Abstract: A multi-channel stackable semiconductor device and a method for fabricating the same, and a stacking substrate applied to the semiconductor device are provided. A plurality of stacking substrates and package members having known good dies are provided. Each stacking substrate includes a first surface, an opposite second surface, a plurality of electrical bond pads and ball pads formed on the first surface, and a plurality of electrical terminals formed on the second surface. The ball pads are electrically connected to the electrical terminals by conductive structures formed in the stacking substrate. A plurality of corresponding connection paths are provided between at least one of the electrical bond pads and at least some of the ball pads, so as to allow each of the electrical bond pads to be selectively electrically connected to the ball pads. A package member is mounted on and electrically connected to each stacking substrate.