Patents by Inventor Wen-Chueh Lo

Wen-Chueh Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package structure
    Patent number: 10559728
    Abstract: A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate. The two substrates can include two notches or two solder receiving portions. Therefore, when the package structure is disposed on the printed circuit board (PCB), the package structure will protrude less on the surface of the printed circuit board (PCB); or, the solders on the printed circuit board (PCB) will not be shifted by the package structure.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: February 11, 2020
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Chih-Ming Ho, Chun-Chih Liang, Ding-Hwa Cherng, Kuang-Mao Lu, Wen-Chueh Lo, Hao-Yu Yang, Chieh-Yu Kang, Han-Chang Pan
  • SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20190259924
    Abstract: A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate. The two substrates can include two notches or two solder receiving portions. Therefore, when the package structure is disposed on the printed circuit board (PCB), the package structure will protrude less on the surface of the printed circuit board (PCB); or, the solders on the printed circuit board (PCB) will not be shifted by the package structure.
    Type: Application
    Filed: August 27, 2018
    Publication date: August 22, 2019
    Applicant: Everlight Electronics Co., Ltd.
    Inventors: Chih-Ming Ho, Chun-Chih Liang, Ding-Hwa Cherng, Kuang-Mao Lu, Wen-Chueh Lo, Hao-Yu Yang, Chieh-Yu Kang, Han-Chang Pan