Abstract: An internal rotor type nail drive device of electric nail gun, comprising a nailing rod and an internal rotor type rotary actuator that can output a specific rotation angle and can drive the nailing rod to move downward for nailing. Specifically, the rotary actuator comprises a stator and a rotor arranged inside the stator, even groups of electromagnetic mutual action components are configured in pairs between the stator and the rotor, to generate a tangential force to drive the rotor to rotate for a specific rotation angle, and to drive the nailing rod to move for a nailing stroke. The nailing stroke can be determined by a specific rotation angle. Thus, through the above configuration of the rotary actuator, the structure of the electric nail gun can be simplified, and the kinetic energy for nailing can be increased.

Abstract: A gate driving device includes an operational amplifier, two impedances, a multiplexer, and an UVLO circuit. The operational amplifier has an output coupled to the gate of the SiC MOSFET, a positive power terminal coupled to a positive power rail, and a negative power terminal coupled to a negative power rail. The impedances are coupled in series and coupled between the output of the amplifier and a low-voltage terminal. The UVLO circuit is coupled to the multiplexer and the positive power rail and coupled to the positive power voltage of the positive power rail, a driving voltage, and an UVLO voltage. The UVLO circuit controls the multiplexer to transmit an off voltage or an on voltage to the positive input of the operational amplifier based on the positive power voltage, the driving voltage, and the UVLO voltage, thereby turning on or off the SiC MOSFET.

Abstract: A gate driving device includes an operational amplifier, two impedances, a multiplexer, and an UVLO circuit. The operational amplifier has an output coupled to the gate of the SiC MOSFET, a positive power terminal coupled to a positive power rail, and a negative power terminal coupled to a negative power rail. The impedances are coupled in series and coupled between the output of the amplifier and a low-voltage terminal. The UVLO circuit is coupled to the multiplexer and the positive power rail and coupled to the positive power voltage of the positive power rail, a driving voltage, and an UVLO voltage. The UVLO circuit controls the multiplexer to transmit an off voltage or an on voltage to the positive input of the operational amplifier based on the positive power voltage, the driving voltage, and the UVLO voltage, thereby turning on or off the SiC MOSFET.

Abstract: A method for fabricating a junction barrier Schottky diode device is disclosed. The junction barrier Schottky device includes an N-type semiconductor layer, a plurality of first P-type doped areas, a plurality of second P-type doped areas, and a conductive metal layer. The first P-type doped areas and the second P-type doped are formed in the N-type semiconductor layer. The second P-type doped areas are self-alignedly formed above the first P-type doped areas. The spacing between every neighboring two of the second P-type doped areas is larger than the spacing between every neighboring two of the first P-type doped areas. The conductive metal layer, formed on the N-type semiconductor layer, covers the first P-type doped areas and the second P-type doped areas.

Abstract: A junction barrier Schottky diode device and a method for fabricating the same is disclosed. In the junction barrier Schottky device includes an N-type semiconductor layer, a plurality of first P-type doped areas, a plurality of second P-type doped areas, and a conductive metal layer. The first P-type doped areas and the second P-type doped are formed in the N-type semiconductor layer. The second P-type doped areas are self-alignedly formed above the first P-type doped areas. The spacing between every neighboring two of the second P-type doped areas is larger than the spacing between every neighboring two of the first P-type doped areas. The conductive metal layer, formed on the N-type semiconductor layer, covers the first P-type doped areas and the second P-type doped areas.

Abstract: A method for fabricating a junction barrier Schottky diode device is disclosed. The junction barrier Schottky device includes an N-type semiconductor layer, a plurality of first P-type doped areas, a plurality of second P-type doped areas, and a conductive metal layer. The first P-type doped areas and the second P-type doped are formed in the N-type semiconductor layer. The second P-type doped areas are self-alignedly formed above the first P-type doped areas. The spacing between every neighboring two of the second P-type doped areas is larger than the spacing between every neighboring two of the first P-type doped areas. The conductive metal layer, formed on the N-type semiconductor layer, covers the first P-type doped areas and the second P-type doped areas.

