Patents by Inventor Wen-Ching Chan

Wen-Ching Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Model maturity state evaluation system
    Patent number: 11698997
    Abstract: A method, apparatus, system, and computer program product for evaluating a maturity of a model for a product. A selected maturity state is determined by a computer system for the model for evaluation. A determination is made by the computer system as to whether the model meets a set of criteria for the selected maturity state and a confidence level for the selected maturity state. A model action is performed by the computer system using the model when the model meets the set of criteria for the selected maturity state and the confidence level for the selected maturity state.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: July 11, 2023
    Assignee: The Boeing Comapny
    Inventors: Nicholas J. Kramer, Scott Christopher Haase, Steven Douglas Swaine, Jeffrey Keith Sipes, Angayarkanni Saravana, Samuel James Tutko, Terri Wen-Ching Chan, Keith Harrell, Steven Charles Holt, Walter S. Wall, Neil Ebarle, Shannon Fowler
  • MODEL MATURITY STATE EVALUATION SYSTEM
    Publication number: 20210209260
    Abstract: A method, apparatus, system, and computer program product for evaluating a maturity of a model for a product. A selected maturity state is determined by a computer system for the model for evaluation. A determination is made by the computer system as to whether the model meets a set of criteria for the selected maturity state and a confidence level for the selected maturity state. A model action is performed by the computer system using the model when the model meets the set of criteria for the selected maturity state and the confidence level for the selected maturity state.
    Type: Application
    Filed: January 2, 2020
    Publication date: July 8, 2021
    Inventors: Nicholas J. Kramer, Scott Christopher Hasse, Steven Douglas Swaine, Jeffrey Keith Sipes, Angayarkanni Saravana, Samuel James Tutko, Terri Wen-Ching Chan, Keith Harrell, Steven Charles Holt, Walter S. Wall, Neil Ebarle, Shannon Fowler
  • Methods and kits for detecting Kawasaki disease
    Patent number: 10358676
    Abstract: Kits for detecting Kawasaki disease, containing an agent for sequencing or measuring the expression level of one or more of the following: miR-941, miR-182-5p and miR-183-5p are provided. Methods for detecting Kawasaki disease in a subject, comprising the identifying of one or more of the following in the subject: miR-941, miR-182-5p and miR-183-5p, are also provided.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: July 23, 2019
    Assignee: Kaohsiung Chang Gung Memorial Hospital
    Inventors: Ho-Chang Kuo, Sung-Chou Li, Wen-Ching Chan
  • METHODS AND KITS FOR DETECTING KAWASAKI DISEASE
    Publication number: 20160289764
    Abstract: Kits for detecting Kawasaki disease, containing an agent for sequencing or measuring the expression level of one or more of the following: miR-941, miR-182-5p and miR-183-5p are provided. Methods for detecting Kawasaki disease in a subject, comprising the identifying of one or more of the following in the subject: miR-941, miR-182-5p and miR-183-5p, are also provided.
    Type: Application
    Filed: February 25, 2016
    Publication date: October 6, 2016
    Inventors: Ho-Chang KUO, Sung-Chou LI, Wen-Ching CHAN
  • INTERPOSER AND FABRICATION METHOD THEREOF
    Publication number: 20160050753
    Abstract: A method for fabricating an interposer is provided, which includes the steps of: providing a substrate body having opposite first and second sides and a plurality of conductive through holes communicating the first and second sides; forming an insulating layer on the first side of the substrate body, wherein the insulating layer has a plurality of openings correspondingly exposing the conductive through holes; and forming a plurality of conductive pads in the openings of the insulating layer, wherein the conductive pads are electrically connected to the corresponding conductive through holes, thereby dispensing with the conventional wet etching process and hence preventing an undercut structure from being formed under the conductive pads.
    Type: Application
    Filed: June 15, 2015
    Publication date: February 18, 2016
    Inventors: Wen-Ching Chan, Chien-Min Lin, Po-Yi Wu, Chun-Hung Lu