltage, thereby turning on or off the SiC MOSFET.Type: GrantFiled: October 28, 2022Date of Patent: April 16, 2024Assignee: TAIPEI ANJET CORPORATIONInventors: Man Hay Pong, Wen-Chin Wu
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Patent number: 11769841Abstract: A method for fabricating a junction barrier Schottky diode device is disclosed. The junction barrier Schottky device includes an N-type semiconductor layer, a plurality of first P-type doped areas, a plurality of second P-type doped areas, and a conductive metal layer. The first P-type doped areas and the second P-type doped are formed in the N-type semiconductor layer. The second P-type doped areas are self-alignedly formed above the first P-type doped areas. The spacing between every neighboring two of the second P-type doped areas is larger than the spacing between every neighboring two of the first P-type doped areas. The conductive metal layer, formed on the N-type semiconductor layer, covers the first P-type doped areas and the second P-type doped areas.Type: GrantFiled: September 19, 2022Date of Patent: September 26, 2023Assignee: TAIPEI ANJET CORPORATIONInventors: Nobuo Machida, Wen-Tsung Chang, Wen-Chin Wu
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Patent number: 11646382Abstract: A junction barrier Schottky diode device and a method for fabricating the same is disclosed. In the junction barrier Schottky device includes an N-type semiconductor layer, a plurality of first P-type doped areas, a plurality of second P-type doped areas, and a conductive metal layer. The first P-type doped areas and the second P-type doped are formed in the N-type semiconductor layer. The second P-type doped areas are self-alignedly formed above the first P-type doped areas. The spacing between every neighboring two of the second P-type doped areas is larger than the spacing between every neighboring two of the first P-type doped areas. The conductive metal layer, formed on the N-type semiconductor layer, covers the first P-type doped areas and the second P-type doped areas.Type: GrantFiled: May 11, 2021Date of Patent: May 9, 2023Assignee: TAIPEI ANJET CORPORATIONInventors: Nobuo Machida, Wen-Tsung Chang, Wen-Chin Wu
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Publication number: 20230021015Abstract: A method for fabricating a junction barrier Schottky diode device is disclosed. The junction barrier Schottky device includes an N-type semiconductor layer, a plurality of first P-type doped areas, a plurality of second P-type doped areas, and a conductive metal layer. The first P-type doped areas and the second P-type doped are formed in the N-type semiconductor layer. The second P-type doped areas are self-alignedly formed above the first P-type doped areas. The spacing between every neighboring two of the second P-type doped areas is larger than the spacing between every neighboring two of the first P-type doped areas. The conductive metal layer, formed on the N-type semiconductor layer, covers the first P-type doped areas and the second P-type doped areas.Type: ApplicationFiled: September 19, 2022Publication date: January 19, 2023Inventors: Nobuo MACHIDA, Wen-Tsung CHANG, Wen-Chin Wu
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Publication number: 20220367731Abstract: A junction barrier Schottky diode device and a method for fabricating the same is disclosed. In the junction barrier Schottky device includes an N-type semiconductor layer, a plurality of first P-type doped areas, a plurality of second P-type doped areas, and a conductive metal layer. The first P-type doped areas and the second P-type doped are formed in the N-type semiconductor layer. The second P-type doped areas are self-alignedly formed above the first P-type doped areas. The spacing between every neighboring two of the second P-type doped areas is larger than the spacing between every neighboring two of the first P-type doped areas. The conductive metal layer, formed on the N-type semiconductor layer, covers the first P-type doped areas and the second P-type doped areas.Type: ApplicationFiled: May 11, 2021Publication date: November 17, 2022Inventors: Nobuo Machida, Wen-Tsung Chang, Wen-Chin Wu
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Patent number: 11423149Abstract: A method securely executing an extensible firmware application is performed by a computer apparatus. The computer apparatus includes a firmware volume and a boot loader. The firmware volume includes a firmware application module to be executed, has passed a security check, and is attached with a secure encryption signature. The boot loader is attached with a first valid digital signature, and is verifiable by a secure boot certificate signature database of the computer apparatus. When the firmware application module is executed, the boot loader or the secure boot certificate signature database of the computer apparatus first verifies a secure encryption signature of the firmware volume, and the boot loader then loads the firmware application module to a buffer memory for further reading and execution, such that execution of the firmware application module is allowed and is executed securely in a secure boot mode under supervision of the boot loader.Type: GrantFiled: August 7, 2020Date of Patent: August 23, 2022Assignee: INSYDE SOFTWARE CORP.Inventor: Wen-Chin Wu
