Abstract: A pressure sensor includes a substrate, a pressure sensing element, a first signal line, a second signal line, an elastomer, and an opposite substrate. The pressure sensing element includes a first resistor and a second resistor connected in series, a third resistor and a fourth resistor connected in series, a first switch component, and a second switch component. The first and the second resistor are connected in parallel to the third and the fourth resistor. The first switch component is electrically connected between the first and the second resistor. The second switch component is electrically connected between the third and the fourth resistor. The first signal line is electrically connected between the first and the fourth resistor. The second signal line is electrically connected between the second and the third resistor. The elastomer includes a cavity. The first resistor to the fourth resistor overlap with the cavity.

Abstract: A sensor package structure includes a substrate, a sensor chip, a plurality of wires, a supporting frame, a transparent cover, and a molding compound. The substrate includes a chip bonding region and a plurality of first pads outside the chip bonding region. The sensor chip is disposed on the chip bonding region, and includes a sensing region and a plurality of second pads. Each wire has two opposite ends respectively connected to one of the first pads and one of the second pads. The supporting frame is arranged above the substrate and/or the sensor chip and includes a positioning portion. The transparent cover is fixed in position above the sensor chip by the positioning portion so as to maintain a vertical distance there-between. The molding compound fills the space in-between the substrate and the supporting frame and covers a part of an upper surface of the supporting frame.

Abstract: A sensor package structure includes a substrate, a sensor chip, a plurality of wires, a supporting frame, a transparent cover, and a molding compound. The substrate includes a chip bonding region and a plurality of first pads outside the chip bonding region. The sensor chip is disposed on the chip bonding region, and includes a sensing region and a plurality of second pads. Each wire has two opposite ends respectively connected to one of the first pads and one of the second pads. The supporting frame is arranged above the substrate and/or the sensor chip and includes a positioning portion. The transparent cover is fixed in position above the sensor chip by the positioning portion so as to maintain a vertical distance there-between. The molding compound fills the space in-between the substrate and the supporting frame and covers a part of an upper surface of the supporting frame.

Abstract: An apparatus for wave energy harnessing includes at least one slide shaft, a buoyant unit, an energy-transmitting unit, and a rotate unit. The slide shaft is firmly mounted on the seabed. The buoyant unit is movably engaged with the slide shaft and has a reservoir and an adjusting board, so as to control the vertical position of the buoyant unit relative to sea level. The energy-transmitting unit is mounted on the buoyant unit. The rotate unit rotatably engages with the energy-transmitting unit and connects with an energy-transfonning unit through a transmission shaft. Thereby, the buoyant unit is driven by waves to vertically slide along the slide shaft, the energy-transmitting unit rotates the transmission shaft of the rotate unit, and, thus, the energy-transforming unit generates power.

Abstract: A vehicular steering apparatus has a steering column connected to a steering wheel of a vehicle, a reduction gear mechanism and a pivot element. The reduction gear mechanism has a reduction gear assembly with a gear reduction for speed-power conversion, an input shaft connected between the reduction gear assembly and the steering column and an output shaft connected to the reduction gear assembly. The pivot element has a proximal end connected to the output shaft and a distal end connected to two tie rods of the vehicle. When the steering wheel is turned, the pivot element is pivoted with the transmission of the reduction gear mechanism to drive the tie rods to turn front wheels. The gear reduction provided by the reduction assembly converts a high rotational speed to a high torque such that the user can easily steer the steering column.

Abstract: An apparatus for wave energy harnessing includes at least one slide shaft, a buoyant unit, an energy-transmitting unit, and a rotate unit. Said at least one slide shaft is firmly mounted on seabed. The buoyant unit is movably engaged with the slide shaft and has a reservoir and an adjusting board, so as to control the vertical position of the buoyant unit relative to sea level. The energy-transmitting unit is mounted on the buoyant unit. And the rotate unit rotatably engages with the energy-transmitting unit and connects with an energy-transforming unit through a transmission shaft. Thereby, the buoyant unit is driven by wave to vertically slide along the at least one slide shaft, the energy-transmitting unit rotates the transmission shaft of the rotate unit and thus the energy-transforming unit generates power.

Abstract: A wave energy power generating apparatus includes a fixed base, a buoyant float unit and at least one gearing mechanism. The fixed base has a slide shaft mounted thereon for connecting with the buoyant float unit. The buoyant float unit includes a buoyant float slidably connected with the slide shaft, and at least one rack mechanism formed with a pair of rack members. The gearing mechanism includes a transmission shaft, and a pair of one-way gears connected with the transmission shaft and engaged with the rack members. The rack members can drive the one-way gears to rotate the transmission shaft in a single predetermined direction when an upward or downward movement of the buoyant float unit occurs.

Abstract: A high-pressure polishing apparatus and method comprising a condenser having high-pressure nozzles for ejecting a solution on the polishing pad to perform a conditioning, thereby preventing damage to the wafer and destruction of the diamond condenser due to a larger force applied on the diamond condenser in order to obtain a better status of polishing pad. The present invention can be applied to a conventional machine.