Abstract: A junction barrier Schottky diode device and a method for fabricating the same is disclosed. In the junction barrier Schottky device includes an N-type semiconductor layer, a plurality of first P-type doped areas, a plurality of second P-type doped areas, and a conductive metal layer. The first P-type doped areas and the second P-type doped are formed in the N-type semiconductor layer. The second P-type doped areas are self-alignedly formed above the first P-type doped areas. The spacing between every neighboring two of the second P-type doped areas is larger than the spacing between every neighboring two of the first P-type doped areas. The conductive metal layer, formed on the N-type semiconductor layer, covers the first P-type doped areas and the second P-type doped areas.

Abstract: A method securely executing an extensible firmware application is performed by a computer apparatus. The computer apparatus includes a firmware volume and a boot loader. The firmware volume includes a firmware application module to be executed, has passed a security check, and is attached with a secure encryption signature. The boot loader is attached with a first valid digital signature, and is verifiable by a secure boot certificate signature database of the computer apparatus. When the firmware application module is executed, the boot loader or the secure boot certificate signature database of the computer apparatus first verifies a secure encryption signature of the firmware volume, and the boot loader then loads the firmware application module to a buffer memory for further reading and execution, such that execution of the firmware application module is allowed and is executed securely in a secure boot mode under supervision of the boot loader.

Abstract: An electronic device includes an outer casing, a sensing module, and a thermal insulation module. The sensing module includes a circuit board and a sensing unit and a heating unit which are disposed on the circuit board. The heating unit is configured to heat the sensing unit. The thermal insulation module is accommodated within the outer casing and includes a casing assembly and a thermal insulation filler. The sensing module is accommodated within the casing assembly. The thermal insulation filler is arranged between the circuit board of the sensing module and an inner surface of the casing assembly so as to contact and cover the heating unit.

Abstract: A method securely executing an extensible firmware application is performed by a computer apparatus. The computer apparatus includes a firmware volume and a boot loader. The firmware volume includes a firmware application module to be executed, has passed a security check, and is attached with a secure encryption signature. The boot loader is attached with a first valid digital signature, and is verifiable by a secure boot certificate signature database of the computer apparatus. When the firmware application module is executed, the boot loader or the secure boot certificate signature database of the computer apparatus first verifies a secure encryption signature of the firmware volume, and the boot loader then loads the firmware application module to a buffer memory for further reading and execution, such that execution of the firmware application module is allowed and is executed securely in a secure boot mode under supervision of the boot loader.

Abstract: An expansion card with homogenized light outputs and light-homogenizing device thereof are disclosed. The expansion card includes a circuit board and a light-homogenizing device. The circuit board includes a light-emitting device disposed on a first side edge. The light-homogenizing device includes a light-guiding body, a light-diffusion element, and a light-turning element. The light-guiding body includes a light-input side and a light-output side opposite to each other, and the light-input side is adjacent to the first side edge. The light-diffusion element is disposed on the light-input side of the light-guiding body and opposite to the light-emitting device. The light-diffusion element and the light-out side are configured to diffuse the light beams entering into the light-guiding body from the light-emitting device and form a light-transmitting path.

Abstract: An expansion card with homogenized light outputs and light-homogenizing device thereof are disclosed. The expansion card includes a circuit board and a light-homogenizing device. The circuit board includes a light-emitting device disposed on a first side edge. The light-homogenizing device includes a light-guiding body, a light-diffusion element, and a light-turning element. The light-guiding body includes a light-input side and a light-output side opposite to each other, and the light-input side is adjacent to the first side edge. The light-diffusion element is disposed on the light-input side of the light-guiding body and opposite to the light-emitting device. The light-diffusion element and the light-out side are configured to diffuse the light beams entering into the light-guiding body from the light-emitting device and form a light-transmitting path.

Abstract: A low capacitance transient voltage suppressor is disclosed. The transient voltage suppressor comprises a first diode with a first anode thereof coupled to an I/O port. A first cathode of the first diode and a second cathode of a second diode are respectively coupled to two ends of a resistor. A second anode of the second diode is coupled to a low-voltage terminal. A third anode and a third cathode of a third diode are respectively coupled to the second cathode and the resistor. The third diode induces a third parasitic capacitance smaller than a first capacitance of the first diode and a second parasitic capacitance of the second diode, and the third parasitic capacitance in series with the first and second parasitic capacitances dominate a small capacitance in a path during normal operation.