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Publication number: 20220247903Abstract: An electronic device includes an outer casing, a sensing module, and a thermal insulation module. The sensing module includes a circuit board and a sensing unit and a heating unit which are disposed on the circuit board. The heating unit is configured to heat the sensing unit. The thermal insulation module is accommodated within the outer casing and includes a casing assembly and a thermal insulation filler. The sensing module is accommodated within the casing assembly. The thermal insulation filler is arranged between the circuit board of the sensing module and an inner surface of the casing assembly so as to contact and cover the heating unit.Type: ApplicationFiled: March 29, 2021Publication date: August 4, 2022Inventors: Po-Liang Huang, Wen-Chin Wu, You-Xin Liu
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Publication number: 20210103661Abstract: A method securely executing an extensible firmware application is performed by a computer apparatus. The computer apparatus includes a firmware volume and a boot loader. The firmware volume includes a firmware application module to be executed, has passed a security check, and is attached with a secure encryption signature. The boot loader is attached with a first valid digital signature, and is verifiable by a secure boot certificate signature database of the computer apparatus. When the firmware application module is executed, the boot loader or the secure boot certificate signature database of the computer apparatus first verifies a secure encryption signature of the firmware volume, and the boot loader then loads the firmware application module to a buffer memory for further reading and execution, such that execution of the firmware application module is allowed and is executed securely in a secure boot mode under supervision of the boot loader.Type: ApplicationFiled: August 7, 2020Publication date: April 8, 2021Inventor: WEN-CHIN WU
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Patent number: 10288791Abstract: An expansion card with homogenized light outputs and light-homogenizing device thereof are disclosed. The expansion card includes a circuit board and a light-homogenizing device. The circuit board includes a light-emitting device disposed on a first side edge. The light-homogenizing device includes a light-guiding body, a light-diffusion element, and a light-turning element. The light-guiding body includes a light-input side and a light-output side opposite to each other, and the light-input side is adjacent to the first side edge. The light-diffusion element is disposed on the light-input side of the light-guiding body and opposite to the light-emitting device. The light-diffusion element and the light-out side are configured to diffuse the light beams entering into the light-guiding body from the light-emitting device and form a light-transmitting path.Type: GrantFiled: August 16, 2016Date of Patent: May 14, 2019Assignee: APACER TECHNOLOGY INC.Inventors: Hua-Min Tseng, Ming-Han Chung, Wen-Chin Wu, Chien-Pang Chen
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Publication number: 20180024285Abstract: An expansion card with homogenized light outputs and light-homogenizing device thereof are disclosed. The expansion card includes a circuit board and a light-homogenizing device. The circuit board includes a light-emitting device disposed on a first side edge. The light-homogenizing device includes a light-guiding body, a light-diffusion element, and a light-turning element. The light-guiding body includes a light-input side and a light-output side opposite to each other, and the light-input side is adjacent to the first side edge. The light-diffusion element is disposed on the light-input side of the light-guiding body and opposite to the light-emitting device. The light-diffusion element and the light-out side are configured to diffuse the light beams entering into the light-guiding body from the light-emitting device and form a light-transmitting path.Type: ApplicationFiled: August 16, 2016Publication date: January 25, 2018Inventors: Hua-Min Tseng, Ming-Han Chung, Wen-Chin Wu, Chien-Pang Chen
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Patent number: 9819176Abstract: A low capacitance transient voltage suppressor is disclosed. The transient voltage suppressor comprises a first diode with a first anode thereof coupled to an I/O port. A first cathode of the first diode and a second cathode of a second diode are respectively coupled to two ends of a resistor. A second anode of the second diode is coupled to a low-voltage terminal. A third anode and a third cathode of a third diode are respectively coupled to the second cathode and the resistor. The third diode induces a third parasitic capacitance smaller than a first capacitance of the first diode and a second parasitic capacitance of the second diode, and the third parasitic capacitance in series with the first and second parasitic capacitances dominate a small capacitance in a path during normal operation.Type: GrantFiled: January 17, 2014Date of Patent: November 14, 2017Assignee: Silergy Semiconductor Technology (Hangzhou) LTDInventors: Albert Z. Wang, Wen-Chin Wu, Fei Yao, Bo Qin
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Patent number: 9787076Abstract: A carrier member includes a first section, a second section, and a third section. The first section has a first length. The second section has a second length. The first section, the third section, and the second section connect sequentially and form a U-shaped structure. The first section and the second section have curved sections. The third section has a flat section. When the second section moves relative to the first section, the first section or the second section having the curved section transform into the third section having the flat section and store a resilient recovering force, and the third section having the flat section transforms into the first section or the second section having the curved section for adjusting lengths of the first section and the second section, which prevents a cable disposed on the carrier member from interfering with other mechanism or getting knotted.Type: GrantFiled: March 28, 2016Date of Patent: October 10, 2017Assignee: Wistron CorporationInventors: Shih-Hao Li, Wen-Chin Wu
