Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes at least one electronic component, a heat source, and a heat dissipation element. The heat source is adjacent to the electronic component. The heat dissipation element is disposed adjacent to the heat source and the electronic component. The heat dissipation element includes a heat transmitting structure configured to reduce heat, which is from the heat source, through the heat dissipation element, and transmitting in a direction toward the electronic component.

Abstract: The present invention relates to an optical digital display apparatus, which comprises a housing, at least a display module, and an optical projecting lens set. The housing has a frame. The display module is disposed on one side in the frame and emits display light. The optical projecting lens set is disposed on the other side in the frame and receives the display light. Besides, the optical projecting lens set emits projection light to a retina and forms a display image. The present invention uses the optical projecting lens set to emit the display light to a retina and form the display image. Thereby, a user can know environmental parameters without stopping. In addition, by means of retina imaging, external obstruction on images can be prevented and hence enhancing convenience as well as safety of skiing.