Abstract: A carrier member includes a first section, a second section, and a third section. The first section has a first length. The second section has a second length. The first section, the third section, and the second section connect sequentially and form a U-shaped structure. The first section and the second section have curved sections. The third section has a flat section. When the second section moves relative to the first section, the first section or the second section having the curved section transform into the third section having the flat section and store a resilient recovering force, and the third section having the flat section transforms into the first section or the second section having the curved section for adjusting lengths of the first section and the second section, which prevents a cable disposed on the carrier member from interfering with other mechanism or getting knotted.

Abstract: A wireless charging device includes a base, a motor, a rotating member and a first transmitting coil. The base has a hollow pillar and a ring-shaped groove around the hollow pillar. The motor is movably disposed in the hollow pillar and has a rotating axle. The rotating member is connected to a first end of the rotating axle. The first transmitting coil is disposed on the rotating member. When an electronic device is placed in the ring-shaped groove, the motor drives the first transmitting coil to move and rotate to a position corresponding to a receiving coil of the electronic device, such that the first transmitting coil cooperates with the receiving coil to charge the electronic device.

Abstract: An integrated circuit common-mode electromagnetic interference filter incorporating electro-static discharge protection comprising two inductive coils is provided. A pair of primary and secondary spiral inductor coils is disposed corresponding to each other. A dielectric layer is used to separate the primary spiral inductor coil from the secondary spiral inductor coil electrically. Resistivity of a high-resistance substrate is more than 100 ?-cm for supporting the primary spiral inductor coil, the secondary spiral inductor coil and the dielectric layer thereon. The proposed filter structure can be formed in integrated circuit (IC) back-end processes and thus be extraordinarily advantageous of effectively eliminating electromagnetic interferences and having electrostatic protection effect at the same time, while having small footprint.

Abstract: A mechanism device includes a hinge mechanism, a holding base, a guiding member and a fixing member. The holding base is pivoted to the frame by the hinge mechanism and includes a main casing, a first holding casing and a second holding casing. The first holding casing and the second holding casing extend from two opposite sides of the main casing along a direction away from the hinge mechanism, such that the main casing, the first holding casing and the second holding casing cooperatively define a holding slot with openings formed on two sides thereof, so as to hold an electronic device. The guiding member is disposed within the holding slot and for guiding the electronic device into the holding slot. The fixing member is disposed within the holding slot and for fixing the electronic device inside the holding slot after the electronic device enters the holding slot.

Abstract: A touch stylus capable of detecting pressure on its tip is disclosed in the present disclosure. The touch stylus includes a body, a tip, and a pressure sensing module disposed between the body and the tip for detecting a pressure on the tip. The pressure sensing module includes a lighting unit, a pressure sensing unit connected to the tip, and a controller electrically connected to the lighting unit and the pressure sensing unit. The pressure sensing unit detects a movement of the tip relative to the body, and generates a corresponding electrical signal. The controller receives the electrical signal to drive the lighting unit for generating a corresponding optical signal. A scintillating frequency of the optical signal and a value of the electrical signal are in direct proportion, and an optical detector can transform the optical signal into the pressure on the tip.

Abstract: A carrier member includes a first section, a second section, and a third section. The first section has a first length. The second section has a second length. The first section, the third section, and the second section connect sequentially and form a U-shaped structure. The first section and the second section have curved sections. The third section has a flat section. When the second section moves relative to the first section, the first section or the second section having the curved section transform into the third section having the flat section and store a resilient recovering force, and the third section having the flat section transforms into the first section or the second section having the curved section for adjusting lengths of the first section and the second section, which prevents a cable disposed on the carrier member from interfering with other mechanism or getting knotted.

Abstract: A wireless charging transceiver device includes an energy storage module, a coil, a switch module, a rectifier circuit, and a resonant circuit. The coil is used to induce an external magnetic field or receive an external charging signal, and is used to transmit a wireless charging signal. The switch module is used to be coupled between the energy storage module and the coil through a first or second electrical path. The rectifier circuit is coupled between the energy storage module and the switch module, and is sited in the first electrical path, and rectifying a first inducing current which is induced from the external magnetic field in a first mode. The resonant circuit is coupled between the energy storage module and the switch module, and is sited in the second electrical path.