Abstract: A non-contact control system includes a control circuit board, a Beacon Gateway, and a mobile electronic device with the original structure of the device to be controlled. The main feature is that when the application of the mobile electronic device is activated, the mobile electronic device displays a control screen for the user to click to control the actuating of the main body. Therefore, the user does not need to touch physical buttons and make a sound in the control operation, so direct contact and droplet infection can be avoided.

Abstract: Compositions, kits and methods are provided for restoring moisture and retarding the aging process in mature skin. In general, ions, combined amino acids, fatty acids and polyols are included in a physiologically acceptable medium. The compositions, kits and methods can be used as cosmetics, cosmeceuticals or pharmaceuticals for improving mature skin condition, and preventing or treating the aging process and/or lack of moisture.

Abstract: A thin image capturing apparatus includes a circuit substrate having at least one electronic component, a light sensing element packaged onto the circuit substrate, and a camera lens installed onto the light sensing element for capturing images.

Abstract: A thin image capturing apparatus includes a circuit substrate having at least one electronic component, a light sensing element packaged onto the circuit substrate, and a camera lens installed onto the light sensing element for capturing images.

Abstract: A multi-image retrieving system includes lenses of multiple image retrieving units arranged close to one another with a virtual boundary of filed field keeping a given spacing in parallel with that of an abutted lens without overlapping from each other to combine into a large scope of filed angle of photography and an image retrieved by an individual lens being processed using an image processor to display an image picture achieves the purpose of minimizing blind spots on both sides, expanding filed angle and image retrieving scope, and maintaining normal reproduction of the image retrieved.

Abstract: A multi-image retrieving system includes lenses of multiple image retrieving units arranged close to one another with a virtual boundary of filed field keeping a given spacing in parallel with that of an abutted lens without overlapping from each other to combine into a large scope of filed angle of photography and an image retrieved by an individual lens being processed using an image processor to display an image picture achieves the purpose of minimizing blind spots on both sides, expanding filed angle and image retrieving scope, and maintaining normal reproduction of the image retrieved.

Abstract: A flip chip packaging method that protects a sensing area of an image sensor from contamination primarily comprises: a transmitting substrate having a surface with a predetermined area forming a metal layer thereon which includes a circuit and at least one enclosure encircling said predetermined area; providing an image sensor with the sensing area thereof disposed according to said predetermined area and the bond pads thereof electrically connected to the circuit on the surface of the transmitting substrate; and filling adhesive around the image sensor forming an airtight seal after the adhesive solidifies forming the flip chip packaging of the image sensor.

Abstract: An image pickup module with an image sensor packaged by way of flip chip, including: a base seat formed with a cavity and having a lead frame embedded in the base seat, the lead frame having multiple outer leads for connecting with a circuit board and multiple inner leads extending from the outer leads into the cavity of the base seat; an image sensor inlaid in the cavity of the base seat, the image sensor being composed of a glass substrate and an image sensing chip bonded with a surface of the glass substrate by way of flip chip, multiple circuits being laid on the surface of the glass substrate for electrically connecting with the image sensing chip and the inner leads; and a soft pad abutting against lower sides of the inner leads.

Abstract: A chip scale package (CSP) structure for an image sensor includes a semi-conductor image sense chip and multiple bonding pads formed on a top face of the semi-conductor image sense chip. A conducting wire extends from each of the multiple bonding pads by wire-bonding. Liquefied jelly-like material is covered with the top face of the semi-conductor image sense chip and forming a transparent layer on the top face of the semi-conductor image sense chip after drying up. The transparent layer has a thickness being equal to a height of each of the conduct wire relative to the top face of the semi-conductor image sense chip.

Abstract: An image sensor with a protective package structure for the sensing area is provided. The image sensor includes a transparent substrate and a semiconductor image-sensing chip. A conductive interconnection circuit is formed on at least the lower surface of the transparent substrate. The semiconductor image-sensing chip is electrically connected with the electric interconnection circuit of the substrate. A perimeter of the chip is underfilled with gum material. A dike is formed around the image-sensing area of the semiconductor image-sensing chip. The electric contact of the semiconductor image-sensing chip is positioned on outer side of the dike.

Abstract: An image sensing module includes a base with an image sensor and a lens assembly connected to the base. A plurality of inner legs are located on a stepped portion between the upper hole and a lower hole in the base. The inner legs extend outward to form outer legs so as to be connected to the circuit board. The image sensor is composed of an image sensing chip connected to a glass plate by way of “Flip Chip”. The glass plate is supported on the stepped portion and the inner legs on the stepped portion are connected to the wires on the glass plate. The lens assembly secures the image sensor in the upper hole so that the image sensing module is slim and easily to be manufactured.

