Abstract: A nearly isothermal heat pipe heat sink is provided. The heat sink includes a flat heat pipe connected to one or more flat vapor chambers using a conduit and a heat pipe. The connected flat heat pipe and the flat vapor chambers form a common vapor domain. Fins are attached on the outer surfaces of the flat heat pipe and the flat vapor chambers. Various capillary structures are also provided for fabricating flat heat pipes. A panelized welding process is further provided for fabricating flat heat pipes or flat vapor chambers. The panelized welding process uses either friction stir welding (FSW) or plasma beam welding to transversely join the panels that form the flat heat pipes or the flat vapor chambers.

Abstract: An impeller with hybrid blades can be used in any blowers, which are applied in many fields such as cooling computers and HVAC. The impeller increases air flow as well as pressure. Each hybrid blade extends from the impeller hub with the shape of an axial fan blade and smoothly transforms at a proper radius of the impeller to the shape of a centrifugal blower blade. In addition, a dual-tunnel blower with multiple outlets is also presented.

Abstract: Microgrooves (<0.2 mm wide) of various shapes used as wick structures in heat pipes can increase the capillary force to overcome the gravitational force on the working fluid so as to enable large working angles for the heat pipes. The microgrooves can be fabricated by two sequential steps use a first plowshare-like blade to turn up the material for large size grooves and then immediately use a second plowshare-like blade to rebury by the previously turned up material. The microgrooves and the fabrication method can be used to manufacture flat heat pipes (vapor chambers) as well as tubular heat pipes.

Abstract: A heat dissipating device includes a motor, a rotary unit, and a housing for receiving the motor and the rotary unit. The rotary unit includes a hub mounted to the motor and blades extending from the hub. The housing defines a hot air inlet, a hot air outlet, a cold air inlet, and a cold air outlet. The housing includes a first partition and a second partition located close to outer ends of the blades. The two partitions divide the housing into a first channel coupling the hot air inlet and the hot air outlet, and a second channel coupling the cold air inlet and the cold air outlet. The two partitions have widths greater than a pitch of the blades to prevent air from mixing in the two channels. The two channels create a bi-directional blower that removes hot air from and provides cold air into a computer case.

Abstract: An elasto-plastic socket for Land or Ball Grid Array package comprising a plurality of metal contacts embedded in a substrate by lamination. The curved plate spring of the metal contacts enable large deformation to accommodate all tolerances other than package tolerance and ensure uniform contact pressure across the package because they are designed based on the application of elasto-plasticity theory. An elasto-plastic stiffener shares the pressure from heat sink to package substrate and semiconductor. A cutting edge subsystem assembly for Land or Ball Grid Array package integrates L/BGA socket, L/BGA package and heat sink with a frame on top of PCB to increase the stiffness. The methods of post manufacturing including post forming and post age hardening used for testing socket application can increase the durability.

Abstract: A nearly isothermal heat pipe heat sink is provided. The heat sink includes a flat heat pipe connected to one or more flat vapor chambers using a conduit and a heat pipe. The connected flat heat pipe and the flat vapor chambers form a common vapor domain. Fins are attached on the outer surfaces of the flat heat pipe and the flat vapor chambers. Various capillary structures are also provided for fabricating flat heat pipes. A panelized welding process is further provided for fabricating flat heat pipes or flat vapor chambers. The panelized welding process uses either friction stir welding (FSW) or plasma beam welding to transversely join the panels that form the flat heat pipes or the flat vapor chambers.

Abstract: A “lidless” integrated circuit package includes a support member that is arranged to support at least part of a load placed on the integrated circuit package. The support member has or is connected to a flexible support device that is in supportive contact with the load and that is designed to flex dependent on a position of the support member. The flexible support device substantially ensures that a plane of the surface of the flexible support device and a plane of a surface of a semiconductor die of the integrated circuit package are co-planar, thereby leading to a desirable load distribution within the integrated circuit package.

Abstract: A heat dissipating device includes a motor, a rotary unit, and a housing for receiving the motor and the rotary unit. The rotary unit includes a hub mounted to the motor and blades extending from the hub. The housing defines a hot air inlet, a hot air outlet, a cold air inlet, and a cold air outlet. The housing includes a first partition and a second partition located close to outer ends of the blades. The two partitions divide the housing into a first channel coupling the hot air inlet and the hot air outlet, and a second channel coupling the cold air inlet and the cold air outlet. The two partitions have widths greater than a pitch of the blades to prevent air from mixing in the two channels. The two channels create a bi-directional blower that removes hot air from and provides cold air into a computer case.

Abstract: Bi-directional Blowers capable of sucking-in ambient air and blowing-out hot air from system box simultaneously are invented to cool computer or electronic systems. The application to cooling laptop computers is disclosed in very details. The bi-directional blowers are comprised of a DC or AC motor, a rotary part of blades and/or impellers, an optional cover, and a housing frame with built-in broken walls, stationary blades and airfoils, which control the flow volume and direction. The separate zone to divide the blow-out and suck-in channels is constructed using the broken walls with conjunction of the blades and/or impellers. The rotary part is the radial blades, or a combination of blades and impellers. Two types of bi-directional blowers are explored: the pressure type and hybrid type. A one-way blower of pressure type utilizes the same principle of the bi-directional blowers such that the inlet and outlet can be located on sides of the blower.

Abstract: An elasto-plastic socket for Land or Ball Grid Array package comprising a plurality of metal contacts embedded in a substrate by lamination. The curved plate spring of the metal contacts enable large deformation to accommodate all tolerances other than package tolerance and ensure uniform contact pressure across the package because they are designed based on the application of elasto-plasticity theory. An elasto-plastic stiffener shares the pressure from heat sink to package substrate and semiconductor. A cutting edge subsystem assembly for Land or Ball Grid Array package integrates L/BGA socket, L/BGA package and heat sink with a frame on top of PCB to increase the stiffness. The methods of post manufacturing including post forming and post age hardening used for testing socket application can increase the durability.

Abstract: A flip-chip package assembly having a package substrate having a mounting surface to which a semiconductor die and a heat removal device is selectively mounted is provided. The flip-chip assembly is made out of a package substrate on which a semiconductor die is positioned and a heat removal device which is physically secured to the package substrate. The semiconductor die is thermally connected to the heat removal device through a thermal interface material. Further, a method for manufacturing the flip-chip package described herein is disclosed.