Abstract: A method for fabricating a semiconductor device is provided and includes the following steps: providing a substrate; forming a lower electrode on the substrate; forming at least one sub-dielectric layer on the lower electrode; patterning the dielectric layer to form an intermediate dielectric layer, where the intermediate dielectric layer exposes a portion of the at least one sub-dielectric layer; forming a hole by etching the portion of the at least one sub-dielectric layer not covered by the intermediate dielectric layer; filling at least one plug into the hole; and forming an upper electrode on the intermediate dielectric layer.

Abstract: A method for fabricating a semiconductor device is provided and includes the following steps: providing a substrate; forming a lower electrode on the substrate; forming at least one sub-dielectric layer on the lower electrode; patterning the dielectric layer to form an intermediate dielectric layer, where the intermediate dielectric layer exposes a portion of the at least one sub-dielectric layer; forming a hole by etching the portion of the at least one sub-dielectric layer not covered by the intermediate dielectric layer; filling at least one plug into the hole; and forming an upper electrode on the intermediate dielectric layer.

Abstract: A semiconductor device includes a substrate, a capacitor disposed on the substrate, and an interconnection structure. The capacitor is disposed on the substrate within a capacitor region and includes a lower electrode, an upper electrode, a stacked dielectric layer, and an intermediate dielectric layer. The upper electrode is disposed over the lower electrode, and the stacked dielectric layer is disposed between the lower electrode and the upper electrode. The intermediate dielectric layer is disposed between the lower electrode and the upper electrode and disposed only within the capacitor region. The relative permittivity of the intermediate dielectric layer is greater than the relative permittivity of the stacked dielectric layer. The interconnection structure including a plug and a stack of metal layers is disposed within an interconnection region abutting the capacitor region and is disposed at at least one side of the intermediate dielectric layer.

Abstract: A semiconductor device includes a substrate, a capacitor disposed on the substrate, and an interconnection structure. The capacitor is disposed on the substrate within a capacitor region and includes a lower electrode, an upper electrode, a stacked dielectric layer, and an intermediate dielectric layer. The upper electrode is disposed over the lower electrode, and the stacked dielectric layer is disposed between the lower electrode and the upper electrode. The intermediate dielectric layer is disposed between the lower electrode and the upper electrode and disposed only within the capacitor region. The relative permittivity of the intermediate dielectric layer is greater than the relative permittivity of the stacked dielectric layer. The interconnection structure including a plug and a stack of metal layers is disposed within an interconnection region abutting the capacitor region and is disposed at at least one side of the intermediate dielectric layer.

Abstract: A data communication system including an electronic device including a serial port, a client device including at least an audio port and an interface device is provided. The electronic device is configured to obtain serial data and output the serial data via the serial port. The interface device is coupled between the electronic device and the client device and includes a serial port connected to the serial port of the electronic device, a signal conversion device and an audio port connected to the audio port of the client device, wherein the interface device receives first serial data from the electronic device via the serial port, converts the received first serial data to first audio signals via the signal conversion device, and outputs the first audio signals to the client device via the audio port, such that the client device obtains the serial data according to the first audio signals.

Abstract: A system for providing qualitative data collection in a communication network is provided, including at least one mobile device and a server coupled to the mobile device via the communication network. Mobile device periodically collects predetermined data from mobile user of mobile device and syncs collected predetermined data to server. Server defines multiple trigger conditions and generates a query form with a set of questions for each trigger condition, wherein each question is associated with a set of predetermined answer options. Server further determines whether any of trigger conditions is matched upon receiving collected data from mobile device, and if so, sends a notification with query form corresponding to trigger condition matched to mobile device to enable mobile device to display the query form with the set of questions associated with matched trigger condition upon receiving the notification from server to perform qualitative data collection.

Abstract: A cloud system for providing health-related services in a communication network includes an electronic device, at least one user device, at least one third-party device, and a cloud server. The electronic device performs a measurement to obtain health-related data. The user device sends an invitation. The third-party device receives the invitation from the user device and establishes a companion relationship with the user device in response to the invitation. The cloud server provides a platform to the third-party device for interacting with the user device therewith, wherein the user device transmits or uploads the health-related data obtained from the electronic device to the cloud server via the communication network to interact with the third-party device, such that the third-party device retrieves or receives the transmitted or uploaded data from the cloud server through the platform and performs a respective health-related operation based on the retrieved or received data.

Abstract: A data communication system including an electronic device including a serial port, a client device including at least an audio port and an interface device is provided. The electronic device is configured to obtain serial data and output the serial data via the serial port. The interface device is coupled between the electronic device and the client device and includes a serial port connected to the serial port of the electronic device, a signal conversion device and an audio port connected to the audio port of the client device, wherein the interface device receives first serial data from the electronic device via the serial port, converts the received first serial data to first audio signals via the signal conversion device, and outputs the first audio signals to the client device via the audio port, such that the client device obtains the serial data according to the first audio signals.

Abstract: A semiconductor device structure is provided. By placing an insulating dielectric material in the drift region of a device to modulate the electric field distribution and current flow in the drift region, the breakdown voltage of the device is increased while the turn-on impedance of the device is reduced.