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Patent number: 9774212Abstract: A wireless charging device includes a base, a motor, a rotating member and a first transmitting coil. The base has a hollow pillar and a ring-shaped groove around the hollow pillar. The motor is movably disposed in the hollow pillar and has a rotating axle. The rotating member is connected to a first end of the rotating axle. The first transmitting coil is disposed on the rotating member. When an electronic device is placed in the ring-shaped groove, the motor drives the first transmitting coil to move and rotate to a position corresponding to a receiving coil of the electronic device, such that the first transmitting coil cooperates with the receiving coil to charge the electronic device.Type: GrantFiled: October 12, 2015Date of Patent: September 26, 2017Assignee: Wistron CorporationInventors: Wen-Chin Wu, Yi-Sheng Kao, Yao-Tsung Chang
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Patent number: 9741655Abstract: An integrated circuit common-mode electromagnetic interference filter incorporating electro-static discharge protection comprising two inductive coils is provided. A pair of primary and secondary spiral inductor coils is disposed corresponding to each other. A dielectric layer is used to separate the primary spiral inductor coil from the secondary spiral inductor coil electrically. Resistivity of a high-resistance substrate is more than 100 ?-cm for supporting the primary spiral inductor coil, the secondary spiral inductor coil and the dielectric layer thereon. The proposed filter structure can be formed in integrated circuit (IC) back-end processes and thus be extraordinarily advantageous of effectively eliminating electromagnetic interferences and having electrostatic protection effect at the same time, while having small footprint.Type: GrantFiled: January 15, 2013Date of Patent: August 22, 2017Assignee: Silergy Semiconductor Technology (Hangzhou) LTDInventors: Albert Z. Wang, Wen-Chin Wu, Shijun Wang, Nan Zhang
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Patent number: 9684336Abstract: A mechanism device includes a hinge mechanism, a holding base, a guiding member and a fixing member. The holding base is pivoted to the frame by the hinge mechanism and includes a main casing, a first holding casing and a second holding casing. The first holding casing and the second holding casing extend from two opposite sides of the main casing along a direction away from the hinge mechanism, such that the main casing, the first holding casing and the second holding casing cooperatively define a holding slot with openings formed on two sides thereof, so as to hold an electronic device. The guiding member is disposed within the holding slot and for guiding the electronic device into the holding slot. The fixing member is disposed within the holding slot and for fixing the electronic device inside the holding slot after the electronic device enters the holding slot.Type: GrantFiled: December 29, 2014Date of Patent: June 20, 2017Assignee: Wistron CorporationInventors: Chun-Peng Hsu, Chin-Hsien Chen, Wen-Chin Wu, Chien Huang
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Patent number: 9665189Abstract: A touch stylus capable of detecting pressure on its tip is disclosed in the present disclosure. The touch stylus includes a body, a tip, and a pressure sensing module disposed between the body and the tip for detecting a pressure on the tip. The pressure sensing module includes a lighting unit, a pressure sensing unit connected to the tip, and a controller electrically connected to the lighting unit and the pressure sensing unit. The pressure sensing unit detects a movement of the tip relative to the body, and generates a corresponding electrical signal. The controller receives the electrical signal to drive the lighting unit for generating a corresponding optical signal. A scintillating frequency of the optical signal and a value of the electrical signal are in direct proportion, and an optical detector can transform the optical signal into the pressure on the tip.Type: GrantFiled: June 21, 2016Date of Patent: May 30, 2017Assignee: Wistron CorporationInventors: Kuo-Hsing Wang, Pei-Chen Chin, Pin-Hsien Su, Wen-Chin Wu, Yi-Sheng Kao
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Publication number: 20170149229Abstract: A carrier member includes a first section, a second section, and a third section. The first section has a first length. The second section has a second length. The first section, the third section, and the second section connect sequentially and form a U-shaped structure. The first section and the second section have curved sections. The third section has a flat section. When the second section moves relative to the first section, the first section or the second section having the curved section transform into the third section having the flat section and store a resilient recovering force, and the third section having the flat section transforms into the first section or the second section having the curved section for adjusting lengths of the first section and the second section, which prevents a cable disposed on the carrier member from interfering with other mechanism or getting knotted.Type: ApplicationFiled: March 28, 2016Publication date: May 25, 2017Inventors: Shih-Hao Li, Wen-Chin Wu