Abstract: The present invention is a kind of wafer improved thermal desorption system. Mainly, a fixed infrared heating source is supplemental attached to a heating chamber with fixed type, also, and a fixed heat reflection mask is equipped at the bottom place of the fixed heating chamber respectively. Furthermore, the invent which a contact area between heating chamber and wafer and an air detracted device supplemental attached at one terminal of carrier gas to connect with the wafer thermal desorption chamber and adsorbent tube for collecting these substances to be analyzing. Thus, the invention can adapt with different brands of thermal desorption instruments, Thermal Desorption-Gas Chromatographic-Mass Spectroscopy (TD/GC/MS), and so on, for proceeding the analysis the micro contamination on the surface of wafer.