Abstract: Some implementations described herein provide techniques and apparatuses for a stacked semiconductor die package. The stacked semiconductor die package may include an upper semiconductor die package above a lower semiconductor die package. The stacked semiconductor die package includes one or more rows of pad structures located within a footprint of a semiconductor die of the lower semiconductor die package. The one or more rows of pad structures may be used to mount the upper semiconductor die package above the lower semiconductor die package. Relative to another stacked semiconductor die package including a row of dummy connection structures adjacent to the semiconductor die that may be used to mount the upper semiconductor die package, a size of the stacked semiconductor die package may be reduced.

Abstract: A common socket device for memory cards is a common inserted base with an upper cover to offer a common space for receive a smart media card, a multimedia card, and a secure digital memory card. The common base may be inserted by two or three memory cards without a need of providing two or three kinds of different socket device. Therefore, contact points in the common socket device is reduced substantially, a less volume of the common socket device is obtained comparing to the gross volume of two or three conventional socket devices, and it enhance the convenience for the user.

Abstract: A drain garbage collector of the invention includes a frame, a top grate, a separator grate, and a collector grate. A plurality of passages are defined through the top grate let the roadside garbage pass through. The separator grate prevents garbage from flowing out of the garbage collector via filtering wastewater flow. Thereby, the garbage collector collects garbage and the collected garbage can be cleaned regularly to prevent inundation caused by jammed drain.