Abstract: An image sensor with protective package structure for sensing area. The image sensor includes a transparent substrate and a semiconductor image-sensing chip. A conductive interconnection circuit is formed on at least the lower surface of the transparent substrate. The semiconductor image-sensing chip is electrically connected with the electric interconnection circuit of the substrate. A circumference of the crystal grain is underfilled with gum material. A dike is formed around the image-sensing area of the semiconductor image-sensing chip. The electric contact of the semiconductor image-sensing chip is positioned on outer side of the dike.

Abstract: A CCD and CMOS image pickup module including a circuit main board on which an image sensor (CMOS, CCD) and relevant electronic elements are laid. A lens seat is disposed on an upper edge of a package of the image sensor. The lens seat has an image pickup cylinder correspondingly positioned above a coupling transistor of the image sensor. The lens seat covers and encloses the image sensor with the connecting section of the bottom of the image pickup cylinder sealedly attaching to the periphery of the top face of the package of the image sensor. With the profile of the outer periphery of the package of the image sensor serving as a normal standard for the axis of the lens, the axis of the lens being projected onto the sensor center of the coupling transistor.

Abstract: A chip scale package (CSP) structure for an image sensor includes a semi-conductor image sense chip and multiple bonding pads formed on a top face of the semi-conductor image sense chip. A conducting wire extends from each of the multiple bonding pads by wire-bonding. Liquefied jelly-like material is covered with the top face of the semi-conductor image sense chip and forming a transparent layer on the top face of the semi-conductor image sense chip after drying up. The transparent layer has a thickness being equal to a height of each of the conduct wire relative to the top face of the semi-conductor image sense chip.

Abstract: An image sense module includes a semi-conductor image sense chip having a top face attached to a bottom face of a glass plate and multiple electric contacts formed on the semi-conductor image sense chip. A conductive interconnection circuit is formed on the bottom face of the glass plate. The conductive interconnection circuit has multiple first solder points each electrically connected to a corresponding one of the electric contacts of the semi-conductor image sense chip and multiple second solder points formed on one side of the glass plate. A lens set is secured on the glass plate. The lens set includes a holder perpendicularly attached to a top face of the glass plate and having a skirt downward extending from the holder. A channel is defined in one side of the skirt for allowing the conductive interconnection circuit extending through the holder.

Abstract: An LED is used as an illuminant of an image sensor and includes a fabricated block, a first electrode and a second electrode contained in the fabricated block for transmitting an electric current to a PN surface of a semiconductor that is contained in the fabricated block and secured in a top portion of the first electrode. The semiconductor has a light-projecting axis forming an acute angle with an elongate line of a bottom of the fabricated block.

Abstract: A hood for a digital image-collecting lens includes a base member having a recess defined in a bottom of the base member and to receive an image sensor that has a coupling crystal contained in the image sensor. A through hole is defined in the base member and communicating with the recess and longitudinally and straightly aligns with the coupling crystal. A lens seat is longitudinally and secured in the through hole in the base member and includes a through hole longitudinally and centrally defined in the lens seat. The through hole in the lens seat receives a camera lens of the digital image-collecting lens. At least one annular slot is longitudinally defined between an inner periphery of the through hole in the lens seat and an outer periphery of the lens seat, and longitudinally extending to corresponds to the camera lens.

Abstract: A digital CMOS sensor includes a chip adapted to be electrically connected to a printed circuit board by multiple conducting wires. A transparent layer is fully enveloped the chip and the multiple wires. A convex lens is disposed on a top face of the transparent layer and aligns with the chip for guiding light rays penetrating the transparent layer to the chip.

Abstract: The wastewater treatment method of the present invention includes introducing an influent water to an oxygen-supply tank for aeration; introducing the oxygen-enriched water from the oxygen-supply tank into the bottom of an activated carbon tank, so that the oxygen-enriched water flows upward and expands the activated carbon bed. When the oxygen-enriched water flows through the activated carbon bed, the microorganisms on the activated carbon particles use the enhanced oxygen concentration to decompose the contaminants, such as COD, BOD, TKN, etc., that are contained in the water or adsorbed on the activated carbon particles. Most of the supernatant liquid in the activated carbon tank is recycled to the oxygen-supply tank for aeration, and a small amount of the liquid is discharged, thereby performing a suitable treatment on wastewater having various qualities by controlling the amount of oxygen supply in the oxygen-supply tank and the recycle ratio of (the oxygen-enriched water)/(the influent water).