Abstract: An interconnect structure on a semiconductor die includes: a lower conductive layer; an upper conductive layer disposed above the lower conductive layer; and a VIA disposed between the lower conductive layer and the upper conductive layer. The VIA includes: a primary interconnect structure and a sacrificial stress barrier ring disposed around the primary interconnect structure and separated a distance from the primary interconnect structure. A fabrication method for the interconnect structure includes: forming a dielectric layer over a lower conductive layer; patterning photoresist (PR) layer over the dielectric layer to define a location for a plurality of VIA trenches, wherein the patterning includes patterning the PR layer to provide a center opening for the VIA trenches that is surrounded by a ring opening for the VIA trenches, wherein the center opening and the ring opening are spaced apart.

Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes providing a substrate for an interposer, and forming a conductive interconnect structure in and on the substrate for connecting a group of selected IC dies. The method includes forming warpage-reducing trenches in non-routing regions of the interposer, wherein the warpage-reducing trenches are sized and positioned based on a warpage characteristic to reduce the warpage of the chip package structure. The method also includes depositing a warpage-relief material in the warpage-reducing trenches according to the warpage characteristic to reduce the warpage of the chip package structure, and bonding the group of selected IC dies to the interposer to form a chip package structure.

Abstract: A semiconductor device includes first nanostructures vertically separated from one another, a first gate structure wrapping around each of the first nanostructures, and second nanostructures vertically separated from one another. The semiconductor device also includes a second gate structure wrapping around the second nanostructures, a first drain/source structure coupled to a first end of the first nanostructures, a second drain/source structure coupled to both of a second end of the first nanostructures and a first end of the second nanostructures, and a third drain/source structure coupled to a second end of the second nanostructures. The first drain/source structure has a first doping type, the second and third drain/source structures have a second doping type, and the first doping type is opposite to the second doping type.

Abstract: A wafer container includes a frame, a door and at least a pair of shelves. The frame has opposite sidewalls. The pair of the shelves are respectively disposed and aligned on the opposite sidewalls of the frame. Various methods and devices are provided for holding at least one wafer to the shelves during transport.

Abstract: A semiconductor device includes a first contact layer, a second contact layer, an active layer, a photonic crystal layer, a passivation layer, a first electrode and a second electrode. The first contact layer has a first surface and a second surface opposite to each other. Microstructures are located on the second surface. The second contact layer is located below the first surface. The active layer is located between the first contact layer and the second contact layer. The photonic crystal layer is located between the active layer and the second contact layer. The passivation layer is located on the second contact layer. The first electrode is located on the passivation layer and is electrically connected the first surface of the first contact layer. The second electrode is located on the passivation layer and is electrically connected to the second contact layer.

Abstract: A sensor package structure includes a substrate, a sensor chip, a plurality of wires, a supporting frame, a transparent cover, and a molding compound. The substrate includes a chip bonding region and a plurality of first pads outside the chip bonding region. The sensor chip is disposed on the chip bonding region, and includes a sensing region and a plurality of second pads. Each wire has two opposite ends respectively connected to one of the first pads and one of the second pads. The supporting frame is arranged above the substrate and/or the sensor chip and includes a positioning portion. The transparent cover is fixed in position above the sensor chip by the positioning portion so as to maintain a vertical distance there-between. The molding compound fills the space in-between the substrate and the supporting frame and covers a part of an upper surface of the supporting frame.

Abstract: A sensor package structure includes a substrate, a sensor chip, a plurality of wires, a supporting frame, a transparent cover, and a molding compound. The substrate includes a chip bonding region and a plurality of first pads outside the chip bonding region. The sensor chip is disposed on the chip bonding region, and includes a sensing region and a plurality of second pads. Each wire has two opposite ends respectively connected to one of the first pads and one of the second pads. The supporting frame is arranged above the substrate and/or the sensor chip and includes a positioning portion. The transparent cover is fixed in position above the sensor chip by the positioning portion so as to maintain a vertical distance there-between. The molding compound fills the space in-between the substrate and the supporting frame and covers a part of an upper surface of the supporting frame.

Abstract: An apparatus for wave energy harnessing includes at least one slide shaft, a buoyant unit, an energy-transmitting unit, and a rotate unit. The slide shaft is firmly mounted on the seabed. The buoyant unit is movably engaged with the slide shaft and has a reservoir and an adjusting board, so as to control the vertical position of the buoyant unit relative to sea level. The energy-transmitting unit is mounted on the buoyant unit. The rotate unit rotatably engages with the energy-transmitting unit and connects with an energy-transfonning unit through a transmission shaft. Thereby, the buoyant unit is driven by waves to vertically slide along the slide shaft, the energy-transmitting unit rotates the transmission shaft of the rotate unit, and, thus, the energy-transforming unit generates power.

Abstract: A vehicular steering apparatus has a steering column connected to a steering wheel of a vehicle, a reduction gear mechanism and a pivot element. The reduction gear mechanism has a reduction gear assembly with a gear reduction for speed-power conversion, an input shaft connected between the reduction gear assembly and the steering column and an output shaft connected to the reduction gear assembly. The pivot element has a proximal end connected to the output shaft and a distal end connected to two tie rods of the vehicle. When the steering wheel is turned, the pivot element is pivoted with the transmission of the reduction gear mechanism to drive the tie rods to turn front wheels. The gear reduction provided by the reduction assembly converts a high rotational speed to a high torque such that the user can easily steer the steering column.

Abstract: An apparatus for wave energy harnessing includes at least one slide shaft, a buoyant unit, an energy-transmitting unit, and a rotate unit. Said at least one slide shaft is firmly mounted on seabed. The buoyant unit is movably engaged with the slide shaft and has a reservoir and an adjusting board, so as to control the vertical position of the buoyant unit relative to sea level. The energy-transmitting unit is mounted on the buoyant unit. And the rotate unit rotatably engages with the energy-transmitting unit and connects with an energy-transforming unit through a transmission shaft. Thereby, the buoyant unit is driven by wave to vertically slide along the at least one slide shaft, the energy-transmitting unit rotates the transmission shaft of the rotate unit and thus the energy-transforming unit generates power.

Abstract: A wave energy power generating apparatus includes a fixed base, a buoyant float unit and at least one gearing mechanism. The fixed base has a slide shaft mounted thereon for connecting with the buoyant float unit. The buoyant float unit includes a buoyant float slidably connected with the slide shaft, and at least one rack mechanism formed with a pair of rack members. The gearing mechanism includes a transmission shaft, and a pair of one-way gears connected with the transmission shaft and engaged with the rack members. The rack members can drive the one-way gears to rotate the transmission shaft in a single predetermined direction when an upward or downward movement of the buoyant float unit occurs.

Abstract: A high-pressure polishing apparatus and method comprising a condenser having high-pressure nozzles for ejecting a solution on the polishing pad to perform a conditioning, thereby preventing damage to the wafer and destruction of the diamond condenser due to a larger force applied on the diamond condenser in order to obtain a better status of polishing pad. The present invention can be applied to a conventional machine.