Abstract: An electronic device includes a substrate, a plurality of flexible circuit boards, a plurality of ICs and an insulator. The flexible circuit boards are disposed on the substrate. In a top view of the electronic device, the flexible circuit boards are overlapped with an edge of the substrate. The ICs are disposed on the substrate. The insulator is disposed on the flexible circuit boards and contacted the ICs, wherein the insulator has a first side and a second side opposite to the first side and the first side is closer to the edge than the second side. Along a first direction perpendicular to an extension direction of the edge, a first minimum distance between the second side and one of the ICs is less than a second minimum distance between the second side and one of the flexible circuit boards.

Abstract: A radar signal processing system with a self-interference cancelling function includes an analog front end (AFE) processor, an analog to digital converter (ADC), an adaptive interference canceller (AIC), and a digital to analog converter (DAC). The AFE processor receives an original input signal and generates an analog input signal. The ADC converts the analog input signal to a digital input signal. The AIC generates a digital interference signal digital interference signal by performing an adaptive interference cancellation process according to the digital input signal. The DAC converts the digital interference signal to an analog interference signal. Finally, the analog interference signal is fed back to the AFE and cancelled from the original input signal in the AFE processor while performing the front end process, reducing the interference of the static interference from the leaking of a close-by transmitter during the front end process.

Abstract: A wafer container includes a frame, a door and at least a pair of shelves. The frame has opposite sidewalls. The pair of the shelves are respectively disposed and aligned on the opposite sidewalls of the frame. Various methods and devices are provided for holding at least one wafer to the shelves during transport.

Abstract: Some implementations described herein a provide a multi-die package and methods of formation. The multi-die package includes a dynamic random access memory integrated circuit die over a system-on-chip integrated circuit die, and a heat transfer component between the system-on-chip integrated circuit die and the dynamic random access memory integrated circuit die. The heat transfer component, which may correspond to a dome-shaped structure, may be on a surface of the system-on-chip integrated circuit die and enveloped by an underfill material between the system-on-chip integrated circuit die and the dynamic random access memory integrated circuit die. The heat transfer component, in combination with the underfill material, may be a portion of a thermal circuit having one or more thermal conductivity properties to quickly spread and transfer heat within the multi-die package so that a temperature of the system-on-chip integrated circuit die satisfies a threshold.

Abstract: Integrated circuit packages and methods of forming the same are discussed. In an embodiment, a device includes: a package substrate; a semiconductor device attached to the package substrate; an underfill between the semiconductor device and the package substrate; and a package stiffener attached to the package substrate, the package stiffener includes: a main body extending around the semiconductor device and the underfill in a top-down view, the main body having a first coefficient of thermal expansion; and pillars in the main body, each of the pillars extending from a top surface of the main body to a bottom surface of the main body, each of the pillars physically contacting the main body, the pillars having a second coefficient of thermal expansion, the second coefficient of thermal expansion being less than the first coefficient of thermal expansion.

Abstract: A laptop keyboard structure includes a keycap assembly and a key shaft assembly. The keycap assembly includes a keycap positioning plate, a plurality of stroke limiting structures and a plurality of keycaps. The stroke limiting structures are respectively disposed on the keycap positioning plate. The keycaps are respectively connected to the stroke limiting structure. The key shaft assembly, detachably assembled to one side of the keycap assembly, includes a circuit substrate and a plurality of key switches. The key switches are disposed on the circuit substrate and used to abut the keycap. A manufacturing method of the laptop keyboard structure is mainly to prepare the keycap assembly first, then to prepare the key shaft assembly, and finally to mount detachably the key shaft assembly to the keycap assembly by having the key switches respectively to penetrate the switch and further abut the keycap.

Abstract: A thermal cracker device includes an outer furnace and a thermal cracking furnace accommodated in the outer furnace. The outer surface of the thermal cracking furnace and the inner surface of the outer furnace define a space. The outer surface of the thermal cracking furnace has a fin structure to define an air flow channel in the space.

Abstract: A thermal cracker device includes an outer furnace and a thermal cracking furnace accommodated in the outer furnace. The outer surface of the thermal cracking furnace and the inner surface of the outer furnace define a space. The outer surface of the thermal cracking furnace has a fin structure to define an air flow channel in the space.

Abstract: An modified peptide of human acidic fibroblast growth factor (aFGF), comprising a native human aFGF shortened by a deletion of a deletion of 20 amino acids from N-terminal of the native human aFGF, and an addition of Alanine (Ala) before the shortened native aFGF is provided.

Abstract: An modified peptide of human acidic fibroblast growth factor (aFGF), comprising a native human aFGF shortened by a deletion of a deletion of 20 amino acids from N-terminal of the native human aFGF, and an addition of alanine (Ala) before the shortened native aFGF is provided.

Abstract: A method for promoting axon re-growth and behavior recovery in a subject suffering from a nerve injury is described. The method includes administering a pharmaceutical composition comprising a safe and effective amount of a chondroitinase ABC (CHABC) to an injury site of the nerve injury in the subject.