Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.

Abstract: A heat-shrinkable polyester film made of a polyester-forming resin composition includes a recycled material, and has an exothermic crystallization peak and an endothermic melting peak which are determined via differential scanning calorimetry, and which satisfy relationships of T2?T1?68° C. and T3?T2?78° C., where T1 represents an onset point of the exothermic crystallization peak, T2 represents an end point of the exothermic crystallization peak and an onset point of the endothermic melting peak, and T3 represents an end point of the endothermic melting peak. A method for manufacturing the heat-shrinkable polyester film is also disclosed.

Abstract: A semiconductor device structure includes a first dielectric wall, a plurality of first semiconductor layers vertically stacked and extending outwardly from a first side of the first dielectric wall, each first semiconductor layer has a first width, a plurality of second semiconductor layers vertically stacked and extending outwardly from a second side of the first dielectric wall, each second semiconductor layer has a second width, a plurality of third semiconductor layers disposed adjacent the second side of the first dielectric wall, each third semiconductor layer has a third width greater than the second width, a first gate electrode layer surrounding at least three surfaces of each of the first semiconductor layers, the first gate electrode layer having a first conductivity type, and a second gate electrode layer surrounding at least three surfaces of each of the second semiconductor layers, the second gate electrode layer having a second conductivity type opposite the first conductivity type.

Abstract: A method of forming a semiconductor device includes providing a substrate including a circuit region and a well strap region, forming a mandrel extending from the circuit region to the well strap region, depositing mandrel spacers on sidewalls of the mandrel, removing the mandrel in the circuit region, while the mandrel in the well strap region remains intact, patterning the substrate with the mandrel spacers in the circuit region and the mandrel in the well strap region as an etch mask, thereby forming at least a first fin in the circuit region and a second fin in the well strap region, and epitaxially growing a first epitaxial feature over the first fin in the circuit region and a second epitaxial feature over the second fin in the well strap region. A width of the second fin is larger than a width of the first fin.

Abstract: An immersion cooling system includes a pressure seal tank, an electronic apparatus, a pressure balance pipe and a relief valve. The pressure seal tank is configured to store coolant. A vapor space is formed in the pressure seal tank above the liquid level of the coolant. The electronic apparatus is completely immersed in the coolant. The pressure balance pipe has a gas collection length. The first port of the pressure balance pipe is disposed on the top surface of the pressure seal tank. The relief valve is disposed on the second port of the pressure balance pipe. The second port is farther away from the top surface of the pressure seal tank than the first port. The gas collection length of the pressure equalization tube allows the concentration of vaporized coolant at the first port to be greater than the concentration of vaporized coolant at the second port.

Abstract: A method for fabricating a high electron mobility transistor (HEMT) includes the steps of forming a buffer layer on a substrate, forming a barrier layer on the buffer layer, forming a p-type semiconductor layer on the barrier layer, forming a gate electrode layer on the p-type semiconductor layer, and patterning the gate electrode layer to form a gate electrode. Preferably, the gate electrode includes an inclined sidewall.

Abstract: A firefighting system includes a fluid unit, a sensing unit, and a control unit. The fluid unit is arranged adjacent to a lower part of a parking area. The sensing unit senses an ambient temperature of the parking area and generates a temperature information. The control unit is electrically connected with the sensing unit and the fluid unit. When the temperature information is greater than or equal to a first threshold temperature, the control unit controls the fluid unit to output a fluid to the lower part of the parking area.

Abstract: A Schottky diode having a current leakage protection structure includes a Schottky diode unit, a first isolation portion and a second isolation portion. The Schottky diode unit is defined in a substrate and includes a metalized anode, an active region having dopants of first conductive type, a cathode and at least one isolation structure. The first isolation portion having dopants of second conductive type is formed between substrate and active region, and the first isolation portion includes a first well disposed beneath active region, and a first guard ring surrounding active region and connecting to the first well. The second isolation portion having dopants of first conductive type is formed between substrate and the first isolation portion, and the second isolation portion includes a second well disposed beneath the first well, and a second guard ring surrounding the first guard ring and connecting to the second well.

Abstract: A fire hydrant box accommodates a hand held firefighting spray gun, a water inlet pipe with a rotary connector and a connection unit. A positioning member capable of bearing gravity is installed on the sidewall inside the box. A rotary member is movably connected with the positioning member, from which two supporting members extend to engage and support a rotary base of a firefighting hose assembly. The rotary base includes a rolling mechanism used to roll the fire hose thereon. Two rolling disks are provided to two sides of the rolling mechanism. One rolling disk is provided with a handle to roll and release the fire hose, and the other rolling disk is connected to the water inlet pipe. The connection unit can be easily rotated out of the accommodating space in order for the fireman to easily access the fire hose and the firefighting spray gun.

Abstract: A fire hydrant box accommodates a hand held firefighting spay gun, a water inlet pipe with a rotary connector and a connection unit. A positioning member capable of bearing gravity is installed on the sidewall inside the box. A rotary member is movably connected with the positioning member, from which two supporting members extend to engage and support a rotary base of a firefighting hose assembly. The rotary base includes a rolling mechanism used to roll the fire hose thereon. Two rolling disks are provided to two sides of the rolling mechanism. One rolling disk is provided with a handle to roll and release the fire hose, and the other rolling disk is connected to the water inlet pipe. The connection unit can be easily rotated out of the accommodating space in order for the fireman to easily access the fire hose and the firefighting spray gun.

Abstract: A method for fabricating a test structure, in which, a heating plate is formed on the wafer for heating a structure to be tested positioned above or adjacent to the heating plate. The heating plate produces heat by electrically connecting to a current. Thus, the heat provided by the heating plate and the electric input/output into/from the structure to be tested are controlled separately and not influenced each other.

Abstract: A wafer level test structure in which, a heating plate is formed on the wafer for heating a structure to be tested positioned above or adjacent to the heating plate. The heating plate produces heat by electrically connecting to a current. Thus, the heat provided by the heating plate and the electric input/output into/from the structure to be tested are controlled separately and not influenced each other.

Abstract: The present invention discloses a wafer level test structure and a test method; in which, a heating plate is formed on the wafer for heating a structure to be tested positioned above or adjacent to the heating plate. The heating plate produces heat by electrically connecting to a current. Thus, the heat provided by the heating plate and the electric input/output into/from the structure to be tested are controlled separately and not influenced each other.

Abstract: The present invention discloses a wafer level test structure and a test method; in which, a heating plate is formed on the wafer for heating a structure to be tested positioned above or adjacent to the heating plate. The heating plate produces heat by electrically connecting to a current. Thus, the heat provided by the heating plate and the electric input/output into/from the structure to be tested are controlled separately and not influenced each other.

Abstract: A circuit capable of selectively operating in an inspecting mode or a driving mode for a display is formed in an integrated circuit and on a glass substrate. The circuit in the IC has a control circuit, a first input circuit, a second input circuit and a fourth input circuit. Each input circuit has a switch. Two additional switches are respectively connected between the first and the second input circuits, and between the second and the fourth input circuits. The glass substrate forms multiple connecting terminals corresponding to the input circuits. Two connecting terminals on the glass substrate are shorted. The control circuit outputs a signal to control all switches to form a configuration suitable for inspecting mode. When inspecting processes are completed, the control circuit changes the configuration for driving mode. The junction resistance of the display is precisely measured and areas in the IC are effectively used.

Abstract: The present invention provides a high-pressure water sprayer for fire extinguishment, including a body having a base and a fluid conduit connecting thereto, and at least two spray heads and fluid-guiding bars respectively corresponding thereto. The base is provided with at least two positioning slots for positioning the spray heads. Each of the positioning slots communicates with a main fluid passage within the fluid conduit via a branched fluid passage. A nozzle is formed at a lower end of the spray head, and an orifice is formed at an upper end of the spray head for the fluid-guiding bar to be disposed in a receiving space within the spray head. Then the receiving space communicates with the nozzle. A lower end of the fluid-guiding bar is provided with fluid-guiding grooves opposite to the nozzle. The spray heads are arranged in at least two different disposed angles. An appropriate spray angle can be obtained by adjusting the angle between the nozzle